2,386 research outputs found

    Circuit techniques for low-voltage and high-speed A/D converters

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    The increasing digitalization in all spheres of electronics applications, from telecommunications systems to consumer electronics appliances, requires analog-to-digital converters (ADCs) with a higher sampling rate, higher resolution, and lower power consumption. The evolution of integrated circuit technologies partially helps in meeting these requirements by providing faster devices and allowing for the realization of more complex functions in a given silicon area, but simultaneously it brings new challenges, the most important of which is the decreasing supply voltage. Based on the switched capacitor (SC) technique, the pipelined architecture has most successfully exploited the features of CMOS technology in realizing high-speed high-resolution ADCs. An analysis of the effects of the supply voltage and technology scaling on SC circuits is carried out, and it shows that benefits can be expected at least for the next few technology generations. The operational amplifier is a central building block in SC circuits, and thus a comparison of the topologies and their low voltage capabilities is presented. It is well-known that the SC technique in its standard form is not suitable for very low supply voltages, mainly because of insufficient switch control voltage. Two low-voltage modifications are investigated: switch bootstrapping and the switched opamp (SO) technique. Improved circuit structures are proposed for both. Two ADC prototypes using the SO technique are presented, while bootstrapped switches are utilized in three other prototypes. An integral part of an ADC is the front-end sample-and-hold (S/H) circuit. At high signal frequencies its linearity is predominantly determined by the switches utilized. A review of S/H architectures is presented, and switch linearization by means of bootstrapping is studied and applied to two of the prototypes. Another important parameter is sampling clock jitter, which is analyzed and then minimized with carefully-designed clock generation and buffering. The throughput of ADCs can be increased by using parallelism. This is demonstrated on the circuit level with the double-sampling technique, which is applied to S/H circuits and a pipelined ADC. An analysis of nonidealities in double-sampling is presented. At the system level parallelism is utilized in a time-interleaved ADC. The mismatch of parallel signal paths produces errors, for the elimination of which a timing skew insensitive sampling circuit and a digital offset calibration are developed. A total of seven prototypes are presented: two double-sampled S/H circuits, a time-interleaved ADC, an IF-sampling self-calibrated pipelined ADC, a current steering DAC with a deglitcher, and two pipelined ADCs employing the SO technique.reviewe

    Single-Event Upset Analysis and Protection in High Speed Circuits

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    The effect of single-event transients (SETs) (at a combinational node of a design) on the system reliability is becoming a big concern for ICs manufactured using advanced technologies. An SET at a node of combinational part may cause a transient pulse at the input of a flip-flop and consequently is latched in the flip-flop and generates a soft-error. When an SET conjoined with a transition at a node along a critical path of the combinational part of a design, a transient delay fault may occur at the input of a flip-flop. On the other hand, increasing pipeline depth and using low power techniques such as multi-level power supply, and multi-threshold transistor convert almost all paths in a circuit to critical ones. Thus, studying the behavior of the SET in these kinds of circuits needs special attention. This paper studies the dynamic behavior of a circuit with massive critical paths in the presence of an SET. We also propose a novel flip-flop architecture to mitigate the effects of such SETs in combinational circuits. Furthermore, the proposed architecture can tolerant a single event upset (SEU) caused by particle strike on the internal nodes of a flip-flo

    Low-power 6-bit 1-GS/s two-channel pipeline ADC with open-loop amplification using amplifiers with local-feedback

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    IEEE International Symposium on Circuits and Systems, pp. 2258 โ€“ 2261, Seattle, EUAA low-power 1.2 V 6-bit 1-GS/s time-interleaved pipeline ADC designed in 130 nm CMOS is described. It is based on a new 2-channel 1.5-bit MDAC that performs openloop residue amplification using a shared amplifier employing local-feedback. Time mismatches between channels are highly attenuated, simply by using two passive front-end Sample-and-Hold circuits, with dedicated switch-linearization control circuits, driven by a single clock phase. Simulated results of the ADC achieve 5.35-bit ENOB, with 20 mW and without requiring any gain control/calibration scheme

