Immunotronics - novel finite-state-machine architectures with built-in self-test using self-nonself differentiation

A novel approach to hardware fault tolerance is demonstrated that takes inspiration from the human immune system as a method of fault detection. The human immune system is a remarkable system of interacting cells and organs that protect the body from invasion and maintains reliable operation even in the presence of invading bacteria or viruses. This paper seeks to address the field of electronic hardware fault tolerance from an immunological perspective with the aim of showing how novel methods based upon the operation of the immune system can both complement and create new approaches to the development of fault detection mechanisms for reliable hardware systems. In particular, it is shown that by use of partial matching, as prevalent in biological systems, high fault coverage can be achieved with the added advantage of reducing memory requirements. The development of a generic finite-state-machine immunization procedure is discussed that allows any system that can be represented in such a manner to be "immunized" against the occurrence of faulty operation. This is demonstrated by the creation of an immunized decade counter that can detect the presence of faults in real tim

High-level services for networks-on-chip

Future technology trends envision that next-generation Multiprocessors Systems-on- Chip (MPSoCs) will be composed of a combination of a large number of processing and storage elements interconnected by complex communication architectures. Communication and interconnection between these basic blocks play a role of crucial importance when the number of these elements increases. Enabling reliable communication channels between cores becomes therefore a challenge for system designers. Networks-on-Chip (NoCs) appeared as a strategy for connecting and managing the communication between several design elements and IP blocks, as required in complex Systems-on-Chip (SoCs). The topic can be considered as a multidisciplinary synthesis of multiprocessing, parallel computing, networking, and on- chip communication domains. Networks-on-Chip, in addition to standard communication services, can be employed for providing support for the implementation of system-level services. This dissertation will demonstrate how high-level services can be added to an MPSoC platform by embedding appropriate hardware/software support in the network interfaces (NIs) of the NoC. In this dissertation, the implementation of innovative modules acting in parallel with protocol translation and data transmission in NIs is proposed and evaluated. The modules can support the execution of the high-level services in the NoC at a relatively low cost in terms of area and energy consumption. Three types of services will be addressed and discussed: security, monitoring, and fault tolerance. With respect to the security aspect, this dissertation will discuss the implementation of an innovative data protection mechanism for detecting and preventing illegal accesses to protected memory blocks and/or memory mapped peripherals. The second aspect will be addressed by proposing the implementation of a monitoring system based on programmable multipurpose monitoring probes aimed at detecting NoC internal events and run-time characteristics. As last topic, new architectural solutions for the design of fault tolerant network interfaces will be presented and discussed

Implementation and Characterization of AHR on a Xilinx FPGA

A new version of the Adaptive-Hybrid Redundancy (AHR) architecture was developed to be implemented and tested in hardware using Commercial-Off-The-Shelf (COTS) Field-Programmable Gate Arrays (FPGAs). The AHR architecture was developed to mitigate the effects that the Single Event Upset (SEU) and Single Event Transient (SET) radiation effects have on processors and was tested on a Microprocessor without Interlocked Pipeline Stages (MIPS) architecture. The AHR MIPS architecture was implemented in hardware using two Xilinx FPGAs. A Universal Asynchronous Receiver Transmitter (UART) based serial communication network was added to the AHR MIPS design to enable inter-board communication between the two FPGAs. The runtime performance of AHR MIPS was measured in hardware and compared against the runtime performance of standalone TMR and TSR MIPS architectures. The hardware implementation of AHR MIPS demonstrated flexible runtime performance that was nearly as fast as TMR MIPS, never as slow as TSR MIPS, and demonstrated performance in between those extremes. Hardware testing and verification of AHR MIPS showed that the AHR mitigation strategy presents a large performance tradespace, where a user can adjust both the runtime processor performance and radiation tolerance to fit the constraints of a space mission, while also continuing to provide adaptive performance based upon the current radiation environment

