464 research outputs found
DeSyRe: on-Demand System Reliability
The DeSyRe project builds on-demand adaptive and reliable Systems-on-Chips (SoCs). As fabrication technology scales down, chips are becoming less reliable, thereby incurring increased power and performance costs for fault tolerance. To make matters worse, power density is becoming a significant limiting factor in SoC design, in general. In the face of such changes in the technological landscape, current solutions for fault tolerance are expected to introduce excessive overheads in future systems. Moreover, attempting to design and manufacture a totally defect and fault-free system, would impact heavily, even prohibitively, the design, manufacturing, and testing costs, as well as the system performance and power consumption. In this context, DeSyRe delivers a new generation of systems that are reliable by design at well-balanced power, performance, and design costs. In our attempt to reduce the overheads of fault-tolerance, only a small fraction of the chip is built to be fault-free. This fault-free part is then employed to manage the remaining fault-prone resources of the SoC. The DeSyRe framework is applied to two medical systems with high safety requirements (measured using the IEC 61508 functional safety standard) and tight power and performance constraints
Low-cost error detection through high-level synthesis
System-on-chip design is becoming increasingly complex as technology scaling enables more and more functionality on a chip. This scaling and complexity has resulted in a variety of reliability and validation challenges including logic bugs, hot spots, wear-out, and soft errors. To make matters worse, as we reach the limits of Dennard scaling, efforts to improve system performance and energy efficiency have resulted in the integration of a wide variety of complex hardware accelerators in SoCs. Thus the challenge is to design complex, custom hardware that is efficient, but also correct and reliable.
High-level synthesis shows promise to address the problem of complex hardware design by providing a bridge from the high-productivity software domain to the hardware design process. Much research has been done on high-level synthesis efficiency optimizations. This thesis shows that high-level synthesis also has the power to address validation and reliability challenges through two solutions.
One solution for circuit reliability is modulo-3 shadow datapaths: performing lightweight shadow computations in modulo-3 space for each main computation. We leverage the binding and scheduling flexibility of high-level synthesis to detect control errors through diverse binding and minimize area cost through intelligent checkpoint scheduling and modulo-3 reducer sharing. We introduce logic and dataflow optimizations to further reduce cost. We evaluated our technique with 12 high-level synthesis benchmarks from the arithmetic-oriented PolyBench benchmark suite using FPGA emulated netlist-level error injection. We observe coverages of 99.1% for stuck-at faults, 99.5% for soft errors, and 99.6% for timing errors with a 25.7% area cost and negligible performance impact. Leveraging a mean error detection latency of 12.75 cycles (4150x faster than end result check) for soft errors, we also explore a rollback recovery method with an additional area cost of 28.0%, observing a 175x increase in reliability against soft errors.
Another solution for rapid post-silicon validation of accelerator designs is Hybrid Quick Error Detection (H-QED): inserting signature generation logic in a hardware design to create a heavily compressed signature stream that captures the internal behavior of the design at a fine temporal and spatial granularity for comparison with a reference set of signatures generated by high-level simulation to detect bugs. Using H-QED, we demonstrate an improvement in error detection latency (time elapsed from when a bug is activated to when it manifests as an observable failure) of two orders of magnitude and a threefold improvement in bug coverage compared to traditional post-silicon validation techniques. H-QED also uncovered previously unknown bugs in the CHStone benchmark suite, which is widely used by the HLS community. H-QED incurs less than 10% area overhead for the accelerator it validates with negligible performance impact, and we also introduce techniques to minimize any possible intrusiveness introduced by H-QED
A Survey of Recent Developments in Testability, Safety and Security of RISC-V Processors