    Doctor of Philosophy

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    dissertationCommunication surpasses computation as the power and performance bottleneck in forthcoming exascale processors. Scaling has made transistors cheap, but on-chip wires have grown more expensive, both in terms of latency as well as energy. Therefore, the need for low energy, high performance interconnects is highly pronounced, especially for long distance communication. In this work, we examine two aspects of the global signaling problem. The first part of the thesis focuses on a high bandwidth asynchronous signaling protocol for long distance communication. Asynchrony among intellectual property (IP) cores on a chip has become necessary in a System on Chip (SoC) environment. Traditional asynchronous handshaking protocol suffers from loss of throughput due to the added latency of sending the acknowledge signal back to the sender. We demonstrate a method that supports end-to-end communication across links with arbitrarily large latency, without limiting the bandwidth, so long as line variation can be reliably controlled. We also evaluate the energy and latency improvements as a result of the design choices made available by this protocol. The use of transmission lines as a physical interconnect medium shows promise for deep submicron technologies. In our evaluations, we notice a lower energy footprint, as well as vastly reduced wire latency for transmission line interconnects. We approach this problem from two sides. Using field solvers, we investigate the physical design choices to determine the optimal way to implement these lines for a given back-end-of-line (BEOL) stack. We also approach the problem from a system designer's viewpoint, looking at ways to optimize the lines for different performance targets. This work analyzes the advantages and pitfalls of implementing asynchronous channel protocols for communication over long distances. Finally, the innovations resulting from this work are applied to a network-on-chip design example and the resulting power-performance benefits are reported

    ๊ณ ์† DRAM ์ธํ„ฐํŽ˜์ด์Šค๋ฅผ ์œ„ํ•œ ์ „์•• ๋ฐ ์˜จ๋„์— ๋‘”๊ฐํ•œ ํด๋ก ํŒจ์Šค์™€ ์œ„์ƒ ์˜ค๋ฅ˜ ๊ต์ •๊ธฐ ์„ค๊ณ„