A VLSI synthesis of a Reed-Solomon processor for digital communication systems

The Reed-Solomon codes have been widely used in digital communication systems such as computer networks, satellites, VCRs, mobile communications and high- definition television (HDTV), in order to protect digital data against erasures, random and burst errors during transmission. Since the encoding and decoding algorithms for such codes are computationally intensive, special purpose hardware implementations are often required to meet the real time requirements. -- One motivation for this thesis is to investigate and introduce reconfigurable Galois field arithmetic structures which exploit the symmetric properties of available architectures. Another is to design and implement an RS encoder/decoder ASIC which can support a wide family of RS codes. -- An m-programmable Galois field multiplier which uses the standard basis representation of the elements is first introduced. It is then demonstrated that the exponentiator can be used to implement a fast inverter which outperforms the available inverters in GF(2m). Using these basic structures, an ASIC design and synthesis of a reconfigurable Reed-Solomon encoder/decoder processor which implements a large family of RS codes is proposed. The design is parameterized in terms of the block length n, Galois field symbol size m, and error correction capability t for the various RS codes. The design has been captured using the VHDL hardware description language and mapped onto CMOS standard cells available in the 0.8-µm BiCMOS design kits for Cadence and Synopsys tools. The experimental chip contains 218,206 logic gates and supports values of the Galois field symbol size m = 3,4,5,6,7,8 and error correction capability t = 1,2,3, ..., 16. Thus, the block length n is variable from 7 to 255. Error correction t and Galois field symbol size m are pin-selectable. -- Since low design complexity and high throughput are desired in the VLSI chip, the algebraic decoding technique has been investigated instead of the time or transform domain. The encoder uses a self-reciprocal generator polynomial which structures the codewords in a systematic form. At the beginning of the decoding process, received words are initially stored in the first-in-first-out (FIFO) buffer as they enter the syndrome module. The Berlekemp-Massey algorithm is used to determine both the error locator and error evaluator polynomials. The Chien Search and Forney's algorithms operate sequentially to solve for the error locations and error values respectively. The error values are exclusive or-ed with the buffered messages in order to correct the errors, as the processed data leave the chip

New Fault Detection, Mitigation and Injection Strategies for Current and Forthcoming Challenges of HW Embedded Designs

