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Testability considerations for implementing an embedded memory subsystem
textThere are a number of testability considerations for VLSI design,
but test coverage, test time, accuracy of test patterns and
correctness of design information for DFD (Design for debug) are
the most important ones in design with embedded memories. The goal
of DFT (Design-for-Test) is to achieve zero defects. When it comes
to the memory subsystem in SOCs (system on chips), many flavors of
memory BIST (built-in self test) are able to get high test
coverage in a memory, but often, no proper attention is given to
the memory interface logic (shadow logic). Functional testing and
BIST are the most prevalent tests for this logic, but functional
testing is impractical for complicated SOC designs. As a result,
industry has widely used at-speed scan testing to detect delay
induced defects. Compared with functional testing, scan-based
testing for delay faults reduces overall pattern generation
complexity and cost by enhancing both controllability and
observability of flip-flops. However, without proper modeling of
memory, Xs are generated from memories. Also, when the design has
chip compression logic, the number of ATPG patterns is increased
significantly due to Xs from memories. In this dissertation, a
register based testing method and X prevention logic are presented
to tackle these problems.
An important design stage for scan based testing with memory
subsystems is the step to create a gate level model and verify
with this model. The flow needs to provide a robust ATPG netlist
model. Most industry standard CAD tools used to analyze fault
coverage and generate test vectors require gate level models.
However, custom embedded memories are typically designed using a
transistor-level flow, there is a need for an abstraction step to
generate the gate models, which must be equivalent to the actual
design (transistor level). The contribution of the research is a
framework to verify that the gate level representation of custom
designs is equivalent to the transistor-level design.
Compared to basic stuck-at fault testing, the number of patterns
for at-speed testing is much larger than for basic stuck-at fault
testing. So reducing test and data volume are important. In this
desertion, a new scan reordering method is introduced to reduce
test data with an optimal routing solution. With in depth
understanding of embedded memories and flows developed during the
study of custom memory DFT, a custom embedded memory Bit Mapping
method using a symbolic simulator is presented in the last chapter
to achieve high yield for memories.Electrical and Computer Engineerin
Network-on-Chip
Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems
Studies on Core-Based Testing of System-on-Chips Using Functional Bus and Network-on-Chip Interconnects
The tests of a complex system such as a microprocessor-based system-onchip
(SoC) or a network-on-chip (NoC) are difficult and expensive. In this thesis,
we propose three core-based test methods that reuse the existing functional
interconnects-a flat bus, hierarchical buses of multiprocessor SoC's (MPSoC),
and a N oC-in order to avoid the silicon area cost of a dedicated test access mechanism
(TAM). However, the use of functional interconnects as functional TAM's
introduces several new problems.
During tests, the interconnects-including the bus arbitrator, the bus bridges,
and the NoC routers-operate in the functional mode to transport the test stimuli
and responses, while the core under tests (CUT) operate in the test mode. Second,
the test data is transported to the CUT through the functional bus, and not
directly to the test port. Therefore, special core test wrappers that can provide
the necessary control signals required by the different functional interconnect are
proposed. We developed two types of wrappers, one buffer-based wrapper for the
bus-based systems and another pair of complementary wrappers for the NoCbased
systems.
Using the core test wrappers, we propose test scheduling schemes for the three
functionally different types of interconnects. The test scheduling scheme for a flat
bus is developed based on an efficient packet scheduling scheme that minimizes
both the buffer sizes and the test time under a power constraint. The schedulingscheme is then extended to take advantage of the hierarchical bus architecture of
the MPSoC systems. The third test scheduling scheme based on the bandwidth
sharing is developed specifically for the NoC-based systems. The test scheduling
is performed under the objective of co-optimizing the wrapper area cost and the
resulting test application time using the two complementary NoC wrappers.
For each of the proposed methodology for the three types of SoC architec ..
ture, we conducted a thorough experimental evaluation in order to verify their
effectiveness compared to other methods
Test-Delivery Optimization in Manycore SOCs
We present two test-data delivery optimization algorithms
for system-on-chip (SOC) designs with hundreds of cores,
where a network-on-chip (NOC) is used as the interconnection
fabric. We first present an e ective algorithm based on a subsetsum
formulation to solve the test-delivery problem in NOCs
with arbitrary topology that use dedicated routing. We further
propose an algorithm for the important class of NOCs with grid
topology and XY routing. The proposed algorithm is the first to
co-optimize the number of access points, access-point locations,
pin distribution to access points, and assignment of cores to access
points for optimal test resource utilization of such NOCs. Testtime
minimization is modeled as an NOC partitioning problem
and solved with dynamic programming in polynomial time. Both
the proposed methods yield high-quality results and are scalable
to large SOCs with many cores. We present results on synthetic
grid topology NOC-based SOCs constructed using cores from
the ITC’02 benchmark, and demonstrate the scalability of our
approach for two SOCs of the future, one with nearly 1,000 cores
and the other with 1,600 cores. Test scheduling under power
constraints is also incorporated in the optimization framework
Design for pre-bond testability in 3D integrated circuits
In this dissertation we propose several DFT techniques specific to 3D
stacked IC systems. The goal has explicitly been to create techniques that
integrate easily with existing IC test systems. Specifically, this means
utilizing scan- and wrapper-based techniques, two foundations
of the digital IC test industry.
