Gated-Diode Memory Cell and Array Utilizing GIDL Current

학위논문 (박사)-- 서울대학교 대학원 : 전기·컴퓨터공학부, 2014. 2. 이종호.In this dissertation, the gated-diode memory cell and array utilizing the gate-induced drain leakage (GIDL) current is proposed and investigated for ultra-high density memory device. In the gated-diode memory, there is no short-channel effect (SCE) which is the critical issue for scaling down of the cell in conventional FET type memories. In addition, the random access can be possible in array structure although the cells are connected serially like as conventional NAND flash memory array, because the n+ diffusion region is directly connected to all cells which are connected in a bit-line (BL). In the gated-diode memory, Fowler-Nordheim (FN) tunneling is used for injection of electrons and band-to-band-tunneling (BTBT) induced hot-hole injection is used for injection of holes. To sense the cell state, the GIDL current is detected with negative gate bias condition. The GIDL current is increased and decreased by the stored electrons and holes, respectively. Recent trend of nonvolatile memories are introduced in Chapter 1. In Chapter 2, Gated-diode memory utilizing the GIDL current is introduced. In Chapter 3, fabrication process and measured data of gated-diode memory cell and array utilizing GIDL current is presented. Three methods of fabrication process is represented and key process technologies are shown with SEM images. In Chapter 4, the comparison between measurement and simulation is done and improved device structure with SiGe material is investigated to increase the sensing current (GIDL current). In Appendix, the low-frequency noise (LFN) characteristics of GIDL current in MOSFETs are investigated.Abstract i Contents iii Chapter 1 Introduction………………………………………………1 1.1 Flash Memory Technology………………………………………1 1.2 Basic Operation of Flash Memory……………………………4 1.3 3D stacked NAND Flash Memory…………………………6 1.4 Emerging New Memory……………………………………9 Chapter 2 Gated-Diode Memory utilizing GIDL Current………10 2.1 Introduction of GIDL Current……………………………10 2.2 Introduction of Gated-Diode Memory……………15 Chapter 3 Fabrication and Electrical Characteristics of SONOS Gated-Diode Memory Cell and Array utilizing GIDL Current…………………………………………………21 3.1 Fabrication Process of Gated-diode Memory with Fin Structure ……………………………………………………………………21 3.2 SEM Images of Fabricated Structures and Key Process Issues …………………………………………………………………31 3.3 Electrical Characteristics of Fabricated SONOS Gated-Diode Memory Cell and Array utilizing GIDL Current……………36 Chapter 4 Optimization of Gated-Diode Memory……………43 4.1 Comparison between Measurement and Simulation………43 4.2 Increase of GIDL current using SiGe……… …………………47 Chapter 5 Conclusions……………………………………………55 Appendix Low Frequency Noise of GIDL Current in MOSFETs …………………………………………………………56 A.1 LFN of GIDL and Channel Currents…………………………56 A.2 LFN of GIDL Current in n- and p-type MOSFETs…………67 A.3 RTN in GIDL and Gate Edge Tunneling Currents…………72 A.4 Model for RTN in GIDL Current…………………………85 Bibliography……………………………………………90 Abstract in Korean………………………………………96Docto

Caractérisation, mécanismes et applications mémoire des transistors avancés sur SOI

