4,346 research outputs found

    Investigations on electromagnetic noises and interactions in electronic architectures : a tutorial case on a mobile system

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    Electromagnetic interactions become critic in embedded and smart electronic structures. The increase of electronic performances confined in a finite volume or support for mobile applications defines new electromagnetic environment and compatibility configurations (EMC). With canonical demonstrators developed for tutorials and EMC experiences, this paper present basic principles and experimental techniques to investigate and control these severe interferences. Some issues are reviewed to present actual and future scientific challenges for EMC at electronic circuit level

    Testing Embedded Memories in Telecommunication Systems

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    Extensive system testing is mandatory nowadays to achieve high product quality. Telecommunication systems are particularly sensitive to such a requirement; to maintain market competitiveness, manufacturers need to combine reduced costs, shorter life cycles, advanced technologies, and high quality. Moreover, strict reliability constraints usually impose very low fault latencies and a high degree of fault detection for both permanent and transient faults. This article analyzes major problems related to testing complex telecommunication systems, with particular emphasis on their memory modules, often so critical from the reliability point of view. In particular, advanced BIST-based solutions are analyzed, and two significant industrial case studies presente

    Effect of a Polywell geometry on a CMOS Photodiode Array

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    The effect of a polywell geometry hybridized with a stacked gradient poly-homojunction architecture, on the response of a CMOs compatible photodiode array was simulated. Crosstalk and sensitivity improved compared to the polywell geometry alone, for both back and front illuminatio

    System-on-chip Computing and Interconnection Architectures for Telecommunications and Signal Processing

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    This dissertation proposes novel architectures and design techniques targeting SoC building blocks for telecommunications and signal processing applications. Hardware implementation of Low-Density Parity-Check decoders is approached at both the algorithmic and the architecture level. Low-Density Parity-Check codes are a promising coding scheme for future communication standards due to their outstanding error correction performance. This work proposes a methodology for analyzing effects of finite precision arithmetic on error correction performance and hardware complexity. The methodology is throughout employed for co-designing the decoder. First, a low-complexity check node based on the P-output decoding principle is designed and characterized on a CMOS standard-cells library. Results demonstrate implementation loss below 0.2 dB down to BER of 10^{-8} and a saving in complexity up to 59% with respect to other works in recent literature. High-throughput and low-latency issues are addressed with modified single-phase decoding schedules. A new "memory-aware" schedule is proposed requiring down to 20% of memory with respect to the traditional two-phase flooding decoding. Additionally, throughput is doubled and logic complexity reduced of 12%. These advantages are traded-off with error correction performance, thus making the solution attractive only for long codes, as those adopted in the DVB-S2 standard. The "layered decoding" principle is extended to those codes not specifically conceived for this technique. Proposed architectures exhibit complexity savings in the order of 40% for both area and power consumption figures, while implementation loss is smaller than 0.05 dB. Most modern communication standards employ Orthogonal Frequency Division Multiplexing as part of their physical layer. The core of OFDM is the Fast Fourier Transform and its inverse in charge of symbols (de)modulation. Requirements on throughput and energy efficiency call for FFT hardware implementation, while ubiquity of FFT suggests the design of parametric, re-configurable and re-usable IP hardware macrocells. In this context, this thesis describes an FFT/IFFT core compiler particularly suited for implementation of OFDM communication systems. The tool employs an accuracy-driven configuration engine which automatically profiles the internal arithmetic and generates a core with minimum operands bit-width and thus minimum circuit complexity. The engine performs a closed-loop optimization over three different internal arithmetic models (fixed-point, block floating-point and convergent block floating-point) using the numerical accuracy budget given by the user as a reference point. The flexibility and re-usability of the proposed macrocell are illustrated through several case studies which encompass all current state-of-the-art OFDM communications standards (WLAN, WMAN, xDSL, DVB-T/H, DAB and UWB). Implementations results are presented for two deep sub-micron standard-cells libraries (65 and 90 nm) and commercially available FPGA devices. Compared with other FFT core compilers, the proposed environment produces macrocells with lower circuit complexity and same system level performance (throughput, transform size and numerical accuracy). The final part of this dissertation focuses on the Network-on-Chip design paradigm whose goal is building scalable communication infrastructures connecting hundreds of core. A low-complexity link architecture for mesochronous on-chip communication is discussed. The link enables skew constraint looseness in the clock tree synthesis, frequency speed-up, power consumption reduction and faster back-end turnarounds. The proposed architecture reaches a maximum clock frequency of 1 GHz on 65 nm low-leakage CMOS standard-cells library. In a complex test case with a full-blown NoC infrastructure, the link overhead is only 3% of chip area and 0.5% of leakage power consumption. Finally, a new methodology, named metacoding, is proposed. Metacoding generates correct-by-construction technology independent RTL codebases for NoC building blocks. The RTL coding phase is abstracted and modeled with an Object Oriented framework, integrated within a commercial tool for IP packaging (Synopsys CoreTools suite). Compared with traditional coding styles based on pre-processor directives, metacoding produces 65% smaller codebases and reduces the configurations to verify up to three orders of magnitude

    An Open Core System-on-chip Platform

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    The design cycle required to produce a System-on-Chip can be reduced by providing pre-designed built-in features and functions such as configurable I/O, power and ground grids, block RAMs, timing generators and other embedded intellectual property (IP) blocks. A basic combination of such built-in features is known as a platform. The major objective of this thesis was to design and implement one such System-on-Chip platform using open IP cores targeting the TSMC-0.18 CMOS process. The integrated System-on-Chip platform, which contains approximately four million transistors, was synthesized using Synopsys - Design Compiler and placed and routed using Cadence - First Encounter, Silicon Ensemble. Design verification was done at the pre-synthesis, post-synthesis and post-layout levels using Mentor Graphics - ModelSim. Final layout was imported into Cadence - Virtuoso to perform design rule check. A tutorial was written to enable others to create derivative designs of this platform quickly

    Microelectronic engineering education for emerging frontiers

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    With the support provided by the National Science Foundation and RIT Provost’s vision for providing flexible curricula, the department of Microelectronic Engineering has instituted new and enhanced program initiatives – (1) offering a semiconductor processing minor for other science and engineering programs promoting access to state-of-the art semiconductor fabrication facilities to students from other programs; (2) crafting a five course elective sequence within the existing curriculum by eliminating legacy material and course consolidation; (3) developing a concentration program in nanotechnology and MEMS; (4) outreach programs for targeting larger and diverse participation in preparing workforce for the nation’s future high tech industry; (5) enhance student learning through co-op and service. The mission is to generate multi faceted work force for the future semiconductor technologies and emerging frontiers spinning off from microelectronics, while simultaneously promoting enrollment particularly from women and minority students
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