With the continued success of the open RISC-V architecture, practical deployment of RISC-V processors necessitates an in-depth consideration of their testability, safety and security aspects. This survey provides an overview of recent developments in this quickly-evolving field. We start with discussing the application of state-of-the-art functional and system-level test solutions to RISC-V processors. Then, we discuss the use of RISC-V processors for safety-related applications; to this end, we outline the essential techniques necessary to obtain safety both in the functional and in the timing domain and review recent processor designs with safety features. Finally, we survey the different aspects of security with respect to RISC-V implementations and discuss the relationship between cryptographic protocols and primitives on the one hand and the RISC-V processor architecture and hardware implementation on the other. We also comment on the role of a RISC-V processor for system security and its resilience against side-channel attacks
Recommended from our members
Towards a scalable and reliable wireless network-on-chip
Multi-core platforms are emerging trends in the design of Systems-on-Chip (SoCs). Interconnect fabrics for these multi-core SoCs play a crucial role in achieving the target performance. The Network-on-Chip (NoC) paradigm has been proposed as a promising solution for designing the interconnect fabric of multi-core SoCs. But the performance requirements of NoC infrastructures in future technology nodes cannot be met by relying only on material innovation with traditional scaling. The continuing demand for low power and high speed interconnects with technology scaling necessitates looking beyond the conventional planar metal/dielectric-based interconnect infrastructures. Among different possible alternatives, the on-chip wireless communication network is envisioned as a revolutionary methodology, capable of bringing significant performance gains for multi-core SoCs. Wireless NoCs (WiNoCs) can be designed by using miniaturized on-chip antennas as an enabling technology. In this work, design methodologies and technology requirements for scalable WiNoC architectures are presented and their performance is evaluated. It is demonstrated that WiNoCs outperform their wired counterparts in terms of network throughput and latency, and that energy dissipation improves by orders of magnitude under various experimental and real-life scenarios. A major challenge that NoC design is expected to face is related to the intrinsic unreliability of the interconnect infrastructure under technology limitations. The devices and components of the WiNoCs are expected to suffer high failure rates. By incorporating error control coding (ECC) schemes along the interconnects, NoC architectures will be able to provide correct functionality even in the presence of different sources of transient noise and yet have low energy dissipation. In this work, designs of novel joint crosstalk avoidance and multiple error correction/detection codes as well as burst error correction codes are proposed and their performance is evaluated in different WiNoC fabrics. It is demonstrated that by using the proposed codes WiNoCs can achieve the same reliability as a wireline NoC with much less energy dissipation and higher performance
Error Detection and Diagnosis for System-on-Chip in Space Applications
Tesis por compendio de publicacionesLos componentes electrónicos comerciales, comúnmente llamados componentes
Commercial-Off-The-Shelf (COTS) están presentes en multitud de dispositivos habituales
en nuestro día a día. Particularmente, el uso de microprocesadores y sistemas en chip (SoC)
altamente integrados ha favorecido la aparición de dispositivos electrónicos cada vez más
inteligentes que sostienen el estilo de vida y el avance de la sociedad moderna. Su uso se
ha generalizado incluso en aquellos sistemas que se consideran críticos para la seguridad,
como vehículos, aviones, armamento, dispositivos médicos, implantes o centrales eléctricas.
En cualquiera de ellos, un fallo podría tener graves consecuencias humanas o económicas.
Sin embargo, todos los sistemas electrónicos conviven constantemente con factores internos
y externos que pueden provocar fallos en su funcionamiento. La capacidad de un sistema
para funcionar correctamente en presencia de fallos se denomina tolerancia a fallos, y es
un requisito en el diseño y operación de sistemas críticos.
Los vehículos espaciales como satélites o naves espaciales también hacen uso de
microprocesadores para operar de forma autónoma o semi autónoma durante su vida útil,
con la dificultad añadida de que no pueden ser reparados en órbita, por lo que se consideran
sistemas críticos. Además, las duras condiciones existentes en el espacio, y en particular
los efectos de la radiación, suponen un gran desafío para el correcto funcionamiento de los
dispositivos electrónicos. Concretamente, los fallos transitorios provocados por radiación
(conocidos como soft errors) tienen el potencial de ser una de las mayores amenazas para
la fiabilidad de un sistema en el espacio.
