FLASH MEMORY DEVICES WITH METAL FLOATING GATE/METAL NANOCRYSTALS AS THE CHARGE STORAGE LAYER: A STATUS REVIEW

Traditional flash memory devices consist of Polysilicon Control Gate (CG) – Oxide-Nitride-Oxide (ONO - Interpoly Dielectric) – Polysilicon Floating Gate (FG) – Silicon Oxide (Tunnel dielectric) – Substrate. The dielectrics have to be scaled down considerably in order to meet the escalating demand for lower write/erase voltages and higher density of cells. But as the floating gate dimensions are scaled down the charge stored in the floating gate leak out more easily via thin tunneling oxide below the floating gate which causes serious reliability issues and the whole amount of stored charge carrying information can be lost. The possible route to eliminate this problem is to use high-k based interpoly dielectric and to replace the polysilicon floating gate with a metal floating gate. At larger physical thickness, these materials have similar capacitance value hence avoiding tunneling effect.  Discrete nanocrystal memory has also been proposed to solve this problem. Due to its high operation speed, excellent scalability and higher reliability it has been shown as a promising candidate for future non-volatile memory applications. This review paper focuses on the recent efforts and research activities related to the fabrication and characterization of non-volatile memory device with metal floating gate/metal nanocrystals as the charge storage layer

MADX: Memristors-As-Drivers for Crossbar logic

Memristors have the potential to not only replace conventional memory, but also to open up new design possibilities because they store 1s and 0s as resistances rather than voltages. A memristor architecture that has attracted interest for its versatility and ease of integration with existing CMOS technologies is the crossbar array. In this paper, I modify the MAD scheme to create the MADX scheme for performing basic logic operations within a crossbar array. Then, I compare this scheme against two of the most well-known schemes, MAGIC and IMPLY. In the case study of a full-adder, both a one-bit and an 8-bit version, the MADX scheme achieves lower latency and substantially lower area requirements than both MAGIC and IMPLY. This is because it is more flexible about storing output values than either, does not destroy input values unlike IMPLY, and has more basic operations. In particular, it has XOR, which neither IMPLY nor MAGIC have and is useful for additionPlan II Honors Progra

Forensic Aspects of Various Flash Memory Devices

Flash memory devices provide high storage volume with low power consumption and faster read-write operations when compared to HDD. This makes FLASH memory devices to be considered as an efficient storage unit thus bringing huge demand for the usage of FLASH memory devices. One of the major problems faced by forensic investigators is extracting deleted data from flash memory devices, as some of the flash memory devices prevent extraction of deleted data using the standard forensic techniques. This paper focuses on exploring forensic opportunities for various flash-based memory devices. This is done by a thorough study of physics of flash memory, the development of flash transition layers, and the file systems that support these devices. It then conducts forensic experiments on various types of flash-based storage media and summarizes the results of each media. This paper also tries to explore various practices to be applied on flash storage media thus enabling them to retrieve deleted information with the use of standard forensic techniques

Intrinsic variability of nanoscale CMOS technology for logic and memory.

The continuous downscaling of CMOS technology, the main engine of development of the semiconductor Industry, is limited by factors that become important for nanoscale device size, which undermine proper device operation completely offset gains from scaling. One of the main problems is device variability: nominally identical devices are different at the microscopic level due to fabrication tolerance and the intrinsic granularity of matter. For this reason, structures, devices and materials for the next technology nodes will be chosen for their robustness to process variability, in agreement with the ITRS (International Technology Roadmap for Semiconductors). Examining the dispersion of various physical and geometrical parameters and the effect these have on device performance becomes necessary. In this thesis, I focus on the study of the dispersion of the threshold voltage due to intrinsic variability in nanoscale CMOS technology for logic and for memory. In order to describe this, it is convenient to have an analytical model that allows, with the assistance of a small number of simulations, to calculate the standard deviation of the threshold voltage due to the various contributions

