異種ダイレット積層を用いたフレキシブルハイブリッドデバイスの集積技術に関する研究

Tohoku University福島誉史課

High-Density Solid-State Memory Devices and Technologies

This Special Issue aims to examine high-density solid-state memory devices and technologies from various standpoints in an attempt to foster their continuous success in the future. Considering that broadening of the range of applications will likely offer different types of solid-state memories their chance in the spotlight, the Special Issue is not focused on a specific storage solution but rather embraces all the most relevant solid-state memory devices and technologies currently on stage. Even the subjects dealt with in this Special Issue are widespread, ranging from process and design issues/innovations to the experimental and theoretical analysis of the operation and from the performance and reliability of memory devices and arrays to the exploitation of solid-state memories to pursue new computing paradigms

MICROELECTRONICS PACKAGING TECHNOLOGY ROADMAPS, ASSEMBLY RELIABILITY, AND PROGNOSTICS

This paper reviews the industry roadmaps on commercial-off-the shelf (COTS) microelectronics packaging technologies covering the current trends toward further reducing size and increasing functionality. Due tothe breadth of work being performed in this field, this paper presents only a number of key packaging technologies. The topics for each category were down-selected by reviewing reports of industry roadmaps including the International Technology Roadmap for Semiconductor (ITRS) and by surveying publications of the International Electronics Manufacturing Initiative (iNEMI) and the roadmap of association connecting electronics industry (IPC). The paper also summarizes the findings of numerous articles and websites that allotted to the emerging and trends in microelectronics packaging technologies. A brief discussion was presented on packaging hierarchy from die to package and to system levels. Key elements of reliability for packaging assemblies were presented followed by reliabilty definition from a probablistic failure perspective. An example was present for showing conventional reliability approach using Monte Carlo simulation results for a number of plastic ball grid array (PBGA). The simulation results were compared to experimental thermal cycle test data. Prognostic health monitoring (PHM) methods, a growing field for microelectronics packaging technologies, were briefly discussed. The artificial neural network (ANN), a data-driven PHM, was discussed in details. Finally, it presented inter- and extra-polations using ANN simulation for thermal cycle test data of PBGA and ceramic BGA (CBGA) assemblies

Integrated Circuits/Microchips

With the world marching inexorably towards the fourth industrial revolution (IR 4.0), one is now embracing lives with artificial intelligence (AI), the Internet of Things (IoTs), virtual reality (VR) and 5G technology. Wherever we are, whatever we are doing, there are electronic devices that we rely indispensably on. While some of these technologies, such as those fueled with smart, autonomous systems, are seemingly precocious; others have existed for quite a while. These devices range from simple home appliances, entertainment media to complex aeronautical instruments. Clearly, the daily lives of mankind today are interwoven seamlessly with electronics. Surprising as it may seem, the cornerstone that empowers these electronic devices is nothing more than a mere diminutive semiconductor cube block. More colloquially referred to as the Very-Large-Scale-Integration (VLSI) chip or an integrated circuit (IC) chip or simply a microchip, this semiconductor cube block, approximately the size of a grain of rice, is composed of millions to billions of transistors. The transistors are interconnected in such a way that allows electrical circuitries for certain applications to be realized. Some of these chips serve specific permanent applications and are known as Application Specific Integrated Circuits (ASICS); while, others are computing processors which could be programmed for diverse applications. The computer processor, together with its supporting hardware and user interfaces, is known as an embedded system.In this book, a variety of topics related to microchips are extensively illustrated. The topics encompass the physics of the microchip device, as well as its design methods and applications

Miniaturized Transistors, Volume II

In this book, we aim to address the ever-advancing progress in microelectronic device scaling. Complementary Metal-Oxide-Semiconductor (CMOS) devices continue to endure miniaturization, irrespective of the seeming physical limitations, helped by advancing fabrication techniques. We observe that miniaturization does not always refer to the latest technology node for digital transistors. Rather, by applying novel materials and device geometries, a significant reduction in the size of microelectronic devices for a broad set of applications can be achieved. The achievements made in the scaling of devices for applications beyond digital logic (e.g., high power, optoelectronics, and sensors) are taking the forefront in microelectronic miniaturization. Furthermore, all these achievements are assisted by improvements in the simulation and modeling of the involved materials and device structures. In particular, process and device technology computer-aided design (TCAD) has become indispensable in the design cycle of novel devices and technologies. It is our sincere hope that the results provided in this Special Issue prove useful to scientists and engineers who find themselves at the forefront of this rapidly evolving and broadening field. Now, more than ever, it is essential to look for solutions to find the next disrupting technologies which will allow for transistor miniaturization well beyond silicon’s physical limits and the current state-of-the-art. This requires a broad attack, including studies of novel and innovative designs as well as emerging materials which are becoming more application-specific than ever before

Collective Communications and Computation Mechanisms on the RF Channel for Organic Printed Smart Labels and Resource-limited IoT Nodes

Radio Frequency IDentification (RFID) and Wireless Sensor Networks (WSN) are seen as enabler technologies for realizing the Internet of Things (IoT). Organic and printed Electronics (OE) has the potential to provide low cost and all-printable smart RFID labels in high volumes. With regard to WSN, power harvesting techniques and resource-efficient communications are promising key technologies to create sustainable and for the environment friendly sensing devices. However, the implementation of OE smart labels is only allowing printable devices of ultra-low hardware complexity, that cannot employ standard RFID communications. And, the deployment of current WSN technology is far away from offering battery-free and low-cost sensing technology. To this end, the steady growth of IoT is increasing the demand for more network capacity and computational power. With respect to wireless communications research, the state-of-the-art employs superimposed radio transmission in form of physical layer network coding and computation over the MAC to increase information flow and computational power, but lacks on practicability and robustness so far. With regard to these research challenges we developed in particular two approaches, i.e., code-based Collective Communications for dense sensing environments, and time-based Collective Communications (CC) for resource-limited WSNs. In respect to the code-based CC approach we exploit the principle of superimposed radio transmission to acquire highly scalable and robust communications obtaining with it at the same time as well minimalistic smart RFID labels, that can be manufactured in high volume with present-day OE. The implementation of our code-based CC relies on collaborative and simultaneous transmission of randomly drawn burst sequences encoding the data. Based on the framework of hyper-dimensional computing, statistical laws and the superposition principle of radio waves we obtained the communication of so called ensemble information, meaning the concurrent bulk reading of sensed values, ranges, quality rating, identifiers (IDs), and so on. With 21 transducers on a small-scale reader platform we tested the performance of our approach successfully proving the scalability and reliability. To this end, we implemented our code-based CC mechanism into an all-printable passive RFID label down to the logic gate level, indicating a circuit complexity of about 500 transistors. In respect to time-based CC approach we utilize the superimposed radio transmission to obtain resource-limited WSNs, that can be deployed in wide areas for establishing, e.g., smart environments. In our application scenario for resource-limited WSN, we utilize the superimposed radio transmission to calculate functions of interest, i.e., to accomplish data processing directly on the radio channel. To prove our concept in a case study, we created a WSN with 15 simple nodes measuring the environmental mean temperature. Based on our analysis about the wireless computation error we were able to minimize the stochastic error arbitrarily, and to remove the systematic error completely