Tesis por compendio[EN] Relevance of electronics towards safety of common devices has only been growing, as an ever growing stake of the functionality is assigned to them. But of course, this comes along the constant need for higher performances to fulfill such functionality requirements, while keeping power and budget low. In this scenario, industry is struggling to provide a technology which meets all the performance, power and price specifications, at the cost of an increased vulnerability to several types of known faults or the appearance of new ones. To provide a solution for the new and growing faults in the systems, designers have been using traditional techniques from safety-critical applications, which offer in general suboptimal results. In fact, modern embedded architectures offer the possibility of optimizing the dependability properties by enabling the interaction of hardware, firmware and software levels in the process. However, that point is not yet successfully achieved. Advances in every level towards that direction are much needed if flexible, robust, resilient and cost effective fault tolerance is desired. The work presented here focuses on the hardware level, with the background consideration of a potential integration into a holistic approach. The efforts in this thesis have focused several issues: (i) to introduce additional fault models as required for adequate representativity of physical effects blooming in modern manufacturing technologies, (ii) to provide tools and methods to efficiently inject both the proposed models and classical ones, (iii) to analyze the optimum method for assessing the robustness of the systems by using extensive fault injection and later correlation with higher level layers in an effort to cut development time and cost, (iv) to provide new detection methodologies to cope with challenges modeled by proposed fault models, (v) to propose mitigation strategies focused towards tackling such new threat scenarios and (vi) to devise an automated methodology for the deployment of many fault tolerance mechanisms in a systematic robust way. The outcomes of the thesis constitute a suite of tools and methods to help the designer of critical systems in his task to develop robust, validated, and on-time designs tailored to his application.[ES] La relevancia que la electrónica adquiere en la seguridad de los productos ha crecido inexorablemente, puesto que cada vez ésta copa una mayor influencia en la funcionalidad de los mismos. Pero, por supuesto, este hecho viene acompañado de una necesidad constante de mayores prestaciones para cumplir con los requerimientos funcionales, al tiempo que se mantienen los costes y el consumo en unos niveles reducidos. En este escenario, la industria está realizando esfuerzos para proveer una tecnología que cumpla con todas las especificaciones de potencia, consumo y precio, a costa de un incremento en la vulnerabilidad a múltiples tipos de fallos conocidos o la introducción de nuevos. Para ofrecer una solución a los fallos nuevos y crecientes en los sistemas, los diseñadores han recurrido a técnicas tradicionalmente asociadas a sistemas críticos para la seguridad, que ofrecen en general resultados sub-óptimos. De hecho, las arquitecturas empotradas modernas ofrecen la posibilidad de optimizar las propiedades de confiabilidad al habilitar la interacción de los niveles de hardware, firmware y software en el proceso. No obstante, ese punto no está resulto todavía. Se necesitan avances en todos los niveles en la mencionada dirección para poder alcanzar los objetivos de una tolerancia a fallos flexible, robusta, resiliente y a bajo coste. El trabajo presentado aquí se centra en el nivel de hardware, con la consideración de fondo de una potencial integración en una estrategia holística. Los esfuerzos de esta tesis se han centrado en los siguientes aspectos: (i) la introducción de modelos de fallo adicionales requeridos para la representación adecuada de efectos físicos surgentes en las tecnologías de manufactura actuales, (ii) la provisión de herramientas y métodos para la inyección eficiente de los modelos propuestos y de los clásicos, (iii) el análisis del método óptimo para estudiar la robustez de sistemas mediante el uso de inyección de fallos extensiva, y la posterior correlación con capas de más alto nivel en un esfuerzo por recortar el tiempo y coste de desarrollo, (iv) la provisión de nuevos métodos de detección para cubrir los retos planteados por los modelos de fallo propuestos, (v) la propuesta de estrategias de mitigación enfocadas hacia el tratamiento de dichos escenarios de amenaza y (vi) la introducción de una metodología automatizada de despliegue de diversos mecanismos de tolerancia a fallos de forma robusta y sistemática. Los resultados de la presente tesis constituyen un conjunto de herramientas y métodos para ayudar al diseñador de sistemas críticos en su tarea de desarrollo de diseños robustos, validados y en tiempo adaptados a su aplicación.[CA] La rellevància que l'electrònica adquireix en la seguretat dels productes ha crescut inexorablement, puix cada volta més aquesta abasta una major influència en la funcionalitat dels mateixos. Però, per descomptat, aquest fet ve acompanyat d'un constant necessitat de majors prestacions per acomplir els requeriments funcionals, mentre es mantenen els costos i consums en uns nivells reduïts. Donat aquest escenari, la indústria està fent esforços per proveir una tecnologia que complisca amb totes les especificacions de potència, consum i preu, tot a costa d'un increment en la vulnerabilitat a diversos tipus de fallades conegudes, i a la introducció de nous tipus. Per oferir una solució a les noves i creixents fallades als sistemes, els dissenyadors han recorregut a tècniques tradicionalment associades a sistemes crítics per a la seguretat, que en general oferixen resultats sub-òptims. De fet, les arquitectures empotrades modernes oferixen la possibilitat d'optimitzar les propietats de confiabilitat en habilitar la interacció dels nivells de hardware, firmware i software en el procés. Tot i això eixe punt no està resolt encara. Es necessiten avanços a tots els nivells en l'esmentada direcció per poder assolir els objectius d'una tolerància a fallades flexible, robusta, resilient i a baix cost. El treball ací presentat se centra en el nivell de hardware, amb la consideració de fons d'una potencial integració en una estratègia holística. Els esforços d'esta tesi s'han centrat en els següents aspectes: (i) la introducció de models de fallada addicionals requerits per a la representació adequada d'efectes físics que apareixen en les tecnologies de fabricació actuals, (ii) la provisió de ferramentes i mètodes per a la injecció eficient del models proposats i dels clàssics, (iii) l'anàlisi del mètode òptim per estudiar la robustesa de sistemes mitjançant l'ús d'injecció de fallades extensiva, i la posterior correlació amb capes de més alt nivell en un esforç per retallar el temps i cost de desenvolupament, (iv) la provisió de nous mètodes de detecció per cobrir els reptes plantejats pels models de fallades proposats, (v) la proposta d'estratègies de mitigació enfocades cap al tractament dels esmentats escenaris d'amenaça i (vi) la introducció d'una metodologia automatitzada de desplegament de diversos mecanismes de tolerància a fallades de forma robusta i sistemàtica. Els resultats de la present tesi constitueixen un conjunt de ferramentes i mètodes per ajudar el dissenyador de sistemes crítics en la seua tasca de desenvolupament de dissenys robustos, validats i a temps adaptats a la seua aplicació.Espinosa García, J. (2016). New Fault Detection, Mitigation and Injection Strategies for Current and Forthcoming Challenges of HW Embedded Designs [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/73146TESISCompendi

