A real-time defect detection in printed circuit boards applying deep learning

Inspection of defects in the printed circuit boards (PCBs) has both safety and economic significance in the 4.0 industrial manufacturing. Nevertheless, it is still a challenging problem to be studied in-depth due to the complexity of the PCB layouts and the shrinking down tendency of the electronic component size. In this paper, a real-time automated supervision algorithm is proposed to test the PCBs quality among different scenarios. The density of the PCBs layout and the complexity on the surface are analyzed based on deep learning and image feature extraction algorithms. To be more detailed, the ORB feature and the Brute-force matching method are utilized to match perfectly the input images with the PCB templates. After transferring images by aiding the RANSAC algorithm, a hybrid method using modern computer vision algorithms is developed to segment defective areas on the PCBs surface. Then, by applying the enhanced Residual Network –50, the proposed algorithm can classify the groove defects on the surface mount technology electronic components which minimum size up to 1x3 mm. After the training process, the proposed system is capable to categorize various types of overproduced, recycled, and cloned PCBs. The speed of the quality testing operation maintains at a high level with an average precision rate up to 96.29 % in case of good brightness conditions. Finally, the computational experiments demonstrate that the proposed system based on deep learning can obtain superior results and it outperforms several existing works in terms of speed, precision, and robustnes

Visual Inspection System To Detect Connector Tilts In PCBAs [TS156. V844 2005 f rb] [Microfiche 7845].

Sistem pemeriksaan visual automatic memainkan peranan penting dalam bahagian tapisan kualiti di industri eletronik. AVI’s are playing important roles in quality inspection in the electronic industry

Hectospec, the MMT's 300 Optical Fiber-Fed Spectrograph

The Hectospec is a 300 optical fiber fed spectrograph commissioned at the MMT in the spring of 2004. A pair of high-speed six-axis robots move the 300 fiber buttons between observing configurations within ~300 s and to an accuracy ~25 microns. The optical fibers run for 26 m between the MMT's focal surface and the bench spectrograph operating at R~1000-2000. Another high dispersion bench spectrograph offering R~5,000, Hectochelle, is also available. The system throughput, including all losses in the telescope optics, fibers, and spectrograph peaks at ~10% at the grating blaze in 1" FWHM seeing. Correcting for aperture losses at the 1.5" diameter fiber entrance aperture, the system throughput peaks at $\sim$17%. Hectospec has proven to be a workhorse instrument at the MMT. Hectospec and Hectochelle together were scheduled for 1/3 of the available nights since its commissioning. Hectospec has returned \~60,000 reduced spectra for 16 scientific programs during its first year of operation.Comment: 68 pages, 28 figures, to appear in December 2005 PAS

Integrated inpection of sculptured surface products using machine vision and a coordinate measuring machine

In modem manufacturing technology with increasing automation of manufacturing processes and operations, the need for automated measurement has become much more apparent. Computer measuring machines are one of the essential instruments for quality control and measurement of complex products, performing measurements that were previously laborious and time consuming. Inspection of sculptured surfaces can be time consuming since, for exact specification, an almost infinite number of points would be required. Automated measurement with a significant reduction of inspected points can be attempted if prior knowledge of the part shape is available. The use of a vision system can help to identify product shape and features but, unfortunately, the accuracy required is often insufficient. In this work a vision system used with a Coordinate Measuring Machine (CMM), incorporating probing, has enabled fast and accurate measurements to be obtained. The part features have been enhanced by surface marking and a simple 2-D vision system has been utilised to identify part features. In order to accurately identify all parts of the product using the 2-D vision system, a multiple image superposition method has been developed which enables 100 per cent identification of surface features. A method has been developed to generate approximate 3-D surface position from prior knowledge of the product shape. A probing strategy has been developed which selects correct probe angle for optimum accuracy and access, together with methods and software for automated CMM code generation. This has enabled accurate measurement of product features with considerable reductions in inspection time. Several strategies for the determination and assessment of feature position errors have been investigated and a method using a 3-D least squares assessment has been found to be satisfactory. A graphical representation of the product model and errors has been developed using a 3-D solid modelling CAD system. The work has used golf balls and tooling as the product example

The robotic multiobject focal plane system of the Dark Energy Spectroscopic Instrument (DESI)

Artículo escrito por un elevado número de autores, solo se referencian el que aparece en primer lugar, los autores pertenecientes a la UAM y el nombre del grupo de colaboración, si lo hubiereA system of 5020 robotic fiber positioners was installed in 2019 on the Mayall Telescope, at Kitt Peak National Observatory. The robots automatically retarget their optical fibers every 10-20 minutes, each to a precision of several microns, with a reconfiguration time of fewer than 2 minutes. Over the next 5 yr, they will enable the newly constructed Dark Energy Spectroscopic Instrument (DESI) to measure the spectra of 35 million galaxies and quasars. DESI will produce the largest 3D map of the universe to date and measure the expansion history of the cosmos. In addition to the 5020 robotic positioners and optical fibers, DESI’s Focal Plane System includes six guide cameras, four wave front cameras, 123 fiducial point sources, and a metrology camera mounted at the primary mirror. The system also includes associated structural, thermal, and electrical systems. In all, it contains over 675,000 individual parts. We discuss the design, construction, quality control, and integration of all these components. We include a summary of the key requirements, the review and acceptance process, on-sky validations of requirements, and lessons learned for future multiobject, fiber-fed spectrograph