Ce travail présente les principaux résultats obtenus avec une large gamme de dispositifs SOI avancés, candidats très prometteurs pour les futurs générations de transistors MOSFETs. Leurs propriétés électriques ont été analysées par des mesures systématiques, agrémentées par des modèles analytiques et/ou des simulations numériques. Nous avons également proposé une utilisation originale de dispositifs FinFETs fabriqués sur ONO enterré en fonctionnalisant le ONO à des fins d'application mémoire non volatile, volatile et unifiées. Après une introduction sur l'état de l'art des dispositifs avancés en technologie SOI, le deuxième chapitre a été consacré à la caractérisation détaillée des propriétés de dispositifs SOI planaires ultra- mince (épaisseur en dessous de 7 nm) et multi-grille. Nous avons montré l excellent contrôle électrostatique par la grille dans les transistors très courts ainsi que des effets intéressants de transport et de couplage. Une approche similaire a été utilisée pour étudier et comparer des dispositifs FinFETs à double grille et triple grille. Nous avons démontré que la configuration FinFET double grille améliore le couplage avec la grille arrière, phénomène important pour des applications à tension de seuil multiple. Nous avons proposé des modèles originaux expliquant l'effet de couplage 3D et le comportement de la mobilité dans des TFTs nanocristallin ZnO. Nos résultats ont souligné les similitudes et les différences entre les transistors SOI et à base de ZnO. Des mesures à basse température et de nouvelles méthodes d'extraction ont permis d'établir que la mobilité dans le ZnO et la qualité de l'interface ZnO/SiO2 sont remarquables. Cet état de fait ouvre des perspectives intéressantes pour l'utilisation de ce type de matériaux aux applications innovantes de l'électronique flexible. Dans le troisième chapitre, nous nous sommes concentrés sur le comportement de la mobilité dans les dispositifs SOI planaires et FinFET en effectuant des mesures de magnétorésistance à basse température. Nous avons mis en évidence expérimentalement un comportement de mobilité inhabituel (multi-branche) obtenu lorsque deux ou plusieurs canaux coexistent et interagissent. Un autre résultat original concerne l existence et l interprétation de la magnétorésistance géométrique dans les FinFETs.L'utilisation de FinFETs fabriqués sur ONO enterré en tant que mémoire non volatile flash a été proposée dans le quatrième chapitre. Deux mécanismes d'injection de charge ont été étudiés systématiquement. En plus de la démonstration de la pertinence de ce type mémoire en termes de performances (rétention, marge de détection), nous avons mis en évidence un comportement inattendu : l amélioration de la marge de détection pour des dispositifs à canaux courts. Notre concept innovant de FinFlash sur ONO enterré présente plusieurs avantages: (i) opération double-bit et (ii) séparation de la grille de stockage et de l'interface de lecture augmentant la fiabilité et autorisant une miniaturisation plus poussée que des Finflash conventionnels avec grille ONO.Dans le dernier chapitre, nous avons exploré le concept de mémoire unifiée, en combinant les opérations non volatiles et 1T-DRAM par le biais des FinFETs sur ONO enterré. Comme escompté pour les mémoires dites unifiées, le courant transitoire en mode 1T-DRAM dépend des charges non volatiles stockées dans le ONO. D'autre part, nous avons montré que les charges piégées dans le nitrure ne sont pas perturbées par les opérations de programmation et lecture de la 1T-DRAM. Les performances de cette mémoire unifiée multi-bits sont prometteuses et pourront être considérablement améliorées par optimisation technologique de ce dispositif.The evolution of electronic systems and portable devices requires innovation in both circuit design and transistor architecture. During last fifty years, the main issue in MOS transistor has been the gate length scaling down. The reduction of power consumption together with the co-integration of different functions is a more recent avenue. In bulk-Si planar technology, device shrinking seems to arrive at the end due to the multiplication of parasitic effects. The relay has been taken by novel SOI-like device architectures. In this perspective, this manuscript presents the main achievements of our work obtained with a variety of advanced fully depleted SOI MOSFETs, which are very promising candidates for next generation MOSFETs. Their electrical properties have been analyzed by systematic measurements and clarified by analytical models and/or simulations. Ultimately, appropriate applications have been proposed based on their beneficial features.In the first chapter, we briefly addressed the short-channel effects and the diverse technologies to improve device performance. The second chapter was dedicated to the detailed characterization and interesting properties of SOI devices. We have demonstrated excellent gate control and high performance in ultra-thin FD SOI MOSFET. The SCEs are efficiently suppressed by decreasing the body thickness below 7 nm. We have investigated the transport and electrostatic properties as well as the coupling mechanisms. The strong impact of body thickness and temperature range has been outlined. A similar approach was used to investigate and compare vertical double-gate and triple-gate FinFETs. DG FinFETs show enhanced coupling to back-gate bias which is applicable and suitable for dynamic threshold voltage tuning. We have proposed original models explaining the 3D coupling effect in FinFETs and the mobility behavior in ZnO TFTs. Our results pointed on the similarities and differences in SOI and ZnO transistors. According to our low-temperature measurements and new promoted extraction methods, the mobility in ZnO and the quality of ZnO/SiO2 interface are respectable, enabling innovating applications in flexible, transparent and power electronics. In the third chapter, we focused on the mobility behavior in planar SOI and FinFET devices by performing low-temperature magnetoresistance measurements. Unusual mobility curve with multi-branch aspect were obtained when two or more channels coexist and interplay. Another original result in the existence of the geometrical magnetoresistance in triple-gate and even double-gate FinFETs.The operation of a flash memory in FinFETs with ONO buried layer was explored in the forth chapter. Two charge injection mechanisms were proposed and systematically investigated. We have discussed the role of device geometry and temperature. Our novel ONO FinFlash concept has several distinct advantages: double-bit operation, separation of storage medium and reading interface, reliability and scalability. In the final chapter, we explored the avenue of unified memory, by combining nonvolatile and 1T-DRAM operations in a single transistor. The key result is that the transient current, relevant for 1T-DRAM operation, depends on the nonvolatile charges stored in the nitride buried layer. On the other hand, the trapped charges are not disturbed by the 1T-DRAM operation. Our experimental data offers the proof-of-concept for such advanced memory. The performance of the unified/multi-bit memory is already decent but will greatly improve in the coming years by processing dedicated devices.SAVOIE-SCD - Bib.électronique (730659901) / SudocGRENOBLE1/INP-Bib.électronique (384210012) / SudocGRENOBLE2/3-Bib.électronique (384219901) / SudocSudocFranceF