First, we describe a general test architecture for 3D ICs. In this
architecture, each tier of a 3D design is wrapped in test control logic that
both manages tier test
pre-bond and integrates the tier into the large test architecture post-bond.
We describe a new kind of boundary scan to provide the necessary test control
and observation of the partial circuits, and we propose
a new design methodology for test hardcore that ensures both pre-bond functionality
and post-bond optimality. We present the application of these techniques to
the 3D-MAPS test vehicle, which has proven their effectiveness.
Second, we extend these DFT techniques to circuit-partitioned designs. We find
that boundary scan design is generally sufficient, but that some 3D designs require
special DFT treatment. Most importantly, we demonstrate that the functional
partitioning inherent in 3D design can potentially decrease the total test cost
of verifying a circuit.
Third, we present a new CAD algorithm for designing 3D test wrappers. This algorithm
co-designs the pre-bond and post-bond wrappers to simultaneously minimize test
time and routing cost. On average, our algorithm utilizes over 90% of the wires
in both the pre-bond and post-bond wrappers.
Finally, we look at the 3D vias themselves to develop a low-cost, high-volume
pre-bond test methodology appropriate for production-level test. We describe
the shorting probes methodology, wherein large test probes are used to contact
multiple small 3D vias. This technique is an all-digital test method that
integrates seamlessly into existing test flows. Our
experimental results demonstrate two key facts: neither the large capacitance
of the probe tips nor the process variation in the 3D vias and the probe tips
significantly hinders the testability of the circuits.
Taken together, this body of work defines a complete test methodology for
testing 3D ICs pre-bond, eliminating one of the key hurdles to the
commercialization of 3D technology.PhDCommittee Chair: Lee, Hsien-Hsin; Committee Member: Bakir, Muhannad; Committee Member: Lim, Sung Kyu; Committee Member: Vuduc, Richard; Committee Member: Yalamanchili, Sudhaka
A Multi-layer Fpga Framework Supporting Autonomous Runtime Partial Reconfiguration
Partial reconfiguration is a unique capability provided by several Field Programmable Gate Array (FPGA) vendors recently, which involves altering part of the programmed design within an SRAM-based FPGA at run-time. In this dissertation, a Multilayer Runtime Reconfiguration Architecture (MRRA) is developed, evaluated, and refined for Autonomous Runtime Partial Reconfiguration of FPGA devices. Under the proposed MRRA paradigm, FPGA configurations can be manipulated at runtime using on-chip resources. Operations are partitioned into Logic, Translation, and Reconfiguration layers along with a standardized set of Application Programming Interfaces (APIs). At each level, resource details are encapsulated and managed for efficiency and portability during operation. An MRRA mapping theory is developed to link the general logic function and area allocation information to the device related physical configuration level data by using mathematical data structure and physical constraints. In certain scenarios, configuration bit stream data can be read and modified directly for fast operations, relying on the use of similar logic functions and common interconnection resources for communication. A corresponding logic control flow is also developed to make the entire process autonomous. Several prototype MRRA systems are developed on a Xilinx Virtex II Pro platform. The Virtex II Pro on-chip PowerPC core and block RAM are employed to manage control operations while multiple physical interfaces establish and supplement autonomous reconfiguration capabilities. Area, speed and power optimization techniques are developed based on the developed Xilinx prototype. Evaluations and analysis of these prototype and techniques are performed on a number of benchmark and hashing algorithm case studies. The results indicate that based on a variety of test benches, up to 70% reduction in the resource utilization, up to 50% improvement in power consumption, and up to 10 times increase in run-time performance are achieved using the developed architecture and approaches compared with Xilinx baseline reconfiguration flow. Finally, a Genetic Algorithm (GA) for a FPGA fault tolerance case study is evaluated as a ultimate high-level application running on this architecture. It demonstrated that this is a hardware and software infrastructure that enables an FPGA to dynamically reconfigure itself efficiently under the control of a soft microprocessor core that is instantiated within the FPGA fabric. Such a system contributes to the observed benefits of intelligent control, fast reconfiguration, and low overhead
A novel high-speed trellis-coded modulation encoder/decoder ASIC design
