The FIELDS Instrument Suite for Solar Probe Plus: Measuring the Coronal Plasma and Magnetic Field, Plasma Waves and Turbulence, and Radio Signatures of Solar Transients.

NASA's Solar Probe Plus (SPP) mission will make the first in situ measurements of the solar corona and the birthplace of the solar wind. The FIELDS instrument suite on SPP will make direct measurements of electric and magnetic fields, the properties of in situ plasma waves, electron density and temperature profiles, and interplanetary radio emissions, amongst other things. Here, we describe the scientific objectives targeted by the SPP/FIELDS instrument, the instrument design itself, and the instrument concept of operations and planned data products

Design Techniques for Energy-Quality Scalable Digital Systems

Energy efficiency is one of the key design goals in modern computing. Increasingly complex tasks are being executed in mobile devices and Internet of Things end-nodes, which are expected to operate for long time intervals, in the orders of months or years, with the limited energy budgets provided by small form-factor batteries. Fortunately, many of such tasks are error resilient, meaning that they can toler- ate some relaxation in the accuracy, precision or reliability of internal operations, without a significant impact on the overall output quality. The error resilience of an application may derive from a number of factors. The processing of analog sensor inputs measuring quantities from the physical world may not always require maximum precision, as the amount of information that can be extracted is limited by the presence of external noise. Outputs destined for human consumption may also contain small or occasional errors, thanks to the limited capabilities of our vision and hearing systems. Finally, some computational patterns commonly found in domains such as statistics, machine learning and operational research, naturally tend to reduce or eliminate errors. Energy-Quality (EQ) scalable digital systems systematically trade off the quality of computations with energy efficiency, by relaxing the precision, the accuracy, or the reliability of internal software and hardware components in exchange for energy reductions. This design paradigm is believed to offer one of the most promising solutions to the impelling need for low-energy computing. Despite these high expectations, the current state-of-the-art in EQ scalable design suffers from important shortcomings. First, the great majority of techniques proposed in literature focus only on processing hardware and software components. Nonetheless, for many real devices, processing contributes only to a small portion of the total energy consumption, which is dominated by other components (e.g. I/O, memory or data transfers). Second, in order to fulfill its promises and become diffused in commercial devices, EQ scalable design needs to achieve industrial level maturity. This involves moving from purely academic research based on high-level models and theoretical assumptions to engineered flows compatible with existing industry standards. Third, the time-varying nature of error tolerance, both among different applications and within a single task, should become more central in the proposed design methods. This involves designing “dynamic” systems in which the precision or reliability of operations (and consequently their energy consumption) can be dynamically tuned at runtime, rather than “static” solutions, in which the output quality is fixed at design-time. This thesis introduces several new EQ scalable design techniques for digital systems that take the previous observations into account. Besides processing, the proposed methods apply the principles of EQ scalable design also to interconnects and peripherals, which are often relevant contributors to the total energy in sensor nodes and mobile systems respectively. Regardless of the target component, the presented techniques pay special attention to the accurate evaluation of benefits and overheads deriving from EQ scalability, using industrial-level models, and on the integration with existing standard tools and protocols. Moreover, all the works presented in this thesis allow the dynamic reconfiguration of output quality and energy consumption. More specifically, the contribution of this thesis is divided in three parts. In a first body of work, the design of EQ scalable modules for processing hardware data paths is considered. Three design flows are presented, targeting different technologies and exploiting different ways to achieve EQ scalability, i.e. timing-induced errors and precision reduction. These works are inspired by previous approaches from the literature, namely Reduced-Precision Redundancy and Dynamic Accuracy Scaling, which are re-thought to make them compatible with standard Electronic Design Automation (EDA) tools and flows, providing solutions to overcome their main limitations. The second part of the thesis investigates the application of EQ scalable design to serial interconnects, which are the de facto standard for data exchanges between processing hardware and sensors. In this context, two novel bus encodings are proposed, called Approximate Differential Encoding and Serial-T0, that exploit the statistical characteristics of data produced by sensors to reduce the energy consumption on the bus at the cost of controlled data approximations. The two techniques achieve different results for data of different origins, but share the common features of allowing runtime reconfiguration of the allowed error and being compatible with standard serial bus protocols. Finally, the last part of the manuscript is devoted to the application of EQ scalable design principles to displays, which are often among the most energy- hungry components in mobile systems. The two proposals in this context leverage the emissive nature of Organic Light-Emitting Diode (OLED) displays to save energy by altering the displayed image, thus inducing an output quality reduction that depends on the amount of such alteration. The first technique implements an image-adaptive form of brightness scaling, whose outputs are optimized in terms of balance between power consumption and similarity with the input. The second approach achieves concurrent power reduction and image enhancement, by means of an adaptive polynomial transformation. Both solutions focus on minimizing the overheads associated with a real-time implementation of the transformations in software or hardware, so that these do not offset the savings in the display. For each of these three topics, results show that the aforementioned goal of building EQ scalable systems compatible with existing best practices and mature for being integrated in commercial devices can be effectively achieved. Moreover, they also show that very simple and similar principles can be applied to design EQ scalable versions of different system components (processing, peripherals and I/O), and to equip these components with knobs for the runtime reconfiguration of the energy versus quality tradeoff