A novel low-temperature growth method of silicon structures and application in flash memory.

Flash memories are solid-state non-volatile memories. They play a vital role especially in information storage in a wide range of consumer electronic devices and applications including smart phones, digital cameras, laptop computers, and satellite navigators. The demand for high density flash has surged as a result of the proliferation of these consumer electronic portable gadgets and the more features they offer – wireless internet, touch screen, video capabilities. The increase in the density of flash memory devices over the years has come as a result of continuous memory cell-size reduction. This size scaling is however approaching a dead end and it is widely agreed that further reduction beyond the 20 nm technological node is going to be very difficult, as it would result to challenges such as cross-talk or cell-to-cell interference, a high statistical variation in the number of stored electrons in the floating gate and high leakage currents due to thinner tunnel oxides. Because of these challenges a wide range of solutions in form of materials and device architectures are being investigated. Among them is three-dimensional (3-D) flash, which is widely acclaimed as the ideal solution, as they promise the integration of long-time retention and ultra-high density cells without compromising device reliability. However, current high temperature (>600 °C) growth techniques of the Polycrystalline silicon floating gate material are incompatible with 3-D flash memory; with vertically stacked memory layers, which require process temperatures to be ≤ 400 °C. There already exist some low temperature techniques for producing polycrystalline silicon such as laser annealing, solid-phase crystallization of amorphous silicon and metal-induced crystallization. However, these have some short-comings which make them not suitable for use in 3-D flash memory, e.g. the high furnace annealing temperatures (700 °C) in solid-phase crystallization of amorphous silicon which could potentially damage underlying memory layers in 3-D flash, and the metal contaminants in metal-induced crystallization which is a potential source of high leakage currents. There is therefore a need for alternative low temperature techniques that would be most suitable for flash memory purposes. With reference to the above, the main objective of this research was to develop a novel low temperature method for growing silicon structures at ≤ 400 °C. This thesis thus describes the development of a low-temperature method for polycrystalline silicon growth and the application of the technique in a capacitor-like flash memory device. It has been demonstrated that silicon structures with polycrystalline silicon-like properties can be grown at ≤ 400 °C in a 13.56 MHz radio frequency (RF) plasma-enhanced chemical vapour deposition (PECVD) reactor with the aid of Nickel Formate Dihydrate (NFD). It is also shown that the NFD coated on the substrates, thermally decomposes in-situ during the deposition process forming Ni particles that act as nucleation and growth sites of polycrystalline silicon. Silicon films grown by this technique and without annealing, have exhibited optical band gaps of ~ 1.2 eV compared to 1.78 eV for films grown under identical conditions but without the substrate being coated. These values were determined from UV-Vis spectroscopy and Tauc plots. These optical band gaps correspond to polycrystalline silicon and amorphous silicon respectively, meaning that the films grown on NFD-coated substrates are polycrystalline silicon while those grown on uncoated substrates remain amorphous. Moreover, this novel technique has been used to fabricate a capacitor-like flash memory that has exhibited hysteresis width corresponding to charge storage density in the order of 1012 cm-2 with a retention time well above 20 days for a device with silicon films grown at 300 °C. Films grown on uncoated films have not exhibit any significant hysteresis, and thus no flash memory-like behaviour. Given that all process temperatures throughout the fabrication of the devices are less than 400 °C and that no annealing of any sort was done on the material and devices, this growth method is thermal budget efficient and meets the crucial process temperature requirements of 3-D flash memory. Furthermore, the technique is glass compatible, which could prove a major step towards the acquisition of flash memory-integrated systems on glass, as well as other applications requiring low temperature polycrystalline silicon