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    ํ•™์œ„๋…ผ๋ฌธ (๋ฐ•์‚ฌ) -- ์„œ์šธ๋Œ€ํ•™๊ต ๋Œ€ํ•™์› : ๊ณต๊ณผ๋Œ€ํ•™ ์ „๊ธฐยท์ •๋ณด๊ณตํ•™๋ถ€, 2021. 2. ์ •๋•๊ท .To cope with problems caused by the high-speed operation of the dynamic random access memory (DRAM) interface, several approaches are proposed that are focused on the clock path of the DRAM. Two delay-locked loop (DLL) based schemes, a forwarded-clock (FC) receiver (RX) with self-tracking loop and a quadrature error corrector, are proposed. Moreover, an open-loop based scheme is presented for drift compensation in the clock distribution. The open-loop scheme consumes less power consumption and reduces design complexity. The FC RX uses DLLs to compensate for voltage and temperature (VT) drift in unmatched memory interfaces. The self-tracking loop consists of two-stage cascaded DLLs to operate in a DRAM environment. With the write training and the proposed DLL, the timing relationship between the data and the sampling clock is always optimal. The proposed scheme compensates for delay drift without relying on data transitions or re-training. The proposed FC RX is fabricated in 65-nm CMOS process and has an active area containing 4 data lanes of 0.0329 mm2. After the write training is completed at the supply voltage of 1 V, the measured timing margin remains larger than 0.31-unit interval (UI) when the supply voltage drifts in the range of 0.94 V and 1.06 V from the training voltage, 1 V. At the data rate of 6.4 Gb/s, the proposed FC RX achieves an energy efficiency of 0.45 pJ/bit. Contrary to the aforementioned scheme, an open-loop-based voltage drift compensation method is proposed to minimize power consumption and occupied area. The overall clock distribution is composed of a current mode logic (CML) path and a CMOS path. In the proposed scheme, the architecture of the CML-to-CMOS converter (C2C) and the inverter is changed to compensate for supply voltage drift. The bias generator provides bias voltages to the C2C and inverters according to supply voltage for delay adjustment. The proposed clock tree is fabricated in 40 nm CMOS process and the active area is 0.004 mm2. When the supply voltage is modulated by a sinusoidal wave with 1 MHz, 100 mV peak-to-peak swing from the center of 1.1 V, applying the proposed scheme reduces the measured root-mean-square (RMS) jitter from 3.77 psRMS to 1.61 psRMS. At 6 GHz output clock, the power consumption of the proposed scheme is 11.02 mW. A DLL-based quadrature error corrector (QEC) with a wide correction range is proposed for the DRAM whose clocks are distributed over several millimeters. The quadrature error is corrected by adjusting delay lines using information from the phase error detector. The proposed error correction method minimizes increased jitter due to phase error correction by setting at least one of the delay lines in the quadrature clock path to the minimum delay. In addition, the asynchronous calibration on-off scheme reduces power consumption after calibration is complete. The proposed QEC is fabricated in 40 nm CMOS process and has an active area of 0.048 mm2. The proposed QEC exhibits a wide correctable error range of 101.6 ps and the remaining phase errors are less than 2.18ยฐ from 0.8 GHz to 2.3 GHz clock. At 2.3 GHz, the QEC contributes 0.53 psRMS jitter. Also, at 2.3 GHz, the power consumption is reduced from 8.89 mW to 3.39 mW when the calibration is off.๋ณธ ๋…ผ๋ฌธ์—์„œ๋Š” ๋™์  ๋žœ๋ค ์•ก์„ธ์Šค ๋ฉ”๋ชจ๋ฆฌ (DRAM)์˜ ์†๋„๊ฐ€ ์ฆ๊ฐ€ํ•จ์— ๋”ฐ๋ผ ํด๋ก ํŒจ์Šค์—์„œ ๋ฐœ์ƒํ•  ์ˆ˜ ์žˆ๋Š” ๋ฌธ์ œ์— ๋Œ€์ฒ˜ํ•˜๊ธฐ ์œ„ํ•œ ์„ธ ๊ฐ€์ง€ ํšŒ๋กœ๋“ค์„ ์ œ์•ˆํ•˜์˜€๋‹ค. ์ œ์•ˆํ•œ ํšŒ๋กœ๋“ค ์ค‘ ๋‘ ๋ฐฉ์‹๋“ค์€ ์ง€์—ฐ๋™๊ธฐ๋ฃจํ”„ (delay-locked loop) ๋ฐฉ์‹์„ ์‚ฌ์šฉํ•˜์˜€๊ณ  ๋‚˜๋จธ์ง€ ํ•œ ๋ฐฉ์‹์€ ๋ฉด์ ๊ณผ ์ „๋ ฅ ์†Œ๋ชจ๋ฅผ ์ค„์ด๊ธฐ ์œ„ํ•ด ์˜คํ”ˆ ๋ฃจํ”„ ๋ฐฉ์‹์„ ์‚ฌ์šฉํ•˜์˜€๋‹ค. DRAM์˜ ๋น„์ •ํ•ฉ ์ˆ˜์‹ ๊ธฐ ๊ตฌ์กฐ์—์„œ ๋ฐ์ดํ„ฐ ํŒจ์Šค์™€ ํด๋ก ํŒจ์Šค ๊ฐ„์˜ ์ง€์—ฐ ๋ถˆ์ผ์น˜๋กœ ์ธํ•ด ์ „์•• ๋ฐ ์˜จ๋„ ๋ณ€ํ™”์— ๋”ฐ๋ผ ์…‹์—… ํƒ€์ž„ ๋ฐ ํ™€๋“œ ํƒ€์ž„์ด ์ค„์–ด๋“œ๋Š” ๋ฌธ์ œ๋ฅผ ํ•ด๊ฒฐํ•˜๊ธฐ ์œ„ํ•ด ์ง€์—ฐ๋™๊ธฐ๋ฃจํ”„๋ฅผ ์‚ฌ์šฉํ•˜์˜€๋‹ค. ์ œ์•ˆํ•œ ์ง€์—ฐ๋™๊ธฐ๋ฃจํ”„ ํšŒ๋กœ๋Š” DRAM ํ™˜๊ฒฝ์—์„œ ๋™์ž‘ํ•˜๋„๋ก ๋‘ ๊ฐœ์˜ ์ง€์—ฐ๋™๊ธฐ๋ฃจํ”„๋กœ ๋‚˜๋ˆ„์—ˆ๋‹ค. ๋˜ํ•œ ์ดˆ๊ธฐ ์“ฐ๊ธฐ ํ›ˆ๋ จ์„ ํ†ตํ•ด ๋ฐ์ดํ„ฐ์™€ ํด๋ก์„ ํƒ€์ด๋ฐ ๋งˆ์ง„ ๊ด€์ ์—์„œ ์ตœ์ ์˜ ์œ„์น˜์— ๋‘˜ ์ˆ˜ ์žˆ๋‹ค. ๋”ฐ๋ผ์„œ ์ œ์•ˆํ•˜๋Š” ๋ฐฉ์‹์€ ๋ฐ์ดํ„ฐ ์ฒœ์ด ์ •๋ณด๊ฐ€ ํ•„์š”ํ•˜์ง€ ์•Š๋‹ค. 65-nm CMOS ๊ณต์ •์„ ์ด์šฉํ•˜์—ฌ ๋งŒ๋“ค์–ด์ง„ ์นฉ์€ 6.4 Gb/s์—์„œ 0.45 pJ/bit์˜ ์—๋„ˆ์ง€ ํšจ์œจ์„ ๊ฐ€์ง„๋‹ค. ๋˜ํ•œ 1 V์—์„œ ์“ฐ๊ธฐ ํ›ˆ๋ จ ๋ฐ ์ง€์—ฐ๋™๊ธฐ๋ฃจํ”„๋ฅผ ๊ณ ์ •์‹œํ‚ค๊ณ  0.94 V์—์„œ 1.06 V๊นŒ์ง€ ๊ณต๊ธ‰ ์ „์••์ด ๋ฐ”๋€Œ์—ˆ์„ ๋•Œ ํƒ€์ด๋ฐ ๋งˆ์ง„์€ 0.31 UI๋ณด๋‹ค ํฐ ๊ฐ’์„ ์œ ์ง€ํ•˜์˜€๋‹ค. ๋‹ค์Œ์œผ๋กœ ์ œ์•ˆํ•˜๋Š” ํšŒ๋กœ๋Š” ํด๋ก ๋ถ„ํฌ ํŠธ๋ฆฌ์—์„œ ์ „์•• ๋ณ€ํ™”๋กœ ์ธํ•ด ํด๋ก ํŒจ์Šค์˜ ์ง€์—ฐ์ด ๋‹ฌ๋ผ์ง€๋Š” ๊ฒƒ์„ ์•ž์„œ ์ œ์‹œํ•œ ๋ฐฉ์‹๊ณผ ๋‹ฌ๋ฆฌ ์˜คํ”ˆ ๋ฃจํ”„ ๋ฐฉ์‹์œผ๋กœ ๋ณด์ƒํ•˜์˜€๋‹ค. ๊ธฐ์กด ํด๋ก ํŒจ์Šค์˜ ์ธ๋ฒ„ํ„ฐ์™€ CML-to-CMOS ๋ณ€ํ™˜๊ธฐ์˜ ๊ตฌ์กฐ๋ฅผ ๋ณ€๊ฒฝํ•˜์—ฌ ๋ฐ”์ด์–ด์Šค ์ƒ์„ฑ ํšŒ๋กœ์—์„œ ์ƒ์„ฑํ•œ ๊ณต๊ธ‰ ์ „์••์— ๋”ฐ๋ผ ๋ฐ”๋€Œ๋Š” ๋ฐ”์ด์–ด์Šค ์ „์••์„ ๊ฐ€์ง€๊ณ  ์ง€์—ฐ์„ ์กฐ์ ˆํ•  ์ˆ˜ ์žˆ๊ฒŒ ํ•˜์˜€๋‹ค. 40-nm CMOS ๊ณต์ •์„ ์ด์šฉํ•˜์—ฌ ๋งŒ๋“ค์–ด์ง„ ์นฉ์˜ 6 GHz ํด๋ก์—์„œ์˜ ์ „๋ ฅ ์†Œ๋ชจ๋Š” 11.02 mW๋กœ ์ธก์ •๋˜์—ˆ๋‹ค. 1.1 V ์ค‘์‹ฌ์œผ๋กœ 1 MHz, 100 mV ํ”ผํฌ ํˆฌ ํ”ผํฌ๋ฅผ ๊ฐ€์ง€๋Š” ์‚ฌ์ธํŒŒ ์„ฑ๋ถ„์œผ๋กœ ๊ณต๊ธ‰ ์ „์••์„ ๋ณ€์กฐํ•˜์˜€์„ ๋•Œ ์ œ์•ˆํ•œ ๋ฐฉ์‹์—์„œ์˜ ์ง€ํ„ฐ๋Š” ๊ธฐ์กด ๋ฐฉ์‹์˜ 3.77 psRMS์—์„œ 1.61 psRMS๋กœ ์ค„์–ด๋“ค์—ˆ๋‹ค. DRAM์˜ ์†ก์‹ ๊ธฐ ๊ตฌ์กฐ์—์„œ ๋‹ค์ค‘ ์œ„์ƒ ํด๋ก ๊ฐ„์˜ ์œ„์ƒ ์˜ค์ฐจ๋Š” ์†ก์‹ ๋œ ๋ฐ์ดํ„ฐ์˜ ๋ฐ์ดํ„ฐ ์œ ํšจ ์ฐฝ์„ ๊ฐ์†Œ์‹œํ‚จ๋‹ค. ์ด๋ฅผ ํ•ด๊ฒฐํ•˜๊ธฐ ์œ„ํ•ด ์ง€์—ฐ๋™๊ธฐ๋ฃจํ”„๋ฅผ ๋„์ž…ํ•˜๊ฒŒ ๋˜๋ฉด ์ฆ๊ฐ€๋œ ์ง€์—ฐ์œผ๋กœ ์ธํ•ด ์œ„์ƒ์ด ๊ต์ •๋œ ํด๋ก์—์„œ ์ง€ํ„ฐ๊ฐ€ ์ฆ๊ฐ€ํ•œ๋‹ค. ๋ณธ ๋…ผ๋ฌธ์—์„œ๋Š” ์ฆ๊ฐ€๋œ ์ง€ํ„ฐ๋ฅผ ์ตœ์†Œํ™”ํ•˜๊ธฐ ์œ„ํ•ด ์œ„์ƒ ๊ต์ •์œผ๋กœ ์ธํ•ด ์ฆ๊ฐ€๋œ ์ง€์—ฐ์„ ์ตœ์†Œํ™”ํ•˜๋Š” ์œ„์ƒ ๊ต์ • ํšŒ๋กœ๋ฅผ ์ œ์‹œํ•˜์˜€๋‹ค. ๋˜ํ•œ ์œ ํœด ์ƒํƒœ์—์„œ ์ „๋ ฅ ์†Œ๋ชจ๋ฅผ ์ค„์ด๊ธฐ ์œ„ํ•ด ์œ„์ƒ ์˜ค์ฐจ๋ฅผ ๊ต์ •ํ•˜๋Š” ํšŒ๋กœ๋ฅผ ์ž…๋ ฅ ํด๋ก๊ณผ ๋น„๋™๊ธฐ์‹์œผ๋กœ ๋Œ ์ˆ˜ ์žˆ๋Š” ๋ฐฉ๋ฒ• ๋˜ํ•œ ์ œ์•ˆํ•˜์˜€๋‹ค. 40-nm CMOS ๊ณต์ •์„ ์ด์šฉํ•˜์—ฌ ๋งŒ๋“ค์–ด์ง„ ์นฉ์˜ ์œ„์ƒ ๊ต์ • ๋ฒ”์œ„๋Š” 101.6 ps์ด๊ณ  0.8 GHz ๋ถ€ํ„ฐ 2.3 GHz๊นŒ์ง€์˜ ๋™์ž‘ ์ฃผํŒŒ์ˆ˜ ๋ฒ”์œ„์—์„œ ์œ„์ƒ ๊ต์ •๊ธฐ์˜ ์ถœ๋ ฅ ํด๋ก์˜ ์œ„์ƒ ์˜ค์ฐจ๋Š” 2.18ยฐ๋ณด๋‹ค ์ž‘๋‹ค. ์ œ์•ˆํ•˜๋Š” ์œ„์ƒ ๊ต์ • ํšŒ๋กœ๋กœ ์ธํ•ด ์ถ”๊ฐ€๋œ ์ง€ํ„ฐ๋Š” 2.3 GHz์—์„œ 0.53 psRMS์ด๊ณ  ๊ต์ • ํšŒ๋กœ๋ฅผ ๊ป์„ ๋•Œ ์ „๋ ฅ ์†Œ๋ชจ๋Š” ๊ต์ • ํšŒ๋กœ๊ฐ€ ์ผœ์กŒ์„ ๋•Œ์ธ 8.89 mW์—์„œ 3.39 mW๋กœ ์ค„์–ด๋“ค์—ˆ๋‹ค.Chapter 1 Introduction 1 1.1 Motivation 1 1.2 Thesis Organization 4 Chapter 2 Background on DRAM Interface 5 2.1 Overview 5 2.2 Memory Interface 7 Chapter 3 Background on DLL 11 3.1 Overview 11 3.2 Building Blocks 15 3.2.1 Delay Line 15 3.2.2 Phase Detector 17 3.2.3 Charge Pump 19 3.2.4 Loop filter 20 Chapter 4 Forwarded-Clock Receiver with DLL-based Self-tracking Loop for Unmatched Memory Interfaces 21 4.1 Overview 21 4.2 Proposed Separated DLL 25 4.2.1 Operation of the Proposed Separated DLL 27 4.2.2 Operation of the Digital Loop Filter in DLL 31 4.3 Circuit Implementation 33 4.4 Measurement Results 37 4.4.1 Measurement Setup and Sequence 38 4.4.2 VT Drift Measurement and Simulation 40 Chapter 5 Open-loop-based Voltage Drift Compensation in Clock Distribution 46 5.1 Overview 46 5.2 Prior Works 50 5.3 Voltage Drift Compensation Method 52 5.4 Circuit Implementation 57 5.5 Measurement Results 61 Chapter 6 Quadrature Error Corrector with Minimum Total Delay Tracking 68 6.1 Overview 68 6.2 Prior Works 70 6.3 Quadrature Error Correction Method 73 6.4 Circuit Implementation 82 6.5 Measurement Results 88 Chapter 7 Conclusion 96 Bibliography 98 ์ดˆ๋ก 102Docto