The Robotic Multiobject Focal Plane System of the Dark Energy Spectroscopic Instrument (DESI)

A system of 5020 robotic fiber positioners was installed in 2019 on the Mayall Telescope, at Kitt Peak National Observatory. The robots automatically retarget their optical fibers every 10-20 minutes, each to a precision of several microns, with a reconfiguration time of fewer than 2 minutes. Over the next 5 yr, they will enable the newly constructed Dark Energy Spectroscopic Instrument (DESI) to measure the spectra of 35 million galaxies and quasars. DESI will produce the largest 3D map of the universe to date and measure the expansion history of the cosmos. In addition to the 5020 robotic positioners and optical fibers, DESI’s Focal Plane System includes six guide cameras, four wave front cameras, 123 fiducial point sources, and a metrology camera mounted at the primary mirror. The system also includes associated structural, thermal, and electrical systems. In all, it contains over 675,000 individual parts. We discuss the design, construction, quality control, and integration of all these components. We include a summary of the key requirements, the review and acceptance process, on-sky validations of requirements, and lessons learned for future multiobject, fiber-fed spectrographs

Ultrasonic sensor platforms for non-destructive evaluation

Robotic vehicles are receiving increasing attention for use in Non-Destructive Evaluation (NDE), due to their attractiveness in terms of cost, safety and their accessibility to areas where manual inspection is not practical. A reconfigurable Lamb wave scanner, using autonomous robotic platforms is presented. The scanner is built from a fleet of wireless miniature robotic vehicles, each with a non-contact ultrasonic payload capable of generating the A0 Lamb wave mode in plate specimens. An embedded Kalman filter gives the robots a positional accuracy of 10mm. A computer simulator, to facilitate the design and assessment of the reconfigurable scanner, is also presented. Transducer behaviour has been simulated using a Linear Systems approximation (LS), with wave propagation in the structure modelled using the Local Interaction Simulation Approach (LISA). Integration of the LS and LISA approaches were validated for use in Lamb wave scanning by comparison with both analytical techniques and more computationally intensive commercial finite element/diference codes. Starting with fundamental dispersion data, the work goes on to describe the simulation of wave propagation and the subsequent interaction with artificial defects and plate boundaries. The computer simulator was used to evaluate several imaging techniques, including local inspection of the area under the robot and an extended method that emits an ultrasonic wave and listens for echos (B-Scan). These algorithms were implemented in the robotic platform and experimental results are presented. The Synthetic Aperture Focusing Technique (SAFT) was evaluated as a means of improving the fidelity of B-Scan data. It was found that a SAFT is only effective for transducers with reasonably wide beam divergence, necessitating small transducers with a width of approximately 5mm. Finally, an algorithm for robot localisation relative to plate sections was proposed and experimentally validated

Height inspection of wafer bumps without explicit 3D reconstruction.

by Dong, Mei.Thesis (M.Phil.)--Chinese University of Hong Kong, 2007.Includes bibliographical references (leaves 83-90).Abstracts in English and Chinese.INTRODUCTION --- p.1Chapter 1.1 --- Bump Height Inspection --- p.1Chapter 1.2 --- Our Height Inspection System --- p.2Chapter 1.3 --- Thesis Outline --- p.3BACKGROUND --- p.5Chapter 2.1 --- Wafer Bumps --- p.5Chapter 2.2 --- Common Defects of Wafer Bumps --- p.7Chapter 2.3 --- Traditional Methods for Bump Inspection --- p.11BIPLANAR DISPARITY METHOD --- p.22Chapter 3.1 --- Problem Nature --- p.22Chapter 3.2 --- System Overview --- p.25Chapter 3.3 --- Biplanar Disparity Matrix D --- p.30Chapter 3.4 --- Planar Homography --- p.36Chapter 3.4.1 --- Planar Homography --- p.36Chapter 3.4.2 --- Homography Estimation --- p.39Chapter 3.5 --- Harris Corner Detector --- p.45Chapter 3.6 --- Experiments --- p.47Chapter 3.6.1 --- Synthetic Experiments --- p.47Chapter 3.6.2 --- Real image experiment --- p.52Chapter 3.7 --- Conclusion and problems --- p.61PARAPLANAR DISPARITY METHOD --- p.62Chapter 4.1 --- The Parallel Constraint --- p.63Chapter 4.2 --- Homography estimation --- p.66Chapter 4.3. --- Experiment: --- p.69Chapter 4.3.1 --- Synthetic Experiment: --- p.69Chapter 4.3.2 --- Real Image Experiment: --- p.74CONCLUSION AND FUTURE WORK --- p.80Chapter 5.1 --- Summary of the contributions --- p.80Chapter 5.2 --- Future Work --- p.81Publication related to this work: --- p.83BIBLIOGRAPHY --- p.8

Index to 1984 NASA Tech Briefs, volume 9, numbers 1-4

Short announcements of new technology derived from the R&D activities of NASA are presented. These briefs emphasize information considered likely to be transferrable across industrial, regional, or disciplinary lines and are issued to encourage commercial application. This index for 1984 Tech B Briefs contains abstracts and four indexes: subject, personal author, originating center, and Tech Brief Number. The following areas are covered: electronic components and circuits, electronic systems, physical sciences, materials, life sciences, mechanics, machinery, fabrication technology, and mathematics and information sciences

NASA Tech Briefs, April 1997

Topics covered include: Video and Imaging; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports