Statistical Reliability Estimation of Microprocessor-Based Systems

What is the probability that the execution state of a given microprocessor running a given application is correct, in a certain working environment with a given soft-error rate? Trying to answer this question using fault injection can be very expensive and time consuming. This paper proposes the baseline for a new methodology, based on microprocessor error probability profiling, that aims at estimating fault injection results without the need of a typical fault injection setup. The proposed methodology is based on two main ideas: a one-time fault-injection analysis of the microprocessor architecture to characterize the probability of successful execution of each of its instructions in presence of a soft-error, and a static and very fast analysis of the control and data flow of the target software application to compute its probability of success. The presented work goes beyond the dependability evaluation problem; it also has the potential to become the backbone for new tools able to help engineers to choose the best hardware and software architecture to structurally maximize the probability of a correct execution of the target softwar

Sustainable Fault-handling Of Reconfigurable Logic Using Throughput-driven Assessment

A sustainable Evolvable Hardware (EH) system is developed for SRAM-based reconfigurable Field Programmable Gate Arrays (FPGAs) using outlier detection and group testing-based assessment principles. The fault diagnosis methods presented herein leverage throughput-driven, relative fitness assessment to maintain resource viability autonomously. Group testing-based techniques are developed for adaptive input-driven fault isolation in FPGAs, without the need for exhaustive testing or coding-based evaluation. The techniques maintain the device operational, and when possible generate validated outputs throughout the repair process. Adaptive fault isolation methods based on discrepancy-enabled pair-wise comparisons are developed. By observing the discrepancy characteristics of multiple Concurrent Error Detection (CED) configurations, a method for robust detection of faults is developed based on pairwise parallel evaluation using Discrepancy Mirror logic. The results from the analytical FPGA model are demonstrated via a self-healing, self-organizing evolvable hardware system. Reconfigurability of the SRAM-based FPGA is leveraged to identify logic resource faults which are successively excluded by group testing using alternate device configurations. This simplifies the system architect\u27s role to definition of functionality using a high-level Hardware Description Language (HDL) and system-level performance versus availability operating point. System availability, throughput, and mean time to isolate faults are monitored and maintained using an Observer-Controller model. Results are demonstrated using a Data Encryption Standard (DES) core that occupies approximately 305 FPGA slices on a Xilinx Virtex-II Pro FPGA. With a single simulated stuck-at-fault, the system identifies a completely validated replacement configuration within three to five positive tests. The approach demonstrates a readily-implemented yet robust organic hardware application framework featuring a high degree of autonomous self-control

High level behavioural modelling of boundary scan architecture.

This project involves the development of a software tool which enables the integration of the IEEE 1149.1/JTAG Boundary Scan Test Architecture automatically into an ASIC (Application Specific Integrated Circuit) design. The tool requires the original design (the ASIC) to be described in VHDL-IEEE 1076 Hardware Description Language. The tool consists of the two major elements: i) A parsing and insertion algorithm developed and implemented in 'C'; ii) A high level model of the Boundary Scan Test Architecture implemented in 'VHDL'. The parsing and insertion algorithm is developed to deal with identifying the design Input/Output (I/O) terminals, their types and the order they appear in the ASIC design. It then attaches suitable Boundary Scan Cells to each I/O, except power and ground and inserts the high level models of the full Boundary Scan Architecture into the ASIC without altering the design core structure

New Techniques to Reduce the Execution Time of Functional Test Programs

The compaction of test programs for processor-based systems is of utmost practical importance: Software-Based Self-Test (SBST) is nowadays increasingly adopted, especially for in-field test of safety-critical applications, and both the size and the execution time of the test are critical parameters. However, while compacting the size of binary test sequences has been thoroughly studied over the years, the reduction of the execution time of test programs is still a rather unexplored area of research. This paper describes a family of algorithms able to automatically enhance an existing test program, reducing the time required to run it and, as a side effect, its size. The proposed solutions are based on instruction removal and restoration, which is shown to be computationally more efficient than instruction removal alone. Experimental results demonstrate the compaction capabilities, and allow analyzing computational costs and effectiveness of the different algorithms

Network-on-Chip

Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems

Reliable Hardware Architectures of CORDIC Algorithm with Fixed Angle of Rotations

