Compressed Passive Macromodeling

This paper presents an approach for the extraction of passive macromodels of large-scale interconnects from their frequency-domain scattering responses. Here, large scale is intended both in terms of number of electrical ports and required dynamic model order. For such structures, standard approaches based on rational approximation via vector fitting and passivity enforcement via model perturbation may fail because of excessive computational requirements, both in terms of memory size and runtime. Our approach addresses this complexity by first reducing the redundancy in the raw scattering responses through a projection and approximation process based on a truncated singular value decomposition. Then we formulate a compressed rational fitting and passivity enforcement framework which is able to obtain speedup factors up to 2 and 3 orders of magnitude with respect to standard approaches, with full control over the approximation errors. Numerical results on a large set of benchmark cases demonstrate the effectiveness of the proposed techniqu

Interpolation-based parameterized model order reduction of delayed systems

Three-dimensional electromagnetic methods are fundamental tools for the analysis and design of high-speed systems. These methods often generate large systems of equations, and model order reduction (MOR) methods are used to reduce such a high complexity. When the geometric dimensions become electrically large or signal waveform rise times decrease, time delays must be included in the modeling. Design space optimization and exploration are usually performed during a typical design process that consequently requires repeated simulations for different design parameter values. Efficient performing of these design activities calls for parameterized model order reduction (PMOR) methods, which are able to reduce large systems of equations with respect to frequency and other design parameters of the circuit, such as layout or substrate features. We propose a novel PMOR method for neutral delayed differential systems, which is based on an efficient and reliable combination of univariate model order reduction methods, a procedure to find scaling and frequency shifting coefficients and positive interpolation schemes. The proposed scaling and frequency shifting coefficients enhance and improve the modeling capability of standard positive interpolation schemes and allow accurate modeling of highly dynamic systems with a limited amount of initial univariate models in the design space. The proposed method is able to provide parameterized reduced order models passive by construction over the design space of interest. Pertinent numerical examples validate the proposed PMOR approach

Addressing Computational Complexity of High Speed Distributed Circuits Using Model Order Reduction

Advanced in the fabrication technology of integrated circuits (ICs) over the last couple of years has resulted in an unparalleled expansion of the functionality of microelectronic systems. Today’s ICs feature complex deep-submicron mixed-signal designs and have found numerous applications in industry due to their lower manufacturing costs and higher performance levels. The tendency towards smaller feature sizes and increasing clock rates is placing higher demands on signal integrity design by highlighting previously negligible interconnect effects such as distortion, reflection, ringing, delay, and crosstalk. These effects if not predicted in the early stages of the design cycle can severely degrade circuit performance and reliability. The objective of this thesis is to develop new model order reduction (MOR) techniques to minimize the computational complexity of non-linear circuits and electronic systems that have delay elements. MOR techniques provide a mechanism to generate reduced order models from the detailed description of the original modified nodal analysis (MNA) formulation. The following contributions are made in this thesis: 1. The first project presents a methodology for reduction of Partial Element Equivalent Circuit (PEEC) models. PEEC method is widely used in electromagnetic compatibility and signal integrity problems in both the time and frequency domains. The PEEC model with retardation has been applied to 3-D analysis but often result in large and dense matrices, which are computationally expensive to solve. In this thesis, a new moment matching technique based on Multi-order Arnoldi is described to model PEEC networks with retardation. 2. The second project deals with developing an efficient model order reduction algorithm for simulating large interconnect networks with nonlinear elements. The proposed methodology is based on a multidimensional subspace method and uses constraint equations to link the nonlinear elements and biasing sources to the reduced order model. This approach significantly improves the simulation time of distributed nonlinear systems, since additional ports are not required to link the nonlinear elements to the reduced order model, yielding appreciable savings in the size of the reduced order model and computational time. 3. A parameterized reduction technique for nonlinear systems is presented. The proposed method uses multidimensional subspace and variational analysis to capture the variances of design parameters and approximates the weakly nonlinear functions as a Taylor series. An SVD approach is presented to address the efficiency of reduced order model. The proposed methodology significantly improves the simulation time of weakly nonlinear systems since the size of the reduced system is smaller than the original system and a new reduced model is not required each time a design parameter is changed

Modeling and Analysis of Noise and Interconnects for On-Chip Communication Link Design

This thesis considers modeling and analysis of noise and interconnects in onchip communication. Besides transistor count and speed, the capabilities of a modern design are often limited by on-chip communication links. These links typically consist of multiple interconnects that run parallel to each other for long distances between functional or memory blocks. Due to the scaling of technology, the interconnects have considerable electrical parasitics that affect their performance, power dissipation and signal integrity. Furthermore, because of electromagnetic coupling, the interconnects in the link need to be considered as an interacting group instead of as isolated signal paths. There is a need for accurate and computationally effective models in the early stages of the chip design process to assess or optimize issues affecting these interconnects. For this purpose, a set of analytical models is developed for on-chip data links in this thesis. First, a model is proposed for modeling crosstalk and intersymbol interference. The model takes into account the effects of inductance, initial states and bit sequences. Intersymbol interference is shown to affect crosstalk voltage and propagation delay depending on bus throughput and the amount of inductance. Next, a model is proposed for the switching current of a coupled bus. The model is combined with an existing model to evaluate power supply noise. The model is then applied to reduce both functional crosstalk and power supply noise caused by a bus as a trade-off with time. The proposed reduction method is shown to be effective in reducing long-range crosstalk noise. The effects of process variation on encoded signaling are then modeled. In encoded signaling, the input signals to a bus are encoded using additional signaling circuitry. The proposed model includes variation in both the signaling circuitry and in the wires to calculate the total delay variation of a bus. The model is applied to study level-encoded dual-rail and 1-of-4 signaling. In addition to regular voltage-mode and encoded voltage-mode signaling, current-mode signaling is a promising technique for global communication. A model for energy dissipation in RLC current-mode signaling is proposed in the thesis. The energy is derived separately for the driver, wire and receiver termination.Siirretty Doriast

