330 research outputs found

    Product assurance technology for custom LSI/VLSI electronics

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    The technology for obtaining custom integrated circuits from CMOS-bulk silicon foundries using a universal set of layout rules is presented. The technical efforts were guided by the requirement to develop a 3 micron CMOS test chip for the Combined Release and Radiation Effects Satellite (CRRES). This chip contains both analog and digital circuits. The development employed all the elements required to obtain custom circuits from silicon foundries, including circuit design, foundry interfacing, circuit test, and circuit qualification

    Second year technical report on-board processing for future satellite communications systems

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    Advanced baseband and microwave switching techniques for large domestic communications satellites operating in the 30/20 GHz frequency bands are discussed. The nominal baseband processor throughput is one million packets per second (1.6 Gb/s) from one thousand T1 carrier rate customer premises terminals. A frequency reuse factor of sixteen is assumed by using 16 spot antenna beams with the same 100 MHz bandwidth per beam and a modulation with a one b/s per Hz bandwidth efficiency. Eight of the beams are fixed on major metropolitan areas and eight are scanning beams which periodically cover the remainder of the U.S. under dynamic control. User signals are regenerated (demodulated/remodulated) and message packages are reformatted on board. Frequency division multiple access and time division multiplex are employed on the uplinks and downlinks, respectively, for terminals within the coverage area and dwell interval of a scanning beam. Link establishment and packet routing protocols are defined. Also described is a detailed design of a separate 100 x 100 microwave switch capable of handling nonregenerated signals occupying the remaining 2.4 GHz bandwidth with 60 dB of isolation, at an estimated weight and power consumption of approximately 400 kg and 100 W, respectively

    Product assurance technology for procuring reliable, radiation-hard, custom LSI/VLSI electronics

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    Advanced measurement methods using microelectronic test chips are described. These chips are intended to be used in acquiring the data needed to qualify Application Specific Integrated Circuits (ASIC's) for space use. Efforts were focused on developing the technology for obtaining custom IC's from CMOS/bulk silicon foundries. A series of test chips were developed: a parametric test strip, a fault chip, a set of reliability chips, and the CRRES (Combined Release and Radiation Effects Satellite) chip, a test circuit for monitoring space radiation effects. The technical accomplishments of the effort include: (1) development of a fault chip that contains a set of test structures used to evaluate the density of various process-induced defects; (2) development of new test structures and testing techniques for measuring gate-oxide capacitance, gate-overlap capacitance, and propagation delay; (3) development of a set of reliability chips that are used to evaluate failure mechanisms in CMOS/bulk: interconnect and contact electromigration and time-dependent dielectric breakdown; (4) development of MOSFET parameter extraction procedures for evaluating subthreshold characteristics; (5) evaluation of test chips and test strips on the second CRRES wafer run; (6) two dedicated fabrication runs for the CRRES chip flight parts; and (7) publication of two papers: one on the split-cross bridge resistor and another on asymmetrical SRAM (static random access memory) cells for single-event upset analysis

    An Integrated Test Plan for an Advanced Very Large Scale Integrated Circuit Design Group

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    VLSI testing poses a number of problems which includes the selection of test techniques, the determination of acceptable fault coverage levels, and test vector generation. Available device test techniques are examined and compared. Design rules should be employed to assure the design is testable. Logic simulation systems and available test utilities are compared. The various methods of test vector generation are also examined. The selection criteria for test techniques are identified. A table of proposed design rules is included. Testability measurement utilities can be used to statistically predict the test generation effort. Field reject rates and fault coverage are statistically related. Acceptable field reject rates can be achieved with less than full test vector fault coverage. The methods and techniques which are examined form the basis of the recommended integrated test plan. The methods of automatic test vector generation are relatively primitive but are improving

    Reconfigurable architecture for very large scale microelectronic systems

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    Hybrid receiver study

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    The results are presented of a 4 month study to design a hybrid analog/digital receiver for outer planet mission probe communication links. The scope of this study includes functional design of the receiver; comparisons between analog and digital processing; hardware tradeoffs for key components including frequency generators, A/D converters, and digital processors; development and simulation of the processing algorithms for acquisition, tracking, and demodulation; and detailed design of the receiver in order to determine its size, weight, power, reliability, and radiation hardness. In addition, an evaluation was made of the receiver's capabilities to perform accurate measurement of signal strength and frequency for radio science missions

    Advanced modulation technology development for earth station demodulator applications

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    The purpose of this contract was to develop a high rate (200 Mbps), bandwidth efficient, modulation format using low cost hardware, in 1990's technology. The modulation format chosen is 16-ary continuous phase frequency shift keying (CPFSK). The implementation of the modulation format uses a unique combination of a limiter/discriminator followed by an accumulator to determine transmitted phase. An important feature of the modulation scheme is the way coding is applied to efficiently gain back the performance lost by the close spacing of the phase points

    Gallium arsenide bit-serial integrated circuits

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    TIROS-N Cosmic Ray study

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    An experimental and analytical study was performed on the impact of galactic cosmic rays on the TIROS-N satellite memory in orbit. Comparisons were made of systems equipped with the Harris HMI-6508 1 x 1024 CMOS/bulk RAM and the RCA CDP-1821 1 x 1024 bit CMOS/SOS RAM. Based upon the experimental results, estimated bit error rates were determined. These were at least 8.0 bit errors/day for a 300 kilobit memory with the HMI-6508 and .014 bit errors/day with the CDF-1821. It was also estimated that the HMI-6508 latchup rate in orbit is at least two orders of magnitude less than the bit error rates; the CDP-1821 will not latchup
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