Développement d'architectures HW/SW tolérantes aux fautes et auto-calibrantes pour les technologies Intégrées 3D

Malgré les avantages de l'intégration 3D, le test, le rendement et la fiabilité des Through-Silicon-Vias (TSVs) restent parmi les plus grands défis pour les systèmes 3D à base de Réseaux-sur-Puce (Network-on-Chip - NoC). Dans cette thèse, une stratégie de test hors-ligne a été proposé pour les interconnections TSV des liens inter-die des NoCs 3D. Pour le TSV Interconnect Built-In Self-Test (TSV-IBIST) on propose une nouvelle stratégie pour générer des vecteurs de test qui permet la détection des fautes structuraux (open et short) et paramétriques (fautes de délaye). Des stratégies de correction des fautes transitoires et permanents sur les TSV sont aussi proposées aux plusieurs niveaux d'abstraction: data link et network. Au niveau data link, des techniques qui utilisent des codes de correction (ECC) et retransmission sont utilisées pour protégé les liens verticales. Des codes de correction sont aussi utilisés pour la protection au niveau network. Les défauts de fabrication ou vieillissement des TSVs sont réparé au niveau data link avec des stratégies à base de redondance et sérialisation. Dans le réseau, les liens inter-die défaillante ne sont pas utilisables et un algorithme de routage tolérant aux fautes est proposé. On peut implémenter des techniques de tolérance aux fautes sur plusieurs niveaux. Les résultats ont montré qu'une stratégie multi-level atteint des très hauts niveaux de fiabilité avec un cout plus bas. Malheureusement, il n'y as pas une solution unique et chaque stratégie a ses avantages et limitations. C'est très difficile d'évaluer tôt dans le design flow les couts et l'impact sur la performance. Donc, une méthodologie d'exploration de la résilience aux fautes est proposée pour les NoC 3D mesh.3D technology promises energy-efficient heterogeneous integrated systems, which may open the way to thousands cores chips. Silicon dies containing processing elements are stacked and connected by vertical wires called Through-Silicon-Vias. In 3D chips, interconnecting an increasing number of processing elements requires a scalable high-performance interconnect solution: the 3D Network-on-Chip. Despite the advantages of 3D integration, testing, reliability and yield remain the major challenges for 3D NoC-based systems. In this thesis, the TSV interconnect test issue is addressed by an off-line Interconnect Built-In Self-Test (IBIST) strategy that detects both structural (i.e. opens, shorts) and parametric faults (i.e. delays and delay due to crosstalk). The IBIST circuitry implements a novel algorithm based on the aggressor-victim scenario and alleviates limitations of existing strategies. The proposed Kth-aggressor fault (KAF) model assumes that the aggressors of a victim TSV are neighboring wires within a distance given by the aggressor order K. Using this model, TSV interconnect tests of inter-die 3D NoC links may be performed for different aggressor order, reducing test times and circuitry complexity. In 3D NoCs, TSV permanent and transient faults can be mitigated at different abstraction levels. In this thesis, several error resilience schemes are proposed at data link and network levels. For transient faults, 3D NoC links can be protected using error correction codes (ECC) and retransmission schemes using error detection (Automatic Retransmission Query) and correction codes (i.e. Hybrid error correction and retransmission).For transients along a source-destination path, ECC codes can be implemented at network level (i.e. Network-level Forward Error Correction). Data link solutions also include TSV repair schemes for faults due to fabrication processes (i.e. TSV-Spare-and-Replace and Configurable Serial Links) and aging (i.e. Interconnect Built-In Self-Repair and Adaptive Serialization) defects. At network-level, the faulty inter-die links of 3D mesh NoCs are repaired by implementing a TSV fault-tolerant routing algorithm. Although single-level solutions can achieve the desired yield / reliability targets, error mitigation can be realized by a combination of approaches at several abstraction levels. To this end, multi-level error resilience strategies have been proposed. Experimental results show that there are cases where this multi-layer strategy pays-off both in terms of cost and performance. Unfortunately, one-fits-all solution does not exist, as each strategy has its advantages and limitations. For system designers, it is very difficult to assess early in the design stages the costs and the impact on performance of error resilience. Therefore, an error resilience exploration (ERX) methodology is proposed for 3D NoCs.SAVOIE-SCD - Bib.électronique (730659901) / SudocGRENOBLE1/INP-Bib.électronique (384210012) / SudocGRENOBLE2/3-Bib.électronique (384219901) / SudocSudocFranceF