Flash-based security primitives: Evolution, challenges and future directions

Over the last two decades, hardware security has gained increasing attention in academia and industry. Flash memory has been given a spotlight in recent years, with the question of whether or not it can prove useful in a security role. Because of inherent process variation in the characteristics of flash memory modules, they can provide a unique fingerprint for a device and have thus been proposed as locations for hardware security primitives. These primitives include physical unclonable functions (PUFs), true random number generators (TRNGs), and integrated circuit (IC) counterfeit detection. In this paper, we evaluate the efficacy of flash memory-based security primitives and categorize them based on the process variations they exploit, as well as other features. We also compare and evaluate flash-based security primitives in order to identify drawbacks and essential design considerations. Finally, we describe new directions, challenges of research, and possible security vulnerabilities for flash-based security primitives that we believe would benefit from further exploration

Chip-off Success Rate Analysis Comparing Temperature and Chip Type

Throughout the digital forensic community, chip-off analysis provides examiners with a technique to obtain a physical acquisition from locked or damaged digital device. Thermal based chip-analysis relies upon the application of heat to remove the flash memory chip from the circuit board. Occasionally, a flash memory chip fails to successfully read despite following similar protocols as other flash memory chips. Previous research found the application of high temperatures increased the number of bit errors present in the flash memory chip. The purpose of this study is to analyze data collected from chip-off analyses to determine if a statistical difference exists between the removal temperatures of flash memory chips successfully and unsuccessfully read by using a t-test, F-test and an analysis of variance (ANOVA). The results from the statistical evaluation showed no statistical difference between the groups of memory chips successfully and unsuccessfully read, as well as, between older and newer types of Ball Grid Array (BGA) memory chips

Reconfigurable three-terminal logic devices using phase-change materials

Conventional solid-state and mass storage memories (such as SRAM, DRAM and the hard disk drive HDD) are facing many technological challenges to meet the ever-increasing demand for fast, low power and cheap data storage solutions. This is compounded by the current conventional computer architectures (such as the von Neumann architecture) with separate processing and storage functionalities and hence data transfer bottlenecks and increased silicon footprint. Beyond the von Neumann computer architecture, the combination of arithmetic-logic processing and (collocally) storage circuits provide a new and promising alternative for computer systems that overcome the many limitations of current technology. However, there are many technical challenges that face the implementation of universal blocks of both logic and memory functions using conventional silicon technology (transistor-transistor logic - TTL, and complementary metal oxide semiconductors - CMOS). Phase-change materials, such as Ge2Sb2Te5 (GST), provide a potential complement or replacement to these technologies to provide both processing and, collocally, storage capability. Existing research in phase-change memory technologies focused on two-terminal non-volatile devices for different memory and logic applications due to their ability to achieve logic-resistive switching in nanosecond time scale, their scalability down to few nanometer-scale cells, and low power requirements. To perform logic functionality, current two-terminal phase-change logic devices need to be connected in series or parallel circuits, and require sequential inputs to perform the required logic function (such as NAND and NOR). In this research programme, three-terminal (3T) non-volatile phase-change memories are proposed and investigated as potential alternative logic cells with simultaneous inputs as reconfigurable, non-volatile logic devices. A vertical 3T logic device structure is proposed in this work based on existing phase-change based memory cell architecture and original concept work by Ovshinsky. A comprehensive, multi-physics finite-element model of the vertical 3T device was constructed in Comsol Multiphysics. This model solves Laplace's equation for the electric potential due to the application of voltage sources. The calculated electric potential and fields provide the Joule heating source in the device, which is used to compute the temperature distribution through solution of the heat diffusion equation, which is necessary to activate the thermally-driven phase transition process. The physically realistic and computationally efficient nucleation- growth model was numerically implemented to model the phase change and resistance change in the Ge2Sb2Te5 (GST) phase-change material in the device, which is combined with the finite- element model using the Matlab programming interface. The changes in electrical and thermal conductivities in the GST region are taken into account following the thermally activated phase transformations between the amorphous-crystalline states using effective medium theory. To determine the appropriate voltage and temperature conditions for the SET and RESET operations, and to optimise the materials and thicknesses of the thermal and heating layers in the device, comprehensive steady-state parametric simulations were carried out using the finite-element multi-physics model. Simulations of transient cycles of writing (SET) and erasing (RESET) processes using appropriate voltage pulses were then carried out on the designed vertical 3T device to study the phase transformations for practical reconfigurable logic operations. The simulations indicated excellent resistance contrast between the logic 1 and 0 states, and successfully demonstrated the feasibility of programming the logic functions of NAND and NOR gates using this 3T configuration