Low-Power Heterogeneous Graphene Nanoribbon-CMOS Multistate Volatile Memory Circuit

Graphene is an emerging nanomaterial believed to be a potential candidate for post-Si nanoelectronics, due to its exotic properties. Recently, a new graphene nanoribbon crossbar (xGNR) device was proposed which exhibits negative differential resistance (NDR). In this paper, a multi-state memory design is presented that can store multiple bits in a single cell enabled by this xGNR device, called Graphene Nanoribbon Tunneling Random Access Memory (GNTRAM). An approach to increase the number of bits per cell is explored alternative to physical scaling to overcome CMOS SRAM limitations. A comprehensive design for quaternary GNTRAM is presented as a baseline, implemented with a heterogeneous integration between graphene and CMOS. Sources of leakage and approaches to mitigate them are investigated. This design is extensively benchmarked against 16nm CMOS SRAMs and 3T DRAM. The proposed quaternary cell shows up to 2.27x density benefit vs. 16nm CMOS SRAMs and 1.8x vs. 3T DRAM. It has comparable read performance and is power-efficient, up to 1.32x during active period and 818x during stand-by against high performance SRAMs. Multi-state GNTRAM has the potential to realize high-density low-power nanoscale embedded memories. Further improvements may be possible by using graphene more extensively, as graphene transistors become available in future

Efficient DSP and Circuit Architectures for Massive MIMO: State-of-the-Art and Future Directions

Massive MIMO is a compelling wireless access concept that relies on the use of an excess number of base-station antennas, relative to the number of active terminals. This technology is a main component of 5G New Radio (NR) and addresses all important requirements of future wireless standards: a great capacity increase, the support of many simultaneous users, and improvement in energy efficiency. Massive MIMO requires the simultaneous processing of signals from many antenna chains, and computational operations on large matrices. The complexity of the digital processing has been viewed as a fundamental obstacle to the feasibility of Massive MIMO in the past. Recent advances on system-algorithm-hardware co-design have led to extremely energy-efficient implementations. These exploit opportunities in deeply-scaled silicon technologies and perform partly distributed processing to cope with the bottlenecks encountered in the interconnection of many signals. For example, prototype ASIC implementations have demonstrated zero-forcing precoding in real time at a 55 mW power consumption (20 MHz bandwidth, 128 antennas, multiplexing of 8 terminals). Coarse and even error-prone digital processing in the antenna paths permits a reduction of consumption with a factor of 2 to 5. This article summarizes the fundamental technical contributions to efficient digital signal processing for Massive MIMO. The opportunities and constraints on operating on low-complexity RF and analog hardware chains are clarified. It illustrates how terminals can benefit from improved energy efficiency. The status of technology and real-life prototypes discussed. Open challenges and directions for future research are suggested.Comment: submitted to IEEE transactions on signal processin

Thermal-Aware Networked Many-Core Systems

Advancements in IC processing technology has led to the innovation and growth happening in the consumer electronics sector and the evolution of the IT infrastructure supporting this exponential growth. One of the most difficult obstacles to this growth is the removal of large amount of heatgenerated by the processing and communicating nodes on the system. The scaling down of technology and the increase in power density is posing a direct and consequential effect on the rise in temperature. This has resulted in the increase in cooling budgets, and affects both the life-time reliability and performance of the system. Hence, reducing on-chip temperatures has become a major design concern for modern microprocessors. This dissertation addresses the thermal challenges at different levels for both 2D planer and 3D stacked systems. It proposes a self-timed thermal monitoring strategy based on the liberal use of on-chip thermal sensors. This makes use of noise variation tolerant and leakage current based thermal sensing for monitoring purposes. In order to study thermal management issues from early design stages, accurate thermal modeling and analysis at design time is essential. In this regard, spatial temperature profile of the global Cu nanowire for on-chip interconnects has been analyzed. It presents a 3D thermal model of a multicore system in order to investigate the effects of hotspots and the placement of silicon die layers, on the thermal performance of a modern ip-chip package. For a 3D stacked system, the primary design goal is to maximise the performance within the given power and thermal envelopes. Hence, a thermally efficient routing strategy for 3D NoC-Bus hybrid architectures has been proposed to mitigate on-chip temperatures by herding most of the switching activity to the die which is closer to heat sink. Finally, an exploration of various thermal-aware placement approaches for both the 2D and 3D stacked systems has been presented. Various thermal models have been developed and thermal control metrics have been extracted. An efficient thermal-aware application mapping algorithm for a 2D NoC has been presented. It has been shown that the proposed mapping algorithm reduces the effective area reeling under high temperatures when compared to the state of the art.Siirretty Doriast

