Sustainable Fault-handling Of Reconfigurable Logic Using Throughput-driven Assessment

A sustainable Evolvable Hardware (EH) system is developed for SRAM-based reconfigurable Field Programmable Gate Arrays (FPGAs) using outlier detection and group testing-based assessment principles. The fault diagnosis methods presented herein leverage throughput-driven, relative fitness assessment to maintain resource viability autonomously. Group testing-based techniques are developed for adaptive input-driven fault isolation in FPGAs, without the need for exhaustive testing or coding-based evaluation. The techniques maintain the device operational, and when possible generate validated outputs throughout the repair process. Adaptive fault isolation methods based on discrepancy-enabled pair-wise comparisons are developed. By observing the discrepancy characteristics of multiple Concurrent Error Detection (CED) configurations, a method for robust detection of faults is developed based on pairwise parallel evaluation using Discrepancy Mirror logic. The results from the analytical FPGA model are demonstrated via a self-healing, self-organizing evolvable hardware system. Reconfigurability of the SRAM-based FPGA is leveraged to identify logic resource faults which are successively excluded by group testing using alternate device configurations. This simplifies the system architect\u27s role to definition of functionality using a high-level Hardware Description Language (HDL) and system-level performance versus availability operating point. System availability, throughput, and mean time to isolate faults are monitored and maintained using an Observer-Controller model. Results are demonstrated using a Data Encryption Standard (DES) core that occupies approximately 305 FPGA slices on a Xilinx Virtex-II Pro FPGA. With a single simulated stuck-at-fault, the system identifies a completely validated replacement configuration within three to five positive tests. The approach demonstrates a readily-implemented yet robust organic hardware application framework featuring a high degree of autonomous self-control

FACTPLA: Functional analysis and the complexity of testing programmable logic array

This thesis was submitted for the degree of Doctor of Philosophy and awarded by Brunel University.A computer aided method for analyzing the testability of Programmable Logic Arrays (PLAs) is described. The method, which is based on a functional verification approach, estimates the complexity of testing a PLA according to the amount of single undetectable faults in the array structure. An analytic program (FACTPLA) is developed to predict the above complexity without analyzing the topology of the array as such. Thus, the method is technology invariant and depends only on the functionality of the PLA. The program quantitatively evaluates the effects of undetectable faults and produces some testability measures to manifest these effects. A testability profile for different PLA examples is provided and a number of suggestions for further research to establish definitely the usefulness of some functional properties for testing were made

Using Fine Grain Approaches for highly reliable Design of FPGA-based Systems in Space

Nowadays using SRAM based FPGAs in space missions is increasingly considered due to their flexibility and reprogrammability. A challenge is the devices sensitivity to radiation effects that increased with modern architectures due to smaller CMOS structures. This work proposes fault tolerance methodologies, that are based on a fine grain view to modern reconfigurable architectures. The focus is on SEU mitigation challenges in SRAM based FPGAs which can result in crucial situations

Design Disjunction for Resilient Reconfigurable Hardware

Contemporary reconfigurable hardware devices have the capability to achieve high performance, power efficiency, and adaptability required to meet a wide range of design goals. With scaling challenges facing current complementary metal oxide semiconductor (CMOS), new concepts and methodologies supporting efficient adaptation to handle reliability issues are becoming increasingly prominent. Reconfigurable hardware and their ability to realize self-organization features are expected to play a key role in designing future dependable hardware architectures. However, the exponential increase in density and complexity of current commercial SRAM-based field-programmable gate arrays (FPGAs) has escalated the overhead associated with dynamic runtime design adaptation. Traditionally, static modular redundancy techniques are considered to surmount this limitation; however, they can incur substantial overheads in both area and power requirements. To achieve a better trade-off among performance, area, power, and reliability, this research proposes design-time approaches that enable fine selection of redundancy level based on target reliability goals and autonomous adaptation to runtime demands. To achieve this goal, three studies were conducted: First, a graph and set theoretic approach, named Hypergraph-Cover Diversity (HCD), is introduced as a preemptive design technique to shift the dominant costs of resiliency to design-time. In particular, union-free hypergraphs are exploited to partition the reconfigurable resources pool into highly separable subsets of resources, each of which can be utilized by the same synthesized application netlist. The diverse implementations provide reconfiguration-based resilience throughout the system lifetime while avoiding the significant overheads associated with runtime placement and routing phases. Evaluation on a Motion-JPEG image compression core using a Xilinx 7-series-based FPGA hardware platform has demonstrated the potential of the proposed FT method to achieve 37.5% area saving and up to 66% reduction in power consumption compared to the frequently-used TMR scheme while providing superior fault tolerance. Second, Design Disjunction based on non-adaptive group testing is developed to realize a low-overhead fault tolerant system capable of handling self-testing and self-recovery using runtime partial reconfiguration. Reconfiguration is guided by resource grouping procedures which employ non-linear measurements given by the constructive property of f-disjunctness to extend runtime resilience to a large fault space and realize a favorable range of tradeoffs. Disjunct designs are created using the mosaic convergence algorithm developed such that at least one configuration in the library evades any occurrence of up to d resource faults, where d is lower-bounded by f. Experimental results for a set of MCNC and ISCAS benchmarks have demonstrated f-diagnosability at the individual slice level with average isolation resolution of 96.4% (94.4%) for f=1 (f=2) while incurring an average critical path delay impact of only 1.49% and area cost roughly comparable to conventional 2-MR approaches. Finally, the proposed Design Disjunction method is evaluated as a design-time method to improve timing yield in the presence of large random within-die (WID) process variations for application with a moderately high production capacity