Las misiones espaciales de gran envergadura, típicamente financiadas públicamente
como en el caso de la NASA o la Agencia Espacial Europea (ESA), han tenido
históricamente como requisito evitar el riesgo a toda costa por encima de cualquier
restricción de coste o plazo. Por ello, la selección de componentes resistentes a la radiación
(rad-hard) específicamente diseñados para su uso en el espacio ha sido la metodología
imperante en el paradigma que hoy podemos denominar industria espacial tradicional, u
Old Space. Sin embargo, los componentes rad-hard tienen habitualmente un coste mucho
más alto y unas prestaciones mucho menores que otros componentes COTS equivalentes.
De hecho, los componentes COTS ya han sido utilizados satisfactoriamente en misiones
de la NASA o la ESA cuando las prestaciones requeridas por la misión no podían ser
cubiertas por ningún componente rad-hard existente.
En los últimos años, el acceso al espacio se está facilitando debido en gran parte a la
entrada de empresas privadas en la industria espacial. Estas empresas no siempre buscan
evitar el riesgo a toda costa, sino que deben perseguir una rentabilidad económica, por
lo que hacen un balance entre riesgo, coste y plazo mediante gestión del riesgo en un
paradigma denominado Nuevo Espacio o New Space. Estas empresas a menudo están
interesadas en entregar servicios basados en el espacio con las máximas prestaciones y el mayor beneficio posibles, para lo cual los componentes rad-hard son menos atractivos
debido a su mayor coste y menores prestaciones que los componentes COTS existentes.
Sin embargo, los componentes COTS no han sido específicamente diseñados para su uso
en el espacio y típicamente no incluyen técnicas específicas para evitar que los efectos de
la radiación afecten su funcionamiento. Los componentes COTS se comercializan tal cual
son, y habitualmente no es posible modificarlos para mejorar su resistencia a la radiación.
Además, los elevados niveles de integración de los sistemas en chip (SoC) complejos
de altas prestaciones dificultan su observación y la aplicación de técnicas de tolerancia
a fallos. Este problema es especialmente relevante en el caso de los microprocesadores.
Por tanto, existe un gran interés en el desarrollo de técnicas que permitan conocer y
mejorar el comportamiento de los microprocesadores COTS bajo radiación sin modificar
su arquitectura y sin interferir en su funcionamiento para facilitar su uso en el espacio y
con ello maximizar las prestaciones de las misiones espaciales presentes y futuras.
En esta Tesis se han desarrollado técnicas novedosas para detectar, diagnosticar y
mitigar los errores producidos por radiación en microprocesadores y sistemas en chip
(SoC) comerciales, utilizando la interfaz de traza como punto de observación. La interfaz de
traza es un recurso habitual en los microprocesadores modernos, principalmente enfocado
a soportar las tareas de desarrollo y depuración del software durante la fase de diseño. Sin
embargo, una vez el desarrollo ha concluido, la interfaz de traza típicamente no se utiliza
durante la fase operativa del sistema, por lo que puede ser reutilizada sin coste. La interfaz
de traza constituye un punto de conexión viable para observar el comportamiento de un
microprocesador de forma no intrusiva y sin interferir en su funcionamiento.
Como resultado de esta Tesis se ha desarrollado un módulo IP capaz de recabar
y decodificar la información de traza de un microprocesador COTS moderno de altas
prestaciones. El IP es altamente configurable y personalizable para adaptarse a diferentes
aplicaciones y tipos de procesadores. Ha sido diseñado y validado utilizando el dispositivo
Zynq-7000 de Xilinx como plataforma de desarrollo, que constituye un dispositivo COTS
de interés en la industria espacial. Este dispositivo incluye un procesador ARM Cortex-A9
de doble núcleo, que es representativo del conjunto de microprocesadores hard-core
modernos de altas prestaciones. El IP resultante es compatible con la tecnología ARM
CoreSight, que proporciona acceso a información de traza en los microprocesadores ARM.