Heat generation transport in micro and sub- micro scale in electronic packaging

Energy exchange takes place in extremely small dimension and time scale in the process of micro-electronic packaging. For fast heating response. Fourier conduction law is inadequate to explain the phenomena. Thus. compensate the Fourier law, named as Non-Fourier law. Non-Fourier law, based on two-phase-lag model has introduced two from classical Fourier heat conduction equation when applied to rapid heating process. These assumptions are finite thermal wave propagation speeds and time of equilibrium between electron and lattice. From previous research on dual phase-lag model, different governing equations have to employ for different boundary conditions, but with a proposed two phase-lag model only a single governing equation is adequate. These phase lags are the phase lag for temperature gradient (xT) and heat flux (xq). A finite element method and Runge-Kutta method are applied in the development of threelower temperature values as compared with one-dimensional and two-dimensional model. The application of two phase-lag model to very-large-scale-integrated (VLSI) interconnect thermal analysis, illustrates that circuit open failure occurs at current pulse of 300ns. An implementation of Asymptotic Waveform Evaluation (AWE) scheme in first and second order ordinary differential equation shows a break through as compared with conventional methods. This advanced, powerful and efficient scheme shows excellent results compared with Runge-Kutta method, central difference method and ANSYS* 5.4, and is several orders faster

EARLY PERFORMANCE PREDICTION METHODOLOGY FOR MANY-CORES ON CHIP BASED APPLICATIONS

Modern high performance computing applications such as personal computing, gaming, numerical simulations require application-specific integrated circuits (ASICs) that comprises of many cores. Performance for these applications depends mainly on latency of interconnects which transfer data between cores that implement applications by distributing tasks. Time-to-market is a critical consideration while designing ASICs for these applications. Therefore, to reduce design cycle time, predicting system performance accurately at an early stage of design is essential. With process technology in nanometer era, physical phenomena such as crosstalk, reflection on the propagating signal have a direct impact on performance. Incorporating these effects provides a better performance estimate at an early stage. This work presents a methodology for better performance prediction at an early stage of design, achieved by mapping system specification to a circuit-level netlist description. At system-level, to simplify description and for efficient simulation, SystemVerilog descriptions are employed. For modeling system performance at this abstraction, queueing theory based bounded queue models are applied. At the circuit level, behavioral Input/Output Buffer Information Specification (IBIS) models can be used for analyzing effects of these physical phenomena on on-chip signal integrity and hence performance. For behavioral circuit-level performance simulation with IBIS models, a netlist must be described consisting of interacting cores and a communication link. Two new netlists, IBIS-ISS and IBIS-AMI-ISS are introduced for this purpose. The cores are represented by a macromodel automatically generated by a developed tool from IBIS models. The generated IBIS models are employed in the new netlists. Early performance prediction methodology maps a system specification to an instance of these netlists to provide a better performance estimate at an early stage of design. The methodology is scalable in nanometer process technology and can be reused in different designs

Modelling and analysis of crosstalk in scaled CMOS interconnects

The development of a general coupled RLC interconnect model for simulating scaled bus structures m VLSI is presented. Several different methods for extracting submicron resistance, inductance and capacitance parameters are documented. Realistic scaling dimensions for deep submicron design rules are derived and used within the model. Deep submicron HSPICE device models are derived through the use of constant-voltage scaling theory on existing 0.75µm and 1.0µm models to create accurate interconnect bus drivers. This complete model is then used to analyse crosstalk noise and delay effects on multiple scaling levels to determine the dependence of crosstalk on scaling level. Using this data, layout techniques and processing methods are suggested to reduce crosstalk in system

Model order reduction of time-delay systems using a laguerre expansion technique

The demands for miniature sized circuits with higher operating speeds have increased the complexity of the circuit, while at high frequencies it is known that effects such as crosstalk, attenuation and delay can have adverse effects on signal integrity. To capture these high speed effects a very large number of system equations is normally required and hence model order reduction techniques are required to make the simulation of the circuits computationally feasible. This paper proposes a higher order Krylov subspace algorithm for model order reduction of time-delay systems based on a Laguerre expansion technique. The proposed technique consists of three sections i.e., first the delays are approximated using the recursive relation of Laguerre polynomials, then in the second part, the reduced order is estimated for the time-delay system using a delay truncation in the Laguerre domain and in the third part, a higher order Krylov technique using Laguerre expansion is computed for obtaining the reduced order time-delay system. The proposed technique is validated by means of real world numerical examples