30 research outputs found

    Electrical model of an NMOS body biased structure in triple-well technology under photoelectric laser stimulation

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    International audience— This study is driven by the need to optimize failure analysis methodologies based on laser/silicon interactions with an integrated circuit using a triple-well process. It is therefore mandatory to understand the behavior of elementary devices to laser illumination, in order to model and predict the behavior of more complex circuits. This paper presents measurements of the photoelectric currents induced by a pulsed-laser on an NMOS transistor in triple-well Psubstrate/DeepNwell/Pwell structure dedicated to low power body biasing techniques. This evaluation compares the triple-well structure to a classical Psubstrate-only structure of an NMOS transistor. It reveals the possible activation change of the bipolar transistors. Based on these experimental measurements, an electrical model is proposed that makes it possible to simulate the effects induced by photoelectric laser stimulation

    Laser Fault Injection into SRAM cells: Picosecond versus Nanosecond pulses

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    International audience—Laser fault injection into SRAM cells is a widely used technique to perform fault attacks. In previous works, Roscian and Sarafianos studied the relations between the layout of the cell, its different laser-sensitive areas and their associated fault model using 50 ns duration laser pulses. In this paper, we report similar experiments carried out using shorter laser pulses (30 ps duration instead of 50 ns). Laser-sensitive areas that did not appear at 50 ns were observed. Additionally, these experiments confirmed the validity of the bit-set/bit-reset fault model over the bit-flip one. We also propose an upgrade of the simulation model they used to take into account laser pulses in the picosecond range. Finally, we performed additional laser fault injection experiments on the RAM memory of a microcontroller to validate the previous results

    Simulation and Experimental Demonstration of the Importance of IR-Drops During Laser Fault-Injection

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    International audienceLaser fault injections induce transient faults into ICs by locally generating transient currents that temporarily flip the outputs of the illuminated gates. Laser fault injection can be anticipated or studied by using simulation tools at different abstraction levels: physical, electrical or logical. At the electrical level, the classical laser-fault injection model is based on the addition of current sources to the various sensitive nodes of CMOS transistors. However, this model does not take into account the large transient current components also induced between the VDD and GND of ICs designed with advanced CMOS technologies. These short-circuit currents provoke a significant IR-drop that contribute to the fault injection process. This paper describes our research on the assessment of this contribution. It shows through simulation and experiments that during laser fault injection campaigns, laser-induced IR-drop is always present when considering circuits designed with deep submicron technologies. It introduces an enhanced electrical fault model taking the laser-induced IR-drop into account. It also proposes a methodology that allows the use of the model to simulate laser-induced faults at the electrical level in large-scale circuits. On the basis of further simulations and experimental results, we found that, depending on the laser pulse characteristics, the number of injected faults may be underestimated by a factor of up to 2.4 if the laser-induced IR-drop is ignored. This could lead to incorrect estimations of the fault injection threshold, which is especially relevant to the design of countermeasure techniques for secure integrated systems

    Nonlinear microscopy for failure analysis of CMOS integrated circuits in the vectorial focusing regime