El IP incorpora técnicas para detectar errores en el flujo de ejecución y en los datos de la
aplicación ejecutada utilizando la información de traza, en tiempo real y con muy baja
latencia. El IP se ha validado en campañas de inyección de fallos y también en radiación con
protones y neutrones en instalaciones especializadas. También se ha combinado con otras
técnicas de tolerancia a fallos para construir técnicas híbridas de mitigación de errores.
Los resultados experimentales obtenidos demuestran su alta capacidad de detección y
potencialidad en el diagnóstico de errores producidos por radiación.
El resultado de esta Tesis, desarrollada en el marco de un Doctorado Industrial entre
la Universidad Carlos III de Madrid (UC3M) y la empresa Arquimea, se ha transferido satisfactoriamente al entorno empresarial en forma de un proyecto financiado por la
Agencia Espacial Europea para continuar su desarrollo y posterior explotación.Commercial electronic components, also known as Commercial-Off-The-Shelf (COTS),
are present in a wide variety of devices commonly used in our daily life. Particularly, the
use of microprocessors and highly integrated System-on-Chip (SoC) devices has fostered
the advent of increasingly intelligent electronic devices which sustain the lifestyles and the
progress of modern society. Microprocessors are present even in safety-critical systems,
such as vehicles, planes, weapons, medical devices, implants, or power plants. In any of
these cases, a fault could involve severe human or economic consequences. However, every
electronic system deals continuously with internal and external factors that could provoke
faults in its operation. The capacity of a system to operate correctly in presence of faults
is known as fault-tolerance, and it becomes a requirement in the design and operation of
critical systems.
Space vehicles such as satellites or spacecraft also incorporate microprocessors to
operate autonomously or semi-autonomously during their service life, with the additional
difficulty that they cannot be repaired once in-orbit, so they are considered critical systems.
In addition, the harsh conditions in space, and specifically radiation effects, involve a big
challenge for the correct operation of electronic devices. In particular, radiation-induced
soft errors have the potential to become one of the major risks for the reliability of systems
in space.
Large space missions, typically publicly funded as in the case of NASA or European
Space Agency (ESA), have followed historically the requirement to avoid the risk at any
expense, regardless of any cost or schedule restriction. Because of that, the selection of
radiation-resistant components (known as rad-hard) specifically designed to be used in
space has been the dominant methodology in the paradigm of traditional space industry,
also known as “Old Space”. However, rad-hard components have commonly a much higher
associated cost and much lower performance that other equivalent COTS devices. In fact,
COTS components have already been used successfully by NASA and ESA in missions
that requested such high performance that could not be satisfied by any available rad-hard
component.
In the recent years, the access to space is being facilitated in part due to the irruption
of private companies in the space industry. Such companies do not always seek to avoid
the risk at any cost, but they must pursue profitability, so they perform a trade-off between
risk, cost, and schedule through risk management in a paradigm known as “New Space”.
Private companies are often interested in deliver space-based services with the maximum
performance and maximum benefit as possible. With such objective, rad-hard components
are less attractive than COTS due to their higher cost and lower performance.
However, COTS components have not been specifically designed to be used in space
and typically they do not include specific techniques to avoid or mitigate the radiation effects in their operation. COTS components are commercialized “as is”, so it is not
possible to modify them to improve their susceptibility to radiation effects. Moreover,
the high levels of integration of complex, high-performance SoC devices hinder their
observability and the application of fault-tolerance techniques. This problem is especially
relevant in the case of microprocessors. Thus, there is a growing interest in the development
of techniques allowing to understand and improve the behavior of COTS microprocessors
under radiation without modifying their architecture and without interfering with their
operation. Such techniques may facilitate the use of COTS components in space and
maximize the performance of present and future space missions.
In this Thesis, novel techniques have been developed to detect, diagnose, and
mitigate radiation-induced errors in COTS microprocessors and SoCs using the trace
interface as an observation point. The trace interface is a resource commonly found
in modern microprocessors, mainly intended to support software development and
debugging activities during the design phase. However, it is commonly left unused
during the operational phase of the system, so it can be reused with no cost. The trace
interface constitutes a feasible connection point to observe microprocessor behavior in a
non-intrusive manner and without disturbing processor operation.