A Process Variation Tolerant Self-Compensation Sense Amplifier Design

As we move under the aegis of the Moore\u27s law, we have to deal with its darker side with problems like leakage and short channel effects. Once we go beyond 45nm regime process variations also have emerged as a significant design concern.Embedded memories uses sense amplifier for fast sensing and typically, sense amplifiers uses pair of matched transistors in a positive feedback environment. A small difference in voltage level of applied input signals to these matched transistors is amplified and the resulting logic signals are latched. Intra die variation causes mismatch between the sense transistors that should ideally be identical structures. Yield loss due to device and process variations has never been so critical to cause failure in circuits. Due to growth in size of embedded SRAMs as well as usage of sense amplifier based signaling techniques, process variations in sense amplifiers leads to significant loss of yield for that we need to come up with process variation tolerant circuit styles and new devices. In this work impact of transistor mismatch due to process variations on sense amplifier is evaluated and this problem is stated. For the solution of the problem a novel self compensation scheme on sense amplifiers is presented on different technology nodes up to 32nm on conventional bulk MOSFET technology. Our results show that the self compensation technique in the conventional bulk MOSFET latch type sense amplifier not just gives improvement in the yield but also leads to improvement in performance for latch type sense amplifiers. Lithography related CD variations, fluctuations in dopant density, oxide thickness and parametric variations of devices are identified as a major challenge to the classical bulk type MOSFET. With the emerging nanoscale devices, SIA roadmap identifies FinFETs as a candidate for post-planar end-of-roadmap CMOS device. With current technology scaling issues and with conventional bulk type MOSFET on 32nm node our technique can easily be applied to Double Gate devices. In this work, we also develop the model of Double Gate MOSFET through 3D Device Simulator Damocles and TCAD simulator. We propose a FinFET based process variation tolerant sense amplifier design that exploits the back gate of FinFET devices for dynamic compensation against process variations. Results from statistical simulation show that the proposed dynamic compensation is highly effective in restoring yield at a level comparable to that of sense amplifiers without process variations. We created the 32nm double gate models generated from Damocles 3-D device simulations [25] and Taurus Device Simulator available commercially from Synopsys [47] and use them in the nominal latch type sense amplifier design and on the Independent Gate Self Compensation Sense Amplifier Design (IGSSA) to compare the yield and performance benefits of sense amplifier design on FinFET technology over the conventional bulk type CMOS based sense amplifier on 32nm technology node effective in restoring yield at a level comparable to that of sense amplifiers without process variations. We created the 32nm double gate models generated from Damocles 3-D device simulations [25] and Taurus Device Simulator available commercially from Synopsys [47] and use them in the nominal latch type sense amplifier design and on the Independent Gate Self Compensation Sense Amplifier Design (IGSSA) to compare the yield and performance benefits of sense amplifier design on FinFET technology over the conventional bulk type CMOS based sense amplifier on 32nm technology node

Ingress of threshold voltage-triggered hardware trojan in the modern FPGA fabric–detection methodology and mitigation

The ageing phenomenon of negative bias temperature instability (NBTI) continues to challenge the dynamic thermal management of modern FPGAs. Increased transistor density leads to thermal accumulation and propagates higher and non-uniform temperature variations across the FPGA. This aggravates the impact of NBTI on key PMOS transistor parameters such as threshold voltage and drain current. Where it ages the transistors, with a successive reduction in FPGA lifetime and reliability, it also challenges its security. The ingress of threshold voltage-triggered hardware Trojan, a stealthy and malicious electronic circuit, in the modern FPGA, is one such potential threat that could exploit NBTI and severely affect its performance. The development of an effective and efficient countermeasure against it is, therefore, highly critical. Accordingly, we present a comprehensive FPGA security scheme, comprising novel elements of hardware Trojan infection, detection, and mitigation, to protect FPGA applications against the hardware Trojan. Built around the threat model of a naval warship’s integrated self-protection system (ISPS), we propose a threshold voltage-triggered hardware Trojan that operates in a threshold voltage region of 0.45V to 0.998V, consuming ultra-low power (10.5nW), and remaining stealthy with an area overhead as low as 1.5% for a 28 nm technology node. The hardware Trojan detection sub-scheme provides a unique lightweight threshold voltage-aware sensor with a detection sensitivity of 0.251mV/nA. With fixed and dynamic ring oscillator-based sensor segments, the precise measurement of frequency and delay variations in response to shifts in the threshold voltage of a PMOS transistor is also proposed. Finally, the FPGA security scheme is reinforced with an online transistor dynamic scaling (OTDS) to mitigate the impact of hardware Trojan through run-time tolerant circuitry capable of identifying critical gates with worst-case drain current degradation