Through Silicon Via Field-Effect Transistor with Hafnia-based Ferroelectrics and the Doping of Silicon by Gallium Implantation Utilizing a Focused Ion Beam System

3-dimensional integration has become a standard to further increase the transistor density and to enhance the integrated functionality in microchips. Integrated circuits are stacked on top of each other and copper-filled through-silicon VIAs (TSVs) are the industry-accepted choice for their vertical electrical connection. The aim of this work is to functionalize the TSVs by implementing vertical field-effect transistors inside the via holes. The front and back sides of 200 ... 300 µm thin silicon wafers were doped to create the source/drain regions of n- and p-FETs. The TSVFETs showed very stable saturation currents and on/off current ratios of about 10^6 (n-TSVFET) and 10^3 (p-TSVFET) for a gate voltage magnitude of 4V. The use of hafnium zirconium oxide on a thin SiO_2 interface layer as gate dielectric material in a p-TSVFET, enabled the implementation of a charge trapping memory inside the TSVs, showing a memory window of about 1V. This allows the non-volatile storage of the transistor on/off state. In addition, the demonstration of the use of gallium as the source/drain dopant in planar p-FET test structures (ion implanted from a focused ion beam tool) paves the way for maskless doping and for a process flow with a low thermal budget. It was shown, that ion implanted gallium can be activated and annealed at relatively low temperatures of 500 °C ... 700 °C.:Abstract / Kurzzusammenfassung Danksagung Index I List of Figures III List of Tables X List of Symbols XI List of Abbreviations XV 1 Introduction 1 2 Fundamentals 5 2.1 Metal Oxide Semiconductor Field Effect Transistors (MOSFETs) 5 2.1.1 Historical Development - Technological Advancements 7 2.1.2 Field-Effect Transistors in Semiconductor Memories 10 2.2 3D Integration and the Use of TSVs (Through Silicon VIAs) 16 2.3 Doping of Silicon 19 2.3.1 Doping by Thermal Diffusion 20 2.3.2 Doping by Ion Implantation 22 3 Electrical Characterization 24 3.1 Resistivity Measurements 24 3.1.1 Resistance Determination by Four-Point Probes Measurement 24 3.1.2 Contact Resistivity 27 3.1.3 Doping Concentration 32 3.2 C-V Measurements 35 3.2.1 Fundamentals of MIS C-V Measurements 35 3.2.2 Interpretation of C-V Measurements 37 3.3 Transistor Measurements 41 3.3.1 Output Characteristics (I_D-V_D) 41 3.3.2 Transfer Characteristics (I_D-V_G) 42 4 TSV Transistor 45 4.1 Idea and Motivation 45 4.2 Design and Layout of the TSV Transistor 47 4.2.1 Design of the TSV Transistor Structures 47 4.2.2 Test Structures for Planar FETs 48 5 Variations in the Integration Scheme of the TSV Transistor 51 5.1 Doping by Diffusion from Thin Films 51 5.1.1 Determination of Doping Profiles 52 5.1.2 n- and p- TSVFETs Doped Manufactures by the Use of the Diffusion Technique 59 5.2 Ferroelectric Hafnium-Zirconium-Oxide (HZO) in the Gate Stack 81 5.2.1 Planar ferroelectric p-MOSFETs Doped by Thermal Diffusion 82 5.2.2 p-TSVFETs with Hafnium-Zirconium-Oxide Metal Gate 90 5.3 Doping by Ion Implantation of Gallium with a Focused Ion Beam (FIB) Tool 96 5.3.1 Ga doped Si Diodes 97 5.3.2 Planar p-MOSFETs Doped by Ga Implantation 108 5.3.3 Proposal for a parallel integration of Cu TSVs and p-TSVFETs 117 6 Summary and Outlook 120 Bibliography XVIII A Appendix XXXVI A.1 Resistivity and Dopant Density XXXVI A.2 Mask set for the TSVFET XXXVII A.3 Mask Design of the Planar Test Structures XXXVIII Curriculum Vitae XXXIX List of Scientific Publications XL