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    This thesis focuses on the development of techniques for enhancing the spatial resolution and localisation precision in the sub-surface microscopy for failure analysis in semiconductor integrated circuits (ICs). Highest spatial resolutions are obtained by implementing solid immersion lenses (SIL), which provide unsurpassed numerical aperture (NA) for sub-surface microscopy. These high NA conditions mean that scalar diffraction theory is no longer valid and a vectorial focusing description should be applied to accurately describe the focal plane electric field distribution. Vectorial theory predicts that under high NA conditions a linearly polarised (LP) light focuses to a spot that is extended along the electric field vector, but radially polarised (RP) light is predicted to form a circular spot whose diameter equals the narrower dimension obtained with linear polarisation. By implementing a novel liquid-crystal (LC) radial polarisation converter (RPC) this effect was studied for both two-photon optical-beam-induced current (TOBIC) microscopy and two-photon laser assisted device alteration (2pLADA) techniques, showing a resolution and localisation improvement using the RP beam. By comparing images of the same structural features obtained using linear, circular and radial polarisations imaging and localisation resolutions both approaching 100 nm were demonstrated. The obtained experimental results were in good agreement with modelling and were consistent with theoretically predicted behaviour. Certain artefacts were observed under radial polarisation, which were thought to result from the extended depth of focus and the significant longitudinal field component. In any application these effects must be considered alongside the benefits of the symmetric field distribution in the focal plane. While SIL sub-surface microscopy offers unmatched spatial resolutions, it is prone to being severely degraded by aberrations arising from inaccurate dimensions of the SIL, imprecise substrate thickness or imperfect contact between SIL and substrate. It is in this context that techniques to identify and even mitigate aberrations in the system are important. A simple approach is demonstrated for revealing the presence of chromatic and spherical aberrations by measuring the two-photon autocorrelation of the pulses at the focal plane inside the sample. In the case of aberration free imaging, it was shown both theoretically and experimentally that the planes of the maximum autocorrelation amplitude and shortest pulse duration always coincide. Therefore, the optics of the imaging system can be first adjusted to obtain the minimum autocorrelation duration and then the wavefront of incident light modified to maximise the autocorrelation intensity, iterating this procedure until the positions of minimum pulse duration and maximum autocorrelation amplitude coincide

    Integrated Circuits/Microchips

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    With the world marching inexorably towards the fourth industrial revolution (IR 4.0), one is now embracing lives with artificial intelligence (AI), the Internet of Things (IoTs), virtual reality (VR) and 5G technology. Wherever we are, whatever we are doing, there are electronic devices that we rely indispensably on. While some of these technologies, such as those fueled with smart, autonomous systems, are seemingly precocious; others have existed for quite a while. These devices range from simple home appliances, entertainment media to complex aeronautical instruments. Clearly, the daily lives of mankind today are interwoven seamlessly with electronics. Surprising as it may seem, the cornerstone that empowers these electronic devices is nothing more than a mere diminutive semiconductor cube block. More colloquially referred to as the Very-Large-Scale-Integration (VLSI) chip or an integrated circuit (IC) chip or simply a microchip, this semiconductor cube block, approximately the size of a grain of rice, is composed of millions to billions of transistors. The transistors are interconnected in such a way that allows electrical circuitries for certain applications to be realized. Some of these chips serve specific permanent applications and are known as Application Specific Integrated Circuits (ASICS); while, others are computing processors which could be programmed for diverse applications. The computer processor, together with its supporting hardware and user interfaces, is known as an embedded system.In this book, a variety of topics related to microchips are extensively illustrated. The topics encompass the physics of the microchip device, as well as its design methods and applications

    Time resolved single photon imaging in Nanometer Scale CMOS technology

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    Time resolved imaging is concerned with the measurement of photon arrival time. It has a wealth of emerging applications including biomedical uses such as fluorescence lifetime microscopy and positron emission tomography, as well as laser ranging and imaging in three dimensions. The impact of time resolved imaging on human life is significant: it can be used to identify cancerous cells in-vivo, how well new drugs may perform, or to guide a robot around a factory or hospital. Two essential building blocks of a time resolved imaging system are a photon detector capable of sensing single photons, and fast time resolvers that can measure the time of flight of light to picosecond resolution. In order to address these emerging applications, miniaturised, single-chip, integrated arrays of photon detectors and time resolvers must be developed with state of the art performance and low cost. The goal of this research is therefore the design, layout and verification of arrays of low noise Single Photon Avalanche Diodes (SPADs) together with high resolution Time-Digital Converters (TDCs) using an advanced silicon fabrication process. The research reported in this Thesis was carried out as part of the E.U. funded Megaframe FP6 Project. A 32x32 pixel, one million frames per second, time correlated imaging device has been designed, simulated and fabricated using a 130nm CMOS Imaging process from ST Microelectronics. The imager array has been implemented together with required support cells in order to transmit data off chip at high speed as well as providing a means of device control, test and calibration. The fabricated imaging device successfully demonstrates the research objectives. The Thesis presents details of design, simulation and characterisation results of the elements of the Megaframe device which were the author’s own work. Highlights of the results include the smallest and lowest noise SPAD devices yet published for this class of fabrication process and an imaging array capable of recording single photon arrivals every microsecond, with a minimum time resolution of fifty picoseconds and single bit linearity