As a result of this Thesis, an IP module has been developed capable to gather and
decode the trace information of a modern, high-end, COTS microprocessor. The IP is highly
configurable and customizable to support different applications and processor types. The
IP has been designed and validated using the Xilinx Zynq-7000 device as a development
platform, which is an interesting COTS device for the space industry. This device features a
dual-core ARM Cortex-A9 processor, which is a good representative of modern, high-end,
hard-core microprocessors. The resulting IP is compatible with the ARM CoreSight
technology, which enables access to trace information in ARM microprocessors. The IP is
able to detect errors in the execution flow of the microprocessor and in the application data
using trace information, in real time and with very low latency. The IP has been validated
in fault injection campaigns and also under proton and neutron irradiation campaigns in
specialized facilities. It has also been combined with other fault-tolerance techniques
to build hybrid error mitigation approaches. Experimental results demonstrate its high
detection capabilities and high potential for the diagnosis of radiation-induced errors.
The result of this Thesis, developed in the framework of an Industrial Ph.D. between the
University Carlos III of Madrid (UC3M) and the company Arquimea, has been successfully
transferred to the company business as a project sponsored by European Space Agency to
continue its development and subsequent commercialization.Programa de Doctorado en Ingeniería Eléctrica, Electrónica y Automática por la Universidad Carlos III de MadridPresidenta: María Luisa López Vallejo.- Secretario: Enrique San Millán Heredia.- Vocal: Luigi Di Lill
2D Parity Product Code for TSV online fault correction and detection
Through-Silicon-Via (TSV) is one of the most promising technologies to realize 3D Integrated Circuits (3D-ICs). However, the reliability issues due to the low yield rates and the sensitivity to thermal hotspots and stress issues are preventing TSV-based 3D-ICs from being widely and efficiently used. To enhance the reliability of TSV connections, using error correction code to detect and correct faults automatically has been demonstrated as a viable solution.This paper presents a 2D Parity Product Code (2D-PPC) for TSV fault-tolerance with the ability to correct one fault and detect, at least, two faults. In an implementation of 64-bit data and 81-bit codeword, 2D-PPC can detect over 71 faults, on average. Its encoder and decoder decrease the overall latency by 38.33% when compared to the Single Error Correction Double Error Detection code. In addition to the high detection rates, the encoder can detect 100% of its gate failures, and the decoder can detect and correct around 40% of its individual gate failures. The squared 2D-PPC could be extended using orthogonal Latin square to support extra bit correction
AI/ML Algorithms and Applications in VLSI Design and Technology
An evident challenge ahead for the integrated circuit (IC) industry in the
nanometer regime is the investigation and development of methods that can
reduce the design complexity ensuing from growing process variations and
curtail the turnaround time of chip manufacturing. Conventional methodologies
employed for such tasks are largely manual; thus, time-consuming and
resource-intensive. In contrast, the unique learning strategies of artificial
intelligence (AI) provide numerous exciting automated approaches for handling
complex and data-intensive tasks in very-large-scale integration (VLSI) design
and testing. Employing AI and machine learning (ML) algorithms in VLSI design
and manufacturing reduces the time and effort for understanding and processing
the data within and across different abstraction levels via automated learning
algorithms. It, in turn, improves the IC yield and reduces the manufacturing
turnaround time. This paper thoroughly reviews the AI/ML automated approaches
introduced in the past towards VLSI design and manufacturing. Moreover, we
discuss the scope of AI/ML applications in the future at various abstraction
levels to revolutionize the field of VLSI design, aiming for high-speed, highly
intelligent, and efficient implementations
Innovative Techniques for Testing and Diagnosing SoCs
We rely upon the continued functioning of many electronic devices for our everyday welfare,
usually embedding integrated circuits that are becoming even cheaper and smaller
with improved features. Nowadays, microelectronics can integrate a working computer
with CPU, memories, and even GPUs on a single die, namely System-On-Chip (SoC).
