FieldPlacer - A flexible, fast and unconstrained force-directed placement method for heterogeneous reconfigurable logic architectures

The field of placement methods for components of integrated circuits, especially in the domain of reconfigurable chip architectures, is mainly dominated by a handful of concepts. While some of these are easy to apply but difficult to adapt to new situations, others are more flexible but rather complex to realize. This work presents the FieldPlacer framework, a flexible, fast and unconstrained force-directed placement method for heterogeneous reconfigurable logic architectures, in particular for the ever important heterogeneous FPGAs. In contrast to many other force-directed placers, this approach is called ‘unconstrained’ as it does not require a priori fixed logic elements in order to calculate a force equilibrium as the solution to a system of equations. Instead, it is based on a free spring embedder simulation of a graph representation which includes all logic block types of a design simultaneously. The FieldPlacer framework offers a huge amount of flexibility in applying different distance norms (e. g., the Manhattan distance) for the force-directed layout and aims at creating adapted layouts for various objective functions, e. g., highest performance or improved routability. Depending on the individual situation, a runtime-quality trade-off can be considered to either produce a decent placement in a very short time or to generate an exceptionally good placement, which takes longer. An extensive comparison with the latest simulated annealing placement method from the well-known Versatile Place and Route (VPR) framework shows that the FieldPlacer approach can create placements of comparable quality much faster than VPR or, alternatively, generate better placements in the same time. The flexibility in defining arbitrary objective functions and the intuitive adaptability of the method, which, among others, includes different concepts from the field of graph drawing, should facilitate further developments with this framework, e. g., for new upcoming optimization targets like the energy consumption of an implemented design

High-Performance Placement and Routing for the Nanometer Scale.

Modern semiconductor manufacturing facilitates single-chip electronic systems that only five years ago required ten to twenty chips. Naturally, design complexity has grown within this period. In contrast to this growth, it is becoming common in the industry to limit design team size which places a heavier burden on design automation tools. Our work identifies new objectives, constraints and concerns in the physical design of systems-on-chip, and develops new computational techniques to address them. In addition to faster and more relevant design optimizations, we demonstrate that traditional design flows based on ``separation of concerns'' produce unnecessarily suboptimal layouts. We develop new integrated optimizations that streamline traditional chains of loosely-linked design tools. In particular, we bridge the gap between mixed-size placement and routing by updating the objective of global and detail placement to a more accurate estimate of routed wirelength. To this we add sophisticated whitespace allocation, and the combination provides increased routability, faster routing, shorter routed wirelength, and the best via counts of published techniques. To further improve post-routing design metrics, we present new global routing techniques based on Discrete Lagrange Multipliers (DLM) which produce the best routed wirelength results on recent benchmarks. Our work culminates in the integration of our routing techniques within an incremental placement flow to improve detailed routing solutions, shrink die sizes and reduce total chip cost. Not only do our techniques improve the quality and cost of designs, but also simplify design automation software implementation in many cases. Ultimately, we reduce the time needed for design closure through improved tool fidelity and the use of our incremental techniques for placement and routing.Ph.D.Computer Science & EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/64639/1/royj_1.pd

Custom Cell Placement Automation for Asynchronous VLSI

Asynchronous Very-Large-Scale-Integration (VLSI) integrated circuits have demonstrated many advantages over their synchronous counterparts, including low power consumption, elastic pipelining, robustness against manufacturing and temperature variations, etc. However, the lack of dedicated electronic design automation (EDA) tools, especially physical layout automation tools, largely limits the adoption of asynchronous circuits. Existing commercial placement tools are optimized for synchronous circuits, and require a standard cell library provided by semiconductor foundries to complete the physical design. The physical layouts of cells in this library have the same height to simplify the placement problem and the power distribution network. Although the standard cell methodology also works for asynchronous designs, the performance is inferior compared with counterparts designed using the full-custom design methodology. To tackle this challenge, we propose a gridded cell layout methodology for asynchronous circuits, in which the cell height and cell width can be any integer multiple of two grid values. The gridded cell approach combines the shape regularity of standard cells with the size flexibility of full-custom layouts. Therefore, this approach can achieve a better space utilization ratio and lower wire length for asynchronous designs. Experiments have shown that the gridded cell placement approach reduces area without impacting the routability. We have also used this placer to tape out a chip in a 65nm process technology, demonstrating that our placer generates design-rule clean results

