Communication channel analysis and real time compressed sensing for high density neural recording devices

Next generation neural recording and Brain- Machine Interface (BMI) devices call for high density or distributed systems with more than 1000 recording sites. As the recording site density grows, the device generates data on the scale of several hundred megabits per second (Mbps). Transmitting such large amounts of data induces significant power consumption and heat dissipation for the implanted electronics. Facing these constraints, efficient on-chip compression techniques become essential to the reduction of implanted systems power consumption. This paper analyzes the communication channel constraints for high density neural recording devices. This paper then quantifies the improvement on communication channel using efficient on-chip compression methods. Finally, This paper describes a Compressed Sensing (CS) based system that can reduce the data rate by > 10x times while using power on the order of a few hundred nW per recording channel

Configurable 3D-integrated focal-plane sensor-processor array architecture

A mixed-signal Cellular Visual Microprocessor architecture with digital processors is described. An ASIC implementation is also demonstrated. The architecture is composed of a regular sensor readout circuit array, prepared for 3D face-to-face type integration, and one or several cascaded array of mainly identical (SIMD) processing elements. The individual array elements derived from the same general HDL description and could be of different in size, aspect ratio, and computing resources

Time-encoding analog-to-digital converters : bridging the analog gap to advanced digital CMOS? Part 2: architectures and circuits

The scaling of CMOS technology deep into the nanometer range has created challenges for the design of highperformance analog ICs: they remain large in area and power consumption in spite of process scaling. Analog circuits based on time encoding [1], [2], where the signal information is encoded in the waveform transitions instead of its amplitude, have been developed to overcome these issues. While part one of this overview article [3] presented the basic principles of time encoding, this follow-up article describes and compares the main time-encoding architectures for analog-to-digital converters (ADCs) and discusses the corresponding design challenges of the circuit blocks. The focus is on structures that avoid, as much as possible, the use of traditional analog blocks like operational amplifiers (opamps) or comparators but instead use digital circuitry, ring oscillators, flip-flops, counters, an so on. Our overview of the state of the art will show that these circuits can achieve excellent performance. The obvious benefit of this highly digital approach to realizing analog functionality is that the resulting circuits are small in area and more compatible with CMOS process scaling. The approach also allows for the easy integration of these analog functions in systems on chip operating at "digital" supply voltages as low as 1V and lower. A large part of the design process can also be embedded in a standard digital synthesis flow

Advances in Solid State Circuit Technologies

This book brings together contributions from experts in the fields to describe the current status of important topics in solid-state circuit technologies. It consists of 20 chapters which are grouped under the following categories: general information, circuits and devices, materials, and characterization techniques. These chapters have been written by renowned experts in the respective fields making this book valuable to the integrated circuits and materials science communities. It is intended for a diverse readership including electrical engineers and material scientists in the industry and academic institutions. Readers will be able to familiarize themselves with the latest technologies in the various fields

VLSI Design

This book provides some recent advances in design nanometer VLSI chips. The selected topics try to present some open problems and challenges with important topics ranging from design tools, new post-silicon devices, GPU-based parallel computing, emerging 3D integration, and antenna design. The book consists of two parts, with chapters such as: VLSI design for multi-sensor smart systems on a chip, Three-dimensional integrated circuits design for thousand-core processors, Parallel symbolic analysis of large analog circuits on GPU platforms, Algorithms for CAD tools VLSI design, A multilevel memetic algorithm for large SAT-encoded problems, etc