    A 10-bit 40MS/s Pipelined ADC in a 0.13ฮผm CMOS Process

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    This paper presents a 10-bit analogue to digital converter (ADC) that will be integrated in a general purpose charge readout ASIC that is the new generation of mixed-mode integrated circuits for Time Projection Chamber (TPC) readout. It is based on a pipelined structure with double sampling and was implemented with switched capacitor circuits in eight 1.5-bit stages followed by a 2-bit stage. The power consumption is adjustable with the conversion rate and varies between 15 and 34mW for a 15 to 40MS/s conversion speed. The ADC occupies a silicon area of 0.7mm2 in a 0.13ฮผm CMOS process and operates from a single 1.5V supply

    Computational structures for application specific VLSI processors

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    Sophisticated security verification on routing repaired balanced cell-based dual-rail logic against side channel analysis

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    Conventional dual-rail precharge logic suffers from difficult implementations of dual-rail structure for obtaining strict compensation between the counterpart rails. As a light-weight and high-speed dual-rail style, balanced cell-based dual-rail logic (BCDL) uses synchronised compound gates with global precharge signal to provide high resistance against differential power or electromagnetic analyses. BCDL can be realised from generic field programmable gate array (FPGA) design flows with constraints. However, routings still exist as concerns because of the deficient flexibility on routing control, which unfavourably results in bias between complementary nets in security-sensitive parts. In this article, based on a routing repair technique, novel verifications towards routing effect are presented. An 8 bit simplified advanced encryption processing (AES)-co-processor is executed that is constructed on block random access memory (RAM)-based BCDL in Xilinx Virtex-5 FPGAs. Since imbalanced routing are major defects in BCDL, the authors can rule out other influences and fairly quantify the security variants. A series of asymptotic correlation electromagnetic (EM) analyses are launched towards a group of circuits with consecutive routing schemes to be able to verify routing impact on side channel analyses. After repairing the non-identical routings, Mutual information analyses are executed to further validate the concrete security increase obtained from identical routing pairs in BCDL

    Reliable interface design for combining asynchronous and synchronous circuits

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    Journal ArticleAbstract: In order to successfully integrate asynchronous and synchronous designs, great care must be taken at the interface between the two types of systems. Synchronizing asynchronous inputs with a free running clock can cause well-known problems with metastability in the synchronization circuits. Stretchable clocks allow a clock cycle to expand dynamically in response to the metastability effects of sampling asynchronous inputs. We use an interface organization where the special circuitry for detecting metastability and for stretching the clock that is delivered to the synchronous part of the system is encapsulated in a Q-flop-based interface. This provides a very convenient method for interfacing mixed systems, as the interface and clock generation circuitry are isolated into one special module, and neither the asynchronous nor the synchronous system need be modified internally to accommodate the interface. This is especially important when standard synchronous components are used as there is no opportunity to modify these parts. We show that this interface module is suitable for most mixed design needs and conclude with an example
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