Column-Parallel Correlated Multiple Sampling Circuits for CMOS Image Sensors and Their Noise Reduction Effects

For low-noise complementary metal-oxide-semiconductor (CMOS) image sensors, the reduction of pixel source follower noises is becoming very important. Column-parallel high-gain readout circuits are useful for low-noise CMOS image sensors. This paper presents column-parallel high-gain signal readout circuits, correlated multiple sampling (CMS) circuits and their noise reduction effects. In the CMS, the gain of the noise cancelling is controlled by the number of samplings. It has a similar effect to that of an amplified CDS for the thermal noise but is a little more effective for 1/f and RTS noises. Two types of the CMS with simple integration and folding integration are proposed. In the folding integration, the output signal swing is suppressed by a negative feedback using a comparator and one-bit D-to-A converter. The CMS circuit using the folding integration technique allows to realize a very low-noise level while maintaining a wide dynamic range. The noise reduction effects of their circuits have been investigated with a noise analysis and an implementation of a 1Mpixel pinned photodiode CMOS image sensor. Using 16 samplings, dynamic range of 59.4 dB and noise level of 1.9 e− for the simple integration CMS and 75 dB and 2.2 e− for the folding integration CMS, respectively, are obtained

Test Procedures for Synchronized Oscillators Network CMOS VLSI Chip

The paper presents test procedures designed for application-specific integrated circuit (ASIC) CMOS VLSI chip that implements a synchronized oscillator neural network with a matrix size of 32×32 for object detecting in binary images. Networks of synchronized oscillators are recently developed tool for image segmentation and analysis. This paper briefly introduces synchronized oscillators network. Basic chip analog building blocks with their test procedures and measurements results are presented. In order to do measurements, special basic building blocks test structures have been implemented in the chip. It let compare Spectre simulations results to measurements results. Moreover, basic chip analog building blocks measurements give precious information about their imperfections caused by MOS transistor mismatch. This information is very usable during design and improvement of a special setup for chip functional tests. Improvement of the setup is a digitally assisted analog technique. It is an idea of oscillators tuning procedure. Such setup, oscillators tuning procedure and segmentation of a sample binary image are presented

A correlated multiple sampling passive switched capacitor circuit for low light CMOS image sensors

After a brief review of the principle of correlated multiple sampling (CMS) and its implementation techniques in CIS readout chains, a simple CMS passive circuit that (i) requires no additional active circuitry, (ii) has no impact on the output dynamic range and (iii) does not need multiple analog-to-digital conversions (faster) is presented. The proposed circuit uses n switched capacitors to perform a CMS on 2n samples. It is validated using transient noise simulations on a CIS readout chain based on a 4T pixel, designed with a 180nm CIS process. For a line readout time of 35 μs and a column amplifier bandwidth of 256 kHz, the proposed circuit reduces the input-referred noise as expected by an ideal CMS

Implementation of a Synchronized Oscillator Circuit for Fast Sensing and Labeling of Image Objects

We present an application-specific integrated circuit (ASIC) CMOS chip that implements a synchronized oscillator cellular neural network with a matrix size of 32 × 32 for object sensing and labeling in binary images. Networks of synchronized oscillators are a recently developed tool for image segmentation and analysis. Its parallel network operation is based on a “temporary correlation” theory that attempts to describe scene recognition as if performed by the human brain. The synchronized oscillations of neuron groups attract a person’s attention if he or she is focused on a coherent stimulus (image object). For more than one perceived stimulus, these synchronized patterns switch in time between different neuron groups, thus forming temporal maps that code several features of the analyzed scene. In this paper, a new oscillator circuit based on a mathematical model is proposed, and the network architecture and chip functional blocks are presented and discussed. The proposed chip is implemented in AMIS 0.35 μm C035M-D 5M/1P technology. An application of the proposed network chip for the segmentation of insulin-producing pancreatic islets in magnetic resonance liver images is presented

Recent trends in low-frequency noise reduction techniques for integrated circuits

This paper presents the two main circuit techniques, namely autozeroing (AZ) and chopper stabilization (CS), that are used to reduce the 1/f noise and offset in amplifiers typically used in sensor electronics interfaces. After recalling their main properties, it looks into recent trends in circuit noise reduction techniques. First, the correlated multiple sampling (CMS) technique is presented as a generalization of AZ and correlated double sampling (CDS). Introduced in CMOS image sensors (CIS), it combines noise averaging and canceling and allows to further reduce the 1/f noise, but, like AZ, it is also ultimately limited by the aliasing of the broadband white noise. Another technique combining noise canceling and CS in a transimpedance amplifier (TIA) for bio-sensors is presented. It allows to maintain a low input impedance required by the TIA, while reducing the noise of the main transimpedance stage. CS is then used to cancel the noise of the following stages

Noise Reduction Techniques and Scaling Effects towards Photon Counting CMOS Image Sensors

This paper presents an overview of the read noise in CMOS image sensors (CISs) based on four-transistors (4T) pixels, column-level amplification and correlated multiple sampling. Starting from the input-referred noise analytical formula, process level optimizations, device choices and circuit techniques at the pixel and column level of the readout chain are derived and discussed. The noise reduction techniques that can be implemented at the column and pixel level are verified by transient noise simulations, measurement and results from recently-published low noise CIS. We show how recently-reported process refinement, leading to the reduction of the sense node capacitance, can be combined with an optimal in-pixel source follower design to reach a sub-0.3 e(rms)(-) read noise at room temperature. This paper also discusses the impact of technology scaling on the CIS read noise. It shows how designers can take advantage of scaling and how the Metal-Oxide-Semiconductor (MOS) transistor gate leakage tunneling current appears as a challenging limitation. For this purpose, both simulation results of the gate leakage current and 1/f noise data reported from different foundries and technology nodes are used