    Characterization, Operation and Wafer-level Testing of an ultra-fast 4k Pixel Readout ASIC for the DSSC X-ray Detector at the European XFEL

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    The DEPFET sensor with signal compression (DSSC) project develops amegapixel X-ray camera dedicated for ultra-fast imaging at 4.5MHz frame rate at the European X-ray free electron laser facility in Hamburg. Further requirements are single photon resolution for so X-rays and a high dynamic range. The system concept includes a hybrid pixel detector, utilizing a non-linear DEPFET sensor. A dedicated readout ASIC allows full parallel readout of a 64 x 64 sensor pixel matrix by in-pixel filtering, immediate analog-to-digital conversion and storage. This thesis presents the ASIC working principle, architecture and the design of a test environment as well as test results of the electronics. Possible improvements of the circuits are highlighted. Measurements on sensor and ASIC assemblies are shown verifying the low noise and high dynamic range properties. The implementation of large scale tests for Known Good Die selection is reported. An introduction to free electron lasers and photon detection principles is included to put the DSSC system into the scientific context

    The 2021 flexible and printed electronics roadmap

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    This roadmap includes the perspectives and visions of leading researchers in the key areas of flexible and printable electronics. The covered topics are broadly organized by the device technologies (sections 1–9), fabrication techniques (sections 10–12), and design and modeling approaches (sections 13 and 14) essential to the future development of new applications leveraging flexible electronics (FE). The interdisciplinary nature of this field involves everything from fundamental scientific discoveries to engineering challenges; from design and synthesis of new materials via novel device design to modelling and digital manufacturing of integrated systems. As such, this roadmap aims to serve as a resource on the current status and future challenges in the areas covered by the roadmap and to highlight the breadth and wide-ranging opportunities made available by FE technologies