Fixed-angle rotation operation of vectors is widely used in signal processing, graphics, and robotics. Various optimized coordinate rotation digital computer (CORDIC) designs have been proposed for uniform rotation of vectors through known and specified angles. Nevertheless, in the presence of faults, such hardware architectures are potentially vulnerable. In this thesis, we propose efficient error detection schemes for two fixed-angle rotation designs, i.e., the Interleaved Scaling and Cascaded Single-rotation CORDIC. To the best of our knowledge, this work is the first in providing reliable architectures for these variants of CORDIC. The former is suitable for low-area applications and, hence, we propose recomputing with encoded operands schemes which add negligible area overhead to the designs. Moreover, the proposed error detection schemes for the latter variant are optimized for efficient applications which hamper the performance of the architectures negligibly. We present three variants of recomputing with encoded operands to detect both transient and permanent faults, coupled with signature-based schemes. The overheads of the proposed designs are assessed through Xilinx FPGA implementations and their effectiveness is benchmarked through error simulations. The results give confidence for the proposed efficient architectures which can be tailored based on the reliability requirements and the overhead to be tolerated

Test and Diagnosis of Integrated Circuits

The ever-increasing growth of the semiconductor market results in an increasing complexity of digital circuits. Smaller, faster, cheaper and low-power consumption are the main challenges in semiconductor industry. The reduction of transistor size and the latest packaging technology (i.e., System-On-a-Chip, System-In-Package, Trough Silicon Via 3D Integrated Circuits) allows the semiconductor industry to satisfy the latest challenges. Although producing such advanced circuits can benefit users, the manufacturing process is becoming finer and denser, making chips more prone to defects.The work presented in the HDR manuscript addresses the challenges of test and diagnosis of integrated circuits. It covers:- Power aware test;- Test of Low Power Devices;- Fault Diagnosis of digital circuits

Conception et test des circuits et systèmes numériques à haute fiabilité et sécurité