Enhancing Real-time Embedded Image Processing Robustness on Reconfigurable Devices for Critical Applications

Nowadays, image processing is increasingly used in several application fields, such as biomedical, aerospace, or automotive. Within these fields, image processing is used to serve both non-critical and critical tasks. As example, in automotive, cameras are becoming key sensors in increasing car safety, driving assistance and driving comfort. They have been employed for infotainment (non-critical), as well as for some driver assistance tasks (critical), such as Forward Collision Avoidance, Intelligent Speed Control, or Pedestrian Detection. The complexity of these algorithms brings a challenge in real-time image processing systems, requiring high computing capacity, usually not available in processors for embedded systems. Hardware acceleration is therefore crucial, and devices such as Field Programmable Gate Arrays (FPGAs) best fit the growing demand of computational capabilities. These devices can assist embedded processors by significantly speeding-up computationally intensive software algorithms. Moreover, critical applications introduce strict requirements not only from the real-time constraints, but also from the device reliability and algorithm robustness points of view. Technology scaling is highlighting reliability problems related to aging phenomena, and to the increasing sensitivity of digital devices to external radiation events that can cause transient or even permanent faults. These faults can lead to wrong information processed or, in the worst case, to a dangerous system failure. In this context, the reconfigurable nature of FPGA devices can be exploited to increase the system reliability and robustness by leveraging Dynamic Partial Reconfiguration features. The research work presented in this thesis focuses on the development of techniques for implementing efficient and robust real-time embedded image processing hardware accelerators and systems for mission-critical applications. Three main challenges have been faced and will be discussed, along with proposed solutions, throughout the thesis: (i) achieving real-time performances, (ii) enhancing algorithm robustness, and (iii) increasing overall system's dependability. In order to ensure real-time performances, efficient FPGA-based hardware accelerators implementing selected image processing algorithms have been developed. Functionalities offered by the target technology, and algorithm's characteristics have been constantly taken into account while designing such accelerators, in order to efficiently tailor algorithm's operations to available hardware resources. On the other hand, the key idea for increasing image processing algorithms' robustness is to introduce self-adaptivity features at algorithm level, in order to maintain constant, or improve, the quality of results for a wide range of input conditions, that are not always fully predictable at design-time (e.g., noise level variations). This has been accomplished by measuring at run-time some characteristics of the input images, and then tuning the algorithm parameters based on such estimations. Dynamic reconfiguration features of modern reconfigurable FPGA have been extensively exploited in order to integrate run-time adaptivity into the designed hardware accelerators. Tools and methodologies have been also developed in order to increase the overall system dependability during reconfiguration processes, thus providing safe run-time adaptation mechanisms. In addition, taking into account the target technology and the environments in which the developed hardware accelerators and systems may be employed, dependability issues have been analyzed, leading to the development of a platform for quickly assessing the reliability and characterizing the behavior of hardware accelerators implemented on reconfigurable FPGAs when they are affected by such faults