First principles modelling of nucleation and growth during atomic layer deposition onto III-V substrates

Atomic layer deposition (ALD) is now used in semiconductor fabrication lines to deposit nanometre-thin oxide films, and has thus enabled the introduction of high-permittivity dielectrics into the CMOS gate stack. With interest increasing in transistors based on high mobility substrates, such as GaAs, we are investigating the surface treatments that may improve the interface characteristics. We focus on incubation periods of ALD processes on III-V substrates. We have applied first principles Density Functional Theory (DFT) to investigate detailed chemistry of these early stages of growth, specifically substrate and ALD precursor interaction. We have modelled the ‘clean-up’ effect by which organometallic precursors: trimethylaluminium (TMA) or hafnium and titanium amides clean arsenic oxides off the GaAs surface before ALD growth of dielectric commences and similar effect on Si3N4 substrate. Our simulations show that ‘clean-up’ of an oxide film strongly depends on precursor ligand, its affinity to the oxide and the redox character of the oxide. The predominant pathway for a metalloid oxide such as arsenic oxide is reduction, producing volatile molecules or gettering oxygen from less reducible oxides. An alternative pathway is non-redox ligand exchange, which allows non-reducible oxides (e.g. SiO2) to be cleaned-up. First principles study shows also that alkylamides are more susceptible to decomposition rather than migration on the oxide surface. This improved understanding of the chemical principles underlying ‘clean-up’ allows us to rationalize and predict which precursors will perform the reaction. The comparison is made between selection of metal chlorides, methyls and alkylamides precursors

Molecular assembly based nano-composite structures for memory applications

Ph.DDOCTOR OF PHILOSOPH

Straintronics: A Leap towards Ultimate Energy Efficiency of Magnetic Memory and Logic

After decades of exponential growth of the semiconductor industries, predicted by Moore’s Law, the complementary metal-oxide semiconductor (CMOS) circuits are approaching their end of the road, as the feature sizes reach sub-10nm regimes, leaving electrical engineers with a profusion of design challenges in terms of energy limitations and power density. The latter has left the road for alternative technologies wide open to help CMOS overcome the present challenges. Magnetic random access memories (MRAM) are one of the candidates to assist with aforesaid obstacles. Proposed in the early 90’s, MRAM has been under research and development for decades. The expedition for energy efficient MRAM is carried out by the fact that magnetic logic, potentially, has orders of magnitude lower switching energy compared to a charge-based CMOS logic since, in a nanomagnet, magnetic domains would self-align with each other. Regrettably, conventional methods for switching the state of the cell in an MRAM, field induced magnetization switching (FIMS) and spin transfer torque (STT), use electric current (flow of charges) to switch the state of the magnet, nullifying the energy advantage, stated above. In order to maximize the energy efficiency, the amount of charge required to switch the state of the MTJ should be minimized. To this end, straintronics, as an alternative energy efficient method to FIMS and STT to switch the state of a nanomagnet, is proposed recently. The method states that by combining piezoelectricity and inverse magnetostriction, the magnetization state of the device can flip, within few nano-seconds while reducing the switching energy by orders of magnitude compared to STT and FIMS. This research focuses on analysis, design, modeling, and applications of straintronics-based MTJ. The first goal is to perform an in-depth analysis on the static and dynamic behavior of the device. Next, we are aiming to increase the accuracy of the model by including the effect of temperature and thermal noise on the device’s behavior. The goal of performing such analysis is to create a comprehensive model of the device that predicts both static and dynamic responses of the magnetization to applied stress. The model will be used to interface the device with CMOS controllers and switches in large systems. Next, in an attempt to speed up the simulation of such devices in multi-megabyte memory systems, a liberal model has been developed by analytically approximating a solution to the magnetization dynamics, which should be numerically solved otherwise. The liberal model demonstrates more than two orders of magnitude speed improvement compared to the conventional numerical models. Highlighting the applications of the straintronics devices by combining such devices with peripheral CMOS circuitry is another goal of the research. Design of a proof-of-concept 2 kilo-bit nonvolatile straintronics-based memory was introduced in our recent work. To highlight the potential applications of the straintronics device, beyond data storage, the use of the principle in ultra-fast yet low power true random number generation and neuron/synapse design for artificial neural networks have been investigated. Lastly, in an attempt to investigate the practicality of the straintronics principle, the effect of process variations and interface imperfections on the switching behavior of the magnetization is investigated. The results reveal the destructive aftermath of fabrication imperfections on the switching pattern of the device, leaving careful pulse-shaping, alternative topologies, or combination with STT as the last resorts for successful strain-based magnetization switching.PHDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttps://deepblue.lib.umich.edu/bitstream/2027.42/137010/1/barangi_1.pd