Rapid SoC Design: On Architectures, Methodologies and Frameworks

Modern applications like machine learning, autonomous vehicles, and 5G networking require an order of magnitude boost in processing capability. For several decades, chip designers have relied on Moore’s Law - the doubling of transistor count every two years to deliver improved performance, higher energy efficiency, and an increase in transistor density. With the end of Dennard’s scaling and a slowdown in Moore’s Law, system architects have developed several techniques to deliver on the traditional performance and power improvements we have come to expect. More recently, chip designers have turned towards heterogeneous systems comprised of more specialized processing units to buttress the traditional processing units. These specialized units improve the overall performance, power, and area (PPA) metrics across a wide variety of workloads and applications. While the GPU serves as a classical example, accelerators for machine learning, approximate computing, graph processing, and database applications have become commonplace. This has led to an exponential growth in the variety (and count) of these compute units found in modern embedded and high-performance computing platforms. The various techniques adopted to combat the slowing of Moore’s Law directly translates to an increase in complexity for modern system-on-chips (SoCs). This increase in complexity in turn leads to an increase in design effort and validation time for hardware and the accompanying software stacks. This is further aggravated by fabrication challenges (photo-lithography, tooling, and yield) faced at advanced technology nodes (below 28nm). The inherent complexity in modern SoCs translates into increased costs and time-to-market delays. This holds true across the spectrum, from mobile/handheld processors to high-performance data-center appliances. This dissertation presents several techniques to address the challenges of rapidly birthing complex SoCs. The first part of this dissertation focuses on foundations and architectures that aid in rapid SoC design. It presents a variety of architectural techniques that were developed and leveraged to rapidly construct complex SoCs at advanced process nodes. The next part of the dissertation focuses on the gap between a completed design model (in RTL form) and its physical manifestation (a GDS file that will be sent to the foundry for fabrication). It presents methodologies and a workflow for rapidly walking a design through to completion at arbitrary technology nodes. It also presents progress on creating tools and a flow that is entirely dependent on open-source tools. The last part presents a framework that not only speeds up the integration of a hardware accelerator into an SoC ecosystem, but emphasizes software adoption and usability.PHDElectrical and Computer EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/168119/1/ajayi_1.pd

AI/ML Algorithms and Applications in VLSI Design and Technology

An evident challenge ahead for the integrated circuit (IC) industry in the nanometer regime is the investigation and development of methods that can reduce the design complexity ensuing from growing process variations and curtail the turnaround time of chip manufacturing. Conventional methodologies employed for such tasks are largely manual; thus, time-consuming and resource-intensive. In contrast, the unique learning strategies of artificial intelligence (AI) provide numerous exciting automated approaches for handling complex and data-intensive tasks in very-large-scale integration (VLSI) design and testing. Employing AI and machine learning (ML) algorithms in VLSI design and manufacturing reduces the time and effort for understanding and processing the data within and across different abstraction levels via automated learning algorithms. It, in turn, improves the IC yield and reduces the manufacturing turnaround time. This paper thoroughly reviews the AI/ML automated approaches introduced in the past towards VLSI design and manufacturing. Moreover, we discuss the scope of AI/ML applications in the future at various abstraction levels to revolutionize the field of VLSI design, aiming for high-speed, highly intelligent, and efficient implementations

Doctor of Philosophy

dissertationRecent breakthroughs in silicon photonics technology are enabling the integration of optical devices into silicon-based semiconductor processes. Photonics technology enables high-speed, high-bandwidth, and high-fidelity communications on the chip-scale-an important development in an increasingly communications-oriented semiconductor world. Significant developments in silicon photonic manufacturing and integration are also enabling investigations into applications beyond that of traditional telecom: sensing, filtering, signal processing, quantum technology-and even optical computing. In effect, we are now seeing a convergence of communications and computation, where the traditional roles of optics and microelectronics are becoming blurred. As the applications for opto-electronic integrated circuits (OEICs) are developed, and manufacturing capabilities expand, design support is necessary to fully exploit the potential of this optics technology. Such design support for moving beyond custom-design to automated synthesis and optimization is not well developed. Scalability requires abstractions, which in turn enables and requires the use of optimization algorithms and design methodology flows. Design automation represents an opportunity to take OEIC design to a larger scale, facilitating design-space exploration, and laying the foundation for current and future optical applications-thus fully realizing the potential of this technology. This dissertation proposes design automation for integrated optic system design. Using a buildingblock model for optical devices, we provide an EDA-inspired design flow and methodologies for optical design automation. Underlying these flows and methodologies are new supporting techniques in behavioral and physical synthesis, as well as device-resynthesis techniques for thermal-aware system integration. We also provide modeling for optical devices and determine optimization and constraint parameters that guide the automation techniques. Our techniques and methodologies are then applied to the design and optimization of optical circuits and devices. Experimental results are analyzed to evaluate their efficacy. We conclude with discussions on the contributions and limitations of the approaches in the context of optical design automation, and describe the tremendous opportunities for future research in design automation for integrated optics

Technology 2002: the Third National Technology Transfer Conference and Exposition, Volume 1

The proceedings from the conference are presented. The topics covered include the following: computer technology, advanced manufacturing, materials science, biotechnology, and electronics

Proceedings of the 19th Sound and Music Computing Conference

Proceedings of the 19th Sound and Music Computing Conference - June 5-12, 2022 - Saint-Étienne (France). https://smc22.grame.f

An Energy-Efficient and Reliable Data Transmission Scheme for Transmitter-based Energy Harvesting Networks

Energy harvesting technology has been studied to overcome a limited power resource problem for a sensor network. This paper proposes a new data transmission period control and reliable data transmission algorithm for energy harvesting based sensor networks. Although previous studies proposed a communication protocol for energy harvesting based sensor networks, it still needs additional discussion. Proposed algorithm control a data transmission period and the number of data transmission dynamically based on environment information. Through this, energy consumption is reduced and transmission reliability is improved. The simulation result shows that the proposed algorithm is more efficient when compared with previous energy harvesting based communication standard, Enocean in terms of transmission success rate and residual energy.This research was supported by Basic Science Research Program through the National Research Foundation by Korea (NRF) funded by the Ministry of Education, Science and Technology(2012R1A1A3012227)