Toward Biologically-Inspired Self-Healing, Resilient Architectures for Digital Instrumentation and Control Systems and Embedded Devices

Digital Instrumentation and Control (I&C) systems in safety-related applications of next generation industrial automation systems require high levels of resilience against different fault classes. One of the more essential concepts for achieving this goal is the notion of resilient and survivable digital I&C systems. In recent years, self-healing concepts based on biological physiology have received attention for the design of robust digital systems. However, many of these approaches have not been architected from the outset with safety in mind, nor have they been targeted for the automation community where a significant need exists. This dissertation presents a new self-healing digital I&C architecture called BioSymPLe, inspired from the way nature responds, defends and heals: the stem cells in the immune system of living organisms, the life cycle of the living cell, and the pathway from Deoxyribonucleic acid (DNA) to protein. The BioSymPLe architecture is integrating biological concepts, fault tolerance techniques, and operational schematics for the international standard IEC 61131-3 to facilitate adoption in the automation industry. BioSymPLe is organized into three hierarchical levels: the local function migration layer from the top side, the critical service layer in the middle, and the global function migration layer from the bottom side. The local layer is used to monitor the correct execution of functions at the cellular level and to activate healing mechanisms at the critical service level. The critical layer is allocating a group of functional B cells which represent the building block that executes the intended functionality of critical application based on the expression for DNA genetic codes stored inside each cell. The global layer uses a concept of embryonic stem cells by differentiating these type of cells to repair the faulty T cells and supervising all repair mechanisms. Finally, two industrial applications have been mapped on the proposed architecture, which are capable of tolerating a significant number of faults (transient, permanent, and hardware common cause failures CCFs) that can stem from environmental disturbances and we believe the nexus of its concepts can positively impact the next generation of critical systems in the automation industry

Real Time Fault Detection and Diagnostics Using FPGA-Based Architecture

Errors within circuits caused by radiation continue to be an important concern to developers. A new methodology of real time fault detection and diagnostics utilizing FPGA based architectures while under radiation were investigated in this research. The contributions of this research are focused on three areas; a full test platform to evaluate a circuit while under irradiation, an algorithm to detect and diagnose fault locations within a circuit, and finally to characterize Triple Design Triple Modular Redundancy (TDTMR), a new form of TMR. Five different test setups, injected fault test, gamma radiation test, thermal radiation test, optical laser test, and optical flash test, were used to assess the effectiveness of these three research goals. The testing platform was constructed with two FPGA boards, the Device Under Test (DUT) and the controller board, to generate and evaluate specific vector sets sent to the DUT. The testing platform combines a myriad of testing and measuring equipment and work hours onto one small reprogrammable and reusable FPGA. This device was able to be used in multiple test setups. The controlling logic can be interchanged to test multiple circuit designs under various forms of radiation. The detection and diagnostic algorithm was designed to determine fault locations in real time. The algorithm used for diagnosing the fault location uses inverse deductive elimination. By using test generation tools, fault lists were developed. The fault lists were used to narrow \ the possible fault locations within the circuit. The algorithm is able to detect single stuck at faults based on these lists. The algorithm can also detect multiple output errors but not able to diagnose multiple stuck at faults in real time

Fault-tolerant fpga for mission-critical applications.

One of the devices that play a great role in electronic circuits design, specifically safety-critical design applications, is Field programmable Gate Arrays (FPGAs). This is because of its high performance, re-configurability and low development cost. FPGAs are used in many applications such as data processing, networks, automotive, space and industrial applications. Negative impacts on the reliability of such applications result from moving to smaller feature sizes in the latest FPGA architectures. This increases the need for fault-tolerant techniques to improve reliability and extend system lifetime of FPGA-based applications. In this thesis, two fault-tolerant techniques for FPGA-based applications are proposed with a built-in fault detection region. A low cost fault detection scheme is proposed for detecting faults using the fault detection region used in both schemes. The fault detection scheme primarily detects open faults in the programmable interconnect resources in the FPGAs. In addition, Stuck-At faults and Single Event Upsets (SEUs) fault can be detected. For fault recovery, each scheme has its own fault recovery approach. The first approach uses a spare module and a 2-to-1 multiplexer to recover from any fault detected. On the other hand, the second approach recovers from any fault detected using the property of Partial Reconfiguration (PR) in the FPGAs. It relies on identifying a Partially Reconfigurable block (P_b) in the FPGA that is used in the recovery process after the first faulty module is identified in the system. This technique uses only one location to recover from faults in any of the FPGA’s modules and the FPGA interconnects. Simulation results show that both techniques can detect and recover from open faults. In addition, Stuck-At faults and Single Event Upsets (SEUs) fault can also be detected. Finally, both techniques require low area overhead