NASA Tech Briefs, February 1992

Topics covered include: New Product Development; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences

Sixth Annual Workshop on Space Operations Applications and Research (SOAR 1992), volume 2

This document contains papers presented at the Space Operations, Applications, and Research Symposium (SOAR) hosted by the U.S. Air Force (USAF) on 4-6 Aug. 1992. The symposium was cosponsored by the Air Force Material Command and by NASA/JSC. Key technical areas covered during the symposium were robotics and telepresence, automation and intelligent systems, human factors, life sciences, and space maintenance and servicing. The SOAR differed from most other conferences in that it was concerned with Government-sponsored research and development relevant to aerospace operations. Symposium proceedings include papers covering various disciplines presented by experts from NASA, the USAF, universities, and industry

Active Ageing with Music and Technology: Meaningful Participation and the Situated Use of Technology in Community Music

Scholars and commentators have long advocated the benefits of communal artistic activity for the ageing population. The notion of “Active Ageing” also brings a new angle to the understanding of challenges and opportunities of emerging technologies. In this dissertation, I argue that recognising community music practices and technology use as situated action provides opportunities to grasp the subtleties of social participation and technology use for active ageing. Qualitative and quantitative enquiries were used to (i) uncover the experiences of meaningful participation and the situated use of technology in community music; (ii) unpack the psychological basis of meaningful participation that is sustained by technology use. Drawing on social practice theory by Elizabeth Shove and the situated action approach by Lucy Suchman, this dissertation contributes a productive context of technology use to the richly researched area of community music with older people, and illuminates the complexities of community music practices and the ways in which technological devices coordinate the practices and the implications for active ageing. Two empirical chapters address the two research goals, respectively. Chapter 3 uses qualitative methods and identifies music practices mediated by technology, such as music sharing and revisiting, and how these practices evolve through the reconfiguration of connections between technological devices, competence, meanings, and forward-facing identities. Identity development, via routes such as exercising control, role transitions and social spaces, has psychological significance and implications for the broader concept of active ageing. Building on these findings, we further elucidate how self-efficacy (an exemplar of competence) and motivation (an exemplar of meaning) are associated with the use of digital music technologies (an exemplar of technologies for community music participation) in Chapter 4. Two sets of use patterns that emerge from the quantitative survey data, Contributing and Active interacting, further lend support to the qualitative data. The use of digital music technologies was not determined exclusively by age and employment status, but also by music group memberships and music-technology-specific self-efficacy. Getting social connectedness was a key motivation for more frequent use and sharing using digital music technologies. These results also suggest that age is relevant in thinking about why technology is used in the participants’ particular ways. Drawing upon these findings, I wrote about how HCI can leverage the tenets of active ageing and might facilitate older people’s meaningful participation in community activities with digital music technologies.Cambridge Trust and CS