    Miniaturized Optical Probes for Near Infrared Spectroscopy

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    RÉSUMÉ L’étude de la propagation de la lumière dans des milieux hautement diffus tels que les tissus biologiques (imagerie optique diffuse) est très attrayante, car elle offre la possibilité d’explorer de manière non invasive le milieu se trouvant profondément sous la surface, et de retrouver des informations sur l’absorption (liée à la composition chimique) et sur la diffusion (liée à la microstructure). Dans la gamme spectrale 600-1000 nm, également appelée gamme proche infrarouge (NIR en anglais), l'atténuation de la lumière par le tissu biologique (eau, lipides et hémoglobine) est relativement faible, ce qui permet une pénétration de plusieurs centimètres dans le tissu. En spectroscopie proche infrarouge (NIRS en anglais), de photons sont injectés dans les tissus et le signal émis portant des informations sur les constituants tissulaires est mesuré. La mesure de très faibles signaux dans la plage de longueurs d'ondes visibles et proche infrarouge avec une résolution temporelle de l'ordre de la picoseconde s'est révélée une technique efficace pour étudier des tissus biologiques en imagerie cérébrale fonctionnelle, en mammographie optique et en imagerie moléculaire, sans parler de l'imagerie de la durée de vie de fluorescence, la spectroscopie de corrélation de fluorescence, informations quantiques et bien d’autres. NIRS dans le domaine temporel (TD en anglais) utilise une source de lumière pulsée, généralement un laser fournissant des impulsions lumineuses d'une durée de quelques dizaines de picosecondes, ainsi qu'un appareil de détection avec une résolution temporelle inférieure à la nanoseconde. Le point essentiel de ces mesures est la nécessité d’augmenter la sensibilité pour de plus grandes profondeurs d’investigation, en particulier pour l’imagerie cérébrale fonctionnelle, où la peau, le crâne et le liquide céphalo-rachidien (LCR) masquent fortement le signal cérébral. À ce jour, l'adoption plus large de ces techniques optique non invasives de surveillance est surtout entravée par les composants traditionnels volumineux, coûteux, complexes et fragiles qui ont un impact significatif sur le coût et la dimension de l’ensemble du système. Notre objectif est de développer une sonde NIRS compacte et miniaturisée, qui peut être directement mise en contact avec l'échantillon testé pour obtenir une haute efficacité de détection des photons diffusés, sans avoir recours à des fibres et des lentilles encombrantes pour l'injection et la collection de la lumière. Le système proposé est composé de deux parties: i) une unité d’émission de lumière pulsée et ii) un module de détection à photon unique qui peut être activé et désactivé rapidement. L'unité d'émission de lumière utilisera une source laser pulsée à plus de 80 MHz avec une largeur d'impulsion de picoseconde.----------ABSTRACT The study of light propagation into highly diffusive media like biological tissues (Diffuse Optical Imaging) is highly appealing due to the possibility to explore the medium non-invasively, deep beneath the surface and to recover information both on absorption (related to chemical composition) and on scattering (related to microstructure). In the 600–1000 nm spectral range also known as near-infrared (NIR) range, light attenuation by the biological tissue constituents (i.e. water, lipid, and hemoglobin) is relatively low and allows for penetration through several centimeters of tissue. In near-infrared spectroscopy (NIRS), a light signal is injected into the tissues and the emitted signal carrying information on tissue constituents is measured. The measurement of very faint light signals in the visible and near-infrared wavelength range with picosecond timing resolution has proven to be an effective technique to study biological tissues in functional brain imaging, optical mammography and molecular imaging, not to mention fluorescence lifetime imaging, fluorescence correlation spectroscopy, quantum information and many others. Time Domain (TD) NIRS employs a pulsed light source, typically a laser providing light pulses with duration of a few tens of picoseconds, and a detection circuit with temporal resolution in the sub-nanosecond scale. The key point of these measurements is the need to increase the sensitivity to higher penetration depths of investigation, in particular for functional brain imaging, where skin, skull, and cerebrospinal fluid (CSF) heavily mask the brain signal. To date, the widespread adoption of the non-invasive optical monitoring techniques is mainly hampered by the traditional bulky, expensive, complex and fragile components which significantly impact the overall cost and dimension of the system. Our goal is the development of a miniaturized compact NIRS probe, that can be directly put in contact with the sample under test to obtain high diffused photon harvesting efficiency without the need for cumbersome optical fibers and lenses for light injection and collection. The proposed system is composed of two parts namely; i) pulsed light emission unit and ii) gated single-photon detection module. The light emission unit will employ a laser source pulsed at over 80MHz with picosecond pulse width generator embedded into the probe along with the light detection unit which comprises single-photon detectors integrated with other peripheral control circuitry. Short distance source and detector pairing, most preferably on a single chip has the potential to greatly expedites the traditional method of portable brain imaging

    Optoelectronics – Devices and Applications

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    Optoelectronics - Devices and Applications is the second part of an edited anthology on the multifaced areas of optoelectronics by a selected group of authors including promising novices to experts in the field. Photonics and optoelectronics are making an impact multiple times as the semiconductor revolution made on the quality of our life. In telecommunication, entertainment devices, computational techniques, clean energy harvesting, medical instrumentation, materials and device characterization and scores of other areas of R&D the science of optics and electronics get coupled by fine technology advances to make incredibly large strides. The technology of light has advanced to a stage where disciplines sans boundaries are finding it indispensable. New design concepts are fast emerging and being tested and applications developed in an unimaginable pace and speed. The wide spectrum of topics related to optoelectronics and photonics presented here is sure to make this collection of essays extremely useful to students and other stake holders in the field such as researchers and device designers
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