SoCs are also employed on automotive safety-critical applications, but need to be tested
thoroughly to comply with reliability standards, in particular the ISO26262 functional
safety for road vehicles.
The goal of this PhD. thesis is to improve SoC reliability by proposing innovative
techniques for testing and diagnosing its internal modules: CPUs, memories, peripherals,
and GPUs. The proposed approaches in the sequence appearing in this thesis are described
as follows:
1. Embedded Memory Diagnosis: Memories are dense and complex circuits which
are susceptible to design and manufacturing errors. Hence, it is important to understand
the fault occurrence in the memory array. In practice, the logical and physical
array representation differs due to an optimized design which adds enhancements to
the device, namely scrambling. This part proposes an accurate memory diagnosis
by showing the efforts of a software tool able to analyze test results, unscramble
the memory array, map failing syndromes to cell locations, elaborate cumulative
analysis, and elaborate a final fault model hypothesis. Several SRAM memory failing
syndromes were analyzed as case studies gathered on an industrial automotive
32-bit SoC developed by STMicroelectronics. The tool displayed defects virtually,
and results were confirmed by real photos taken from a microscope.
2. Functional Test Pattern Generation: The key for a successful test is the pattern applied
to the device. They can be structural or functional; the former usually benefits
from embedded test modules targeting manufacturing errors and is only effective
before shipping the component to the client. The latter, on the other hand, can be
applied during mission minimally impacting on performance but is penalized due
to high generation time. However, functional test patterns may benefit for having
different goals in functional mission mode. Part III of this PhD thesis proposes
three different functional test pattern generation methods for CPU cores embedded
in SoCs, targeting different test purposes, described as follows:
a. Functional Stress Patterns: Are suitable for optimizing functional stress during
I
Operational-life Tests and Burn-in Screening for an optimal device reliability
characterization
b. Functional Power Hungry Patterns: Are suitable for determining functional
peak power for strictly limiting the power of structural patterns during manufacturing
tests, thus reducing premature device over-kill while delivering high test
coverage
c. Software-Based Self-Test Patterns: Combines the potentiality of structural patterns
with functional ones, allowing its execution periodically during mission.
In addition, an external hardware communicating with a devised SBST was proposed.
It helps increasing in 3% the fault coverage by testing critical Hardly
Functionally Testable Faults not covered by conventional SBST patterns.
An automatic functional test pattern generation exploiting an evolutionary algorithm
maximizing metrics related to stress, power, and fault coverage was employed
in the above-mentioned approaches to quickly generate the desired patterns. The
approaches were evaluated on two industrial cases developed by STMicroelectronics;
8051-based and a 32-bit Power Architecture SoCs. Results show that generation
time was reduced upto 75% in comparison to older methodologies while
increasing significantly the desired metrics.
3. Fault Injection in GPGPU: Fault injection mechanisms in semiconductor devices
are suitable for generating structural patterns, testing and activating mitigation techniques,
and validating robust hardware and software applications. GPGPUs are
known for fast parallel computation used in high performance computing and advanced
driver assistance where reliability is the key point. Moreover, GPGPU manufacturers
do not provide design description code due to content secrecy. Therefore,
commercial fault injectors using the GPGPU model is unfeasible, making radiation
tests the only resource available, but are costly. In the last part of this thesis, we
propose a software implemented fault injector able to inject bit-flip in memory elements
of a real GPGPU. It exploits a software debugger tool and combines the
C-CUDA grammar to wisely determine fault spots and apply bit-flip operations in
program variables. The goal is to validate robust parallel algorithms by studying
fault propagation or activating redundancy mechanisms they possibly embed. The
effectiveness of the tool was evaluated on two robust applications: redundant parallel
matrix multiplication and floating point Fast Fourier Transform
Self-Test Mechanisms for Automotive Multi-Processor System-on-Chips
L'abstract è presente nell'allegato / the abstract is in the attachmen
- …