Research activities I carried on after my nomination as Chargé de Recherche deal with the definition of methodologies and tools for the design, the test and the reliability of secure digital circuits and trustworthy manufacturing. More recently, we have started a new research activity on the test of 3D stacked Integrated CIrcuits, based on the use of Through Silicon Vias. Moreover, thanks to the relationships I have maintained after my post-doc in Italy, I have kept on cooperating with Politecnico di Torino on the topics related to test and reliability of memories and microprocessors.Secure and Trusted DevicesSecurity is a critical part of information and communication technologies and it is the necessary basis for obtaining confidentiality, authentication, and integrity of data. The importance of security is confirmed by the extremely high growth of the smart-card market in the last 20 years. It is reported in "Le monde Informatique" in the article "Computer Crime and Security Survey" in 2007 that financial losses due to attacks on "secure objects" in the digital world are greater than $11 Billions. Since the race among developers of these secure devices and attackers accelerates, also due to the heterogeneity of new systems and their number, the improvement of the resistance of such components becomes today’s major challenge.Concerning all the possible security threats, the vulnerability of electronic devices that implement cryptography functions (including smart cards, electronic passports) has become the Achille’s heel in the last decade. Indeed, even though recent crypto-algorithms have been proven resistant to cryptanalysis, certain fraudulent manipulations on the hardware implementing such algorithms can allow extracting confidential information. So-called Side-Channel Attacks have been the first type of attacks that target the physical device. They are based on information gathered from the physical implementation of a cryptosystem. For instance, by correlating the power consumed and the data manipulated by the device, it is possible to discover the secret encryption key. Nevertheless, this point is widely addressed and integrated circuit (IC) manufacturers have already developed different kinds of countermeasures.More recently, new threats have menaced secure devices and the security of the manufacturing process. A first issue is the trustworthiness of the manufacturing process. From one side, secure devices must assure a very high production quality in order not to leak confidential information due to a malfunctioning of the device. Therefore, possible defects due to manufacturing imperfections must be detected. This requires high-quality test procedures that rely on the use of test features that increases the controllability and the observability of inner points of the circuit. Unfortunately, this is harmful from a security point of view, and therefore the access to these test features must be protected from unauthorized users. Another harm is related to the possibility for an untrusted manufacturer to do malicious alterations to the design (for instance to bypass or to disable the security fence of the system). Nowadays, many steps of the production cycle of a circuit are outsourced. For economic reasons, the manufacturing process is often carried out by foundries located in foreign countries. The threat brought by so-called Hardware Trojan Horses, which was long considered theoretical, begins to materialize.A second issue is the hazard of faults that can appear during the circuit’s lifetime and that may affect the circuit behavior by way of soft errors or deliberate manipulations, called Fault Attacks. They can be based on the intentional modification of the circuit’s environment (e.g., applying extreme temperature, exposing the IC to radiation, X-rays, ultra-violet or visible light, or tampering with clock frequency) in such a way that the function implemented by the device generates an erroneous result. The attacker can discover secret information by comparing the erroneous result with the correct one. In-the-field detection of any failing behavior is therefore of prime interest for taking further action, such as discontinuing operation or triggering an alarm. In addition, today’s smart cards use 90nm technology and according to the various suppliers of chip, 65nm technology will be effective on the horizon 2013-2014. Since the energy required to force a transistor to switch is reduced for these new technologies, next-generation secure systems will become even more sensitive to various classes of fault attacks.Based on these considerations, within the group I work with, we have proposed new methods, architectures and tools to solve the following problems:• Test of secure devices: unfortunately, classical techniques for digital circuit testing cannot be easily used in this context. Indeed, classical testing solutions are based on the use of Design-For-Testability techniques that add hardware components to the circuit, aiming to provide full controllability and observability of internal states. Because crypto‐ processors and others cores in a secure system must pass through high‐quality test procedures to ensure that data are correctly processed, testing of crypto chips faces a dilemma. In fact design‐for‐testability schemes want to provide high controllability and observability of the device while security wants minimal controllability and observability in order to hide the secret. We have therefore proposed, form one side, the use of enhanced scan-based test techniques that exploit compaction schemes to reduce the observability of internal information while preserving the high level of testability. From the other side, we have proposed the use of Built-In Self-Test for such devices in order to avoid scan chain based test.• Reliability of secure devices: we proposed an on-line self-test architecture for hardware implementation of the Advanced Encryption Standard (AES). The solution exploits the inherent spatial replications of a parallel architecture for implementing functional redundancy at low cost.• Fault Attacks: one of the most powerful types of attack for secure devices is based on the intentional injection of faults (for instance by using a laser beam) into the system while an encryption occurs. By comparing the outputs of the circuits with and without the injection of the fault, it is possible to identify the secret key. To face this problem we have analyzed how to use error detection and correction codes as counter measure against this type of attack, and we have proposed a new code-based architecture. Moreover, we have proposed a bulk built-in current-sensor that allows detecting the presence of undesired current in the substrate of the CMOS device.• Fault simulation: to evaluate the effectiveness of countermeasures against fault attacks, we developed an open source fault simulator able to perform fault simulation for the most classical fault models as well as user-defined electrical level fault models, to accurately model the effect of laser injections on CMOS circuits.• Side-Channel attacks: they exploit physical data-related information leaking from the device (e.g. current consumption or electro-magnetic emission). One of the most intensively studied attacks is the Differential Power Analysis (DPA) that relies on the observation of the chip power fluctuations during data processing. I studied this type of attack in order to evaluate the influence of the countermeasures against fault attack on the power consumption of the device. Indeed, the introduction of countermeasures for one type of attack could lead to the insertion of some circuitry whose power consumption is related to the secret key, thus allowing another type of attack more easily. We have developed a flexible integrated simulation-based environment that allows validating a digital circuit when the device is attacked by means of this attack. All architectures we designed have been validated through this tool. Moreover, we developed a methodology that allows to drastically reduce the time required to validate countermeasures against this type of attack.TSV- based 3D Stacked Integrated Circuits TestThe stacking process of integrated circuits using TSVs (Through Silicon Via) is a promising technology that keeps the development of the integration more than Moore’s law, where TSVs enable to tightly integrate various dies in a 3D fashion. Nevertheless, 3D integrated circuits present many test challenges including the test at different levels of the 3D fabrication process: pre-, mid-, and post- bond tests. Pre-bond test targets the individual dies at wafer level, by testing not only classical logic (digital logic, IOs, RAM, etc) but also unbounded TSVs. Mid-bond test targets the test of partially assembled 3D stacks, whereas finally post-bond test targets the final circuit.The activities carried out within this topic cover 2 main issues:• Pre-bond test of TSVs: the electrical model of a TSV buried within the substrate of a CMOS circuit is a capacitance connected to ground (when the substrate is connected to ground). The main assumption is that a defect may affect the value of that capacitance. By measuring the variation of the capacitance’s value it is possible to check whether the TSV is correctly fabricated or not. We have proposed a method to measure the value of the capacitance based on the charge/ discharge delay of the RC network containing the TSV.• Test infrastructures for 3D stacked Integrated Circuits: testing a die before stacking to another die introduces the problem of a dynamic test infrastructure, where test data must be routed to a specific die based on the reached fabrication step. New solutions are proposed in literature that allow reconfiguring the test paths within the circuit, based on on-the-fly requirements. We have started working on an extension of the IEEE P1687 test standard that makes use of an automatic die-detection based on pull-up resistors.Memory and Microprocessor Test and ReliabilityThanks to device shrinking and miniaturization of fabrication technology, performances of microprocessors and of memories have grown of more than 5 magnitude order in the last 30 years. With this technology trend, it is necessary to face new problems and challenges, such as reliability, transient errors, variability and aging.In the last five years I’ve worked in cooperation with the Testgroup of Politecnico di Torino (Italy) to propose a new method to on-line validate the correctness of the program execution of a microprocessor. The main idea is to monitor a small set of control signals of the processors in order to identify incorrect activation sequences. This approach can detect both permanent and transient errors of the internal logic of the processor.Concerning the test of memories, we have proposed a new approach to automatically generate test programs starting from a functional description of the possible faults in the memory.Moreover, we proposed a new methodology, based on microprocessor error probability profiling, that aims at estimating fault injection results without the need of a typical fault injection setup. The proposed methodology is based on two main ideas: a one-time fault-injection analysis of the microprocessor architecture to characterize the probability of successful execution of each of its instructions in presence of a soft-error, and a static and very fast analysis of the control and data flow of the target software application to compute its probability of success