The Quanta Image Sensor: Every Photon Counts

The Quanta Image Sensor (QIS) was conceived when contemplating shrinking pixel sizes and storage capacities, and the steady increase in digital processing power. In the single-bit QIS, the output of each field is a binary bit plane, where each bit represents the presence or absence of at least one photoelectron in a photodetector. A series of bit planes is generated through high-speed readout, and a kernel or “cubicle” of bits (x, y, t) is used to create a single output image pixel. The size of the cubicle can be adjusted post-acquisition to optimize image quality. The specialized sub-diffraction-limit photodetectors in the QIS are referred to as “jots” and a QIS may have a gigajot or more, read out at 1000 fps, for a data rate exceeding 1 Tb/s. Basically, we are trying to count photons as they arrive at the sensor. This paper reviews the QIS concept and its imaging characteristics. Recent progress towards realizing the QIS for commercial and scientific purposes is discussed. This includes implementation of a pump-gate jot device in a 65 nm CIS BSI process yielding read noise as low as 0.22 e− r.m.s. and conversion gain as high as 420 µV/e−, power efficient readout electronics, currently as low as 0.4 pJ/b in the same process, creating high dynamic range images from jot data, and understanding the imaging characteristics of single-bit and multi-bit QIS devices. The QIS represents a possible major paradigm shift in image capture

Ultra-low noise, high-frame rate readout design for a 3D-stacked CMOS image sensor

Due to the switch from CCD to CMOS technology, CMOS based image sensors have become smaller, cheaper, faster, and have recently outclassed CCDs in terms of image quality. Apart from the extensive set of applications requiring image sensors, the next technological breakthrough in imaging would be to consolidate and completely shift the conventional CMOS image sensor technology to the 3D-stacked technology. Stacking is recent and an innovative technology in the imaging field, allowing multiple silicon tiers with different functions to be stacked on top of each other. The technology allows for an extreme parallelism of the pixel readout circuitry. Furthermore, the readout is placed underneath the pixel array on a 3D-stacked image sensor, and the parallelism of the readout can remain constant at any spatial resolution of the sensors, allowing extreme low noise and a high-frame rate (design) at virtually any sensor array resolution. The objective of this work is the design of ultra-low noise readout circuits meant for 3D-stacked image sensors, structured with parallel readout circuitries. The readout circuit’s key requirements are low noise, speed, low-area (for higher parallelism), and low power. A CMOS imaging review is presented through a short historical background, followed by the description of the motivation, the research goals, and the work contributions. The fundamentals of CMOS image sensors are addressed, as a part of highlighting the typical image sensor features, the essential building blocks, types of operation, as well as their physical characteristics and their evaluation metrics. Following up on this, the document pays attention to the readout circuit’s noise theory and the column converters theory, to identify possible pitfalls to obtain sub-electron noise imagers. Lastly, the fabricated test CIS device performances are reported along with conjectures and conclusions, ending this thesis with the 3D-stacked subject issues and the future work. A part of the developed research work is located in the Appendices.Devido à mudança da tecnologia CCD para CMOS, os sensores de imagem em CMOS tornam se mais pequenos, mais baratos, mais rápidos, e mais recentemente, ultrapassaram os sensores CCD no que respeita à qualidade de imagem. Para além do vasto conjunto de aplicações que requerem sensores de imagem, o próximo salto tecnológico no ramo dos sensores de imagem é o de mudar completamente da tecnologia de sensores de imagem CMOS convencional para a tecnologia “3D-stacked”. O empilhamento de chips é relativamente recente e é uma tecnologia inovadora no campo dos sensores de imagem, permitindo vários planos de silício com diferentes funções poderem ser empilhados uns sobre os outros. Esta tecnologia permite portanto, um paralelismo extremo na leitura dos sinais vindos da matriz de píxeis. Além disso, num sensor de imagem de planos de silício empilhados, os circuitos de leitura estão posicionados debaixo da matriz de píxeis, sendo que dessa forma, o paralelismo pode manter-se constante para qualquer resolução espacial, permitindo assim atingir um extremo baixo ruído e um alto debito de imagens, virtualmente para qualquer resolução desejada. O objetivo deste trabalho é o de desenhar circuitos de leitura de coluna de muito baixo ruído, planeados para serem empregues em sensores de imagem “3D-stacked” com estruturas altamente paralelizadas. Os requisitos chave para os circuitos de leitura são de baixo ruído, rapidez e pouca área utilizada, de forma a obter-se o melhor rácio. Uma breve revisão histórica dos sensores de imagem CMOS é apresentada, seguida da motivação, dos objetivos e das contribuições feitas. Os fundamentos dos sensores de imagem CMOS são também abordados para expor as suas características, os blocos essenciais, os tipos de operação, assim como as suas características físicas e suas métricas de avaliação. No seguimento disto, especial atenção é dada à teoria subjacente ao ruído inerente dos circuitos de leitura e dos conversores de coluna, servindo para identificar os possíveis aspetos que dificultem atingir a tão desejada performance de muito baixo ruído. Por fim, os resultados experimentais do sensor desenvolvido são apresentados junto com possíveis conjeturas e respetivas conclusões, terminando o documento com o assunto de empilhamento vertical de camadas de silício, junto com o possível trabalho futuro