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Configurable 3D-integrated focal-plane sensor-processor array architecture

Abstract

A mixed-signal Cellular Visual Microprocessor architecture with digital processors is described. An ASIC implementation is also demonstrated. The architecture is composed of a regular sensor readout circuit array, prepared for 3D face-to-face type integration, and one or several cascaded array of mainly identical (SIMD) processing elements. The individual array elements derived from the same general HDL description and could be of different in size, aspect ratio, and computing resources

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