Systematic Model-based Design Assurance and Property-based Fault Injection for Safety Critical Digital Systems

With advances in sensing, wireless communications, computing, control, and automation technologies, we are witnessing the rapid uptake of Cyber-Physical Systems across many applications including connected vehicles, healthcare, energy, manufacturing, smart homes etc. Many of these applications are safety-critical in nature and they depend on the correct and safe execution of software and hardware that are intrinsically subject to faults. These faults can be design faults (Software Faults, Specification faults, etc.) or physically occurring faults (hardware failures, Single-event-upsets, etc.). Both types of faults must be addressed during the design and development of these critical systems. Several safety-critical industries have widely adopted Model-Based Engineering paradigms to manage the design assurance processes of these complex CPSs. This thesis studies the application of IEC 61508 compliant model-based design assurance methodology on a representative safety-critical digital architecture targeted for the Nuclear power generation facilities. The study presents detailed experiences and results to demonstrate the benefits of Model testing in finding design flaws and its relevance to subsequent verification steps in the workflow. Additionally, to study the impact of physical faults on the digital architecture we develop a novel property-based fault injection method that overcomes few deficiencies of traditional fault injection methods. The model-based fault injection approach presented here guarantees high efficiency and near-exhaustive input/state/fault space coverage, by utilizing formal model checking principles to identify fault activation conditions and prove the fault tolerance features. The fault injection framework facilitates automated integration of fault saboteurs throughout the model to enable exhaustive fault location coverage in the model

Infrastructures and Algorithms for Testable and Dependable Systems-on-a-Chip

Every new node of semiconductor technologies provides further miniaturization and higher performances, increasing the number of advanced functions that electronic products can offer. Silicon area is now so cheap that industries can integrate in a single chip usually referred to as System-on-Chip (SoC), all the components and functions that historically were placed on a hardware board. Although adding such advanced functionality can benefit users, the manufacturing process is becoming finer and denser, making chips more susceptible to defects. Today’s very deep-submicron semiconductor technologies (0.13 micron and below) have reached susceptibility levels that put conventional semiconductor manufacturing at an impasse. Being able to rapidly develop, manufacture, test, diagnose and verify such complex new chips and products is crucial for the continued success of our economy at-large. This trend is expected to continue at least for the next ten years making possible the design and production of 100 million transistor chips. To speed up the research, the National Technology Roadmap for Semiconductors identified in 1997 a number of major hurdles to be overcome. Some of these hurdles are related to test and dependability. Test is one of the most critical tasks in the semiconductor production process where Integrated Circuits (ICs) are tested several times starting from the wafer probing to the end of production test. Test is not only necessary to assure fault free devices but it also plays a key role in analyzing defects in the manufacturing process. This last point has high relevance since increasing time-to-market pressure on semiconductor fabrication often forces foundries to start volume production on a given semiconductor technology node before reaching the defect densities, and hence yield levels, traditionally obtained at that stage. The feedback derived from test is the only way to analyze and isolate many of the defects in today’s processes and to increase process’s yield. With the increasing need of high quality electronic products, at each new physical assembly level, such as board and system assembly, test is used for debugging, diagnosing and repairing the sub-assemblies in their new environment. Similarly, the increasing reliability, availability and serviceability requirements, lead the users of high-end products performing periodic tests in the field throughout the full life cycle. To allow advancements in each one of the above scaling trends, fundamental changes are expected to emerge in different Integrated Circuits (ICs) realization disciplines such as IC design, packaging and silicon process. These changes have a direct impact on test methods, tools and equipment. Conventional test equipment and methodologies will be inadequate to assure high quality levels. On chip specialized block dedicated to test, usually referred to as Infrastructure IP (Intellectual Property), need to be developed and included in the new complex designs to assure that new chips will be adequately tested, diagnosed, measured, debugged and even sometimes repaired. In this thesis, some of the scaling trends in designing new complex SoCs will be analyzed one at a time, observing their implications on test and identifying the key hurdles/challenges to be addressed. The goal of the remaining of the thesis is the presentation of possible solutions. It is not sufficient to address just one of the challenges; all must be met at the same time to fulfill the market requirements