Fault and Defect Tolerant Computer Architectures: Reliable Computing With Unreliable Devices

This research addresses design of a reliable computer from unreliable device technologies. A system architecture is developed for a fault and defect tolerant (FDT) computer. Trade-offs between different techniques are studied and yield and hardware cost models are developed. Fault and defect tolerant designs are created for the processor and the cache memory. Simulation results for the content-addressable memory (CAM)-based cache show 90% yield with device failure probabilities of 3 x 10(-6), three orders of magnitude better than non fault tolerant caches of the same size. The entire processor achieves 70% yield with device failure probabilities exceeding 10(-6). The required hardware redundancy is approximately 15 times that of a non-fault tolerant design. While larger than current FT designs, this architecture allows the use of devices much more likely to fail than silicon CMOS. As part of model development, an improved model is derived for NAND Multiplexing. The model is the first accurate model for small and medium amounts of redundancy. Previous models are extended to account for dependence between the inputs and produce more accurate results

Methods to improve debug flow for intellectual property protection

Abstract. Every company wants to protect their intellectual property and limit customer visibility of confidential information. A company may protect its proprietary information by different ways. This thesis will compare different methods that try to protect intellectual property while maintaining the software debugging capability. Working with binary libraries without debug information makes customer support very difficult. When a company is developing a new product, time to market is important. Usually, the last months are very busy resolving urgent customer issues. Especially during this period, the slow process of debugging customer issues without debug information can cause delays and increase time to market. The goal of this thesis is to compare methods that protects intellectual property by making reverse engineering more difficult. Study of the upcoming GNU Compiler Collection (GCC) features related to debug data formats, such as DWARF5, is also carried out while working with the thesis. The approaches tried were split DWARF, injecting ELF files, stripping debug data, and code obfuscation. Also optimisation and their effect on disassembly was studied. The best solution was to compile the software with debug symbols and strip them to a separate file. This way the symbol data can be loaded separately into GDB. The symbol data layout and addresses are also always correct with the solution.Virheiden etsinnän työnkulun parantaminen immateriaaliomaisuudet huomioiden. Tiivistelmä. Yritykset haluavat suojella immateriaaliomaisuuksiaan ja rajoittaa asiakkaiden näkyvyyttä tietylle tasolle asti. Tämä lopputyö vertailee eri metodeja jotka koittavat suojata immateriaaliomaisuuksia, ilman että ohjelmiston virheidenkorjattavuus kärsii. Binäärikirjastot ilman virheenkorjaustietoja vaikeuttavat asiakkaan tukemista. Uutta tuotetta kehitettäessä, markkinoille tuloaika on yritykselle tärkeää. Yleensä viimeiset kuukaudet ovat kiireisiä asiakkaan ongelmien tutkimuksien kanssa ja kyseiset ongelmat tulisi olla ratkaistuna mahdollisimman nopeasti. Tämän lopputyön tavoitteena on vertailla mahdollisia metodeja, jotka suojaavat immateriaaliomaisuutta takaisinmallinnusta vastaan. Tarkoituksena on myös tutkia tulevia GNU kääntäjä-kokoelman (GCC:n) ominaisuuksia liittyen virheenkorjaustietoformaatteihin, kuten DWARF5. Ongelman ratkaisuun koitettiin pilkottuja virheenkorjaustietoja, ELFtiedoston injektointia, virheenkorjaustiedon riisumista ohjelmistosta ja koodin obfuskointia. Myös optimoinnin vaikutusta konekielestä takaisinmallinnettuun Assembly-muotoon tutkittiin. Paras ratkaisu oli kääntää ohjelmisto virheenkorjaustiedolla ja riisua ne omaan erilliseen tiedostoon. Näin ohjelmiston symbolitieto pystytään latamaan erikseen virheenjäljittemänä käytettyyn GNU Debuggeriin (GDB:hen). Näin symbolitietojen rakenne ja osoitteet ovat myös aina paikkansapitävät