Trellis-coded Modulation (TCM) is used in bandlimited communication systems. TCM efficiency improves coding gain by combining modulation and forward error correction coding in one process. In TCM, the bandwidth expansion is not required because it uses the same symbol rate and power spectrum; the differences are the introduction of a redundancy bit and the use of a constellation with double points. In this thesis, a novel TCM encoder/decoder ASIC chip implementation is presented. This ASIC codec not only increases decoding speed but also reduces hardware complexity. The algorithm and technique are presented for a 16-state convolutional code which is used in standard 256-QAM wireless systems. In the decoder, a Hamming distance is used as a cost function to determine output in the maximum likelihood Viterbi decoder. Using the relationship between the delay states and the path state in the Trellis tree of the code, a pre-calculated Hamming distances are stored in a look-up table. In addition, an output look-up-table is generated to determine the decoder output. This table is established by the two relative delay states in the code. The thesis provides details of the algorithm and the structure of TCM codec chip. Besides using parallel processing, the ASIC implementation also uses pipelining to further increase decoding speed. The codec was implemented in ASIC using standard 0.18Ć’Ăťm CMOS technology; the ASIC core occupied a silicon area of 1.1mm2. All register transfer level code of the codec was simulated and synthesized. The chip layout was generated and the final chip was fabricated by Taiwan Semiconductor Manufacturing Company through the Canadian Microelectronics Corporation. The functional testing of the fabricated codec was performed partially successful; the timing testing has not been fully accomplished because the chip was not always stable
Design and Validation of Network-on-Chip Architectures for the Next Generation of Multi-synchronous, Reliable, and Reconfigurable Embedded Systems
NETWORK-ON-CHIP (NoC) design is today at a crossroad. On one hand, the
design principles to efficiently implement interconnection networks in the
resource-constrained on-chip setting have stabilized. On the other hand,
the requirements on embedded system design are far from stabilizing. Embedded
systems are composed by assembling together heterogeneous components featuring
differentiated operating speeds and ad-hoc counter measures must be adopted
to bridge frequency domains. Moreover, an unmistakable trend toward enhanced
reconfigurability is clearly underway due to the increasing complexity of applications.
At the same time, the technology effect is manyfold since it provides unprecedented
levels of system integration but it also brings new severe constraints
to the forefront: power budget restrictions, overheating concerns, circuit delay and
power variability, permanent fault, increased probability of transient faults.
Supporting different degrees of reconfigurability and flexibility in the parallel
hardware platform cannot be however achieved with the incremental evolution of
current design techniques, but requires a disruptive approach and a major increase
in complexity. In addition, new reliability challenges cannot be solved by using
traditional fault tolerance techniques alone but the reliability approach must be
also part of the overall reconfiguration methodology.
In this thesis we take on the challenge of engineering a NoC architectures for
the next generation systems and we provide design methods able to overcome the
conventional way of implementing multi-synchronous, reliable and reconfigurable
NoC. Our analysis is not only limited to research novel approaches to the specific
challenges of the NoC architecture but we also co-design the solutions in a single
integrated framework. Interdependencies between different NoC features are
detected ahead of time and we finally avoid the engineering of highly optimized solutions
to specific problems that however coexist inefficiently together in the final
NoC architecture. To conclude, a silicon implementation by means of a testchip
tape-out and a prototype on a FPGA board validate the feasibility and effectivenes
Physical design methodologies for monolithic 3D ICs
The objective of this research is to develop physical design methodologies for monolithic 3D ICs and use them to evaluate the improvements in the power-performance envelope offered over 2D ICs. In addition, design-for-test (DfT) techniques essential for the adoption of shorter term through-silicon-via (TSV) based 3D ICs are explored.
Testing of TSV-based 3D ICs is one of the last challenges facing their commercialization. First, a pre-bond testable 3D scan chain construction technique is developed. Next, a transition-delay-fault test architecture is presented, along with a study on how to mitigate IR-drop. Finally, to facilitate partitioning, a quick and accurate framework for test-TSV estimation is developed.
Block-level monolithic 3D ICs will be the first to emerge, as significant IP can be reused. However, no physical design flows exist, and hence a monolithic 3D floorplanning framework is developed. Next, inter-tier performance differences that arise due to the not yet mature fabrication process are investigated and modeled. Finally, an inter-tier performance-difference aware floorplanner is presented, and it is demonstrated that high quality 3D floorplans are achievable even under these inter-tier differences.
Monolithic 3D offers sufficient integration density to place individual gates in three dimensions and connect them together. However, no tools or techniques exist that can take advantage of the high integration density offered. Therefore, a gate-level framework that leverages existing 2D ICs tools is presented. This framework also provides congestion modeling and produces results that minimize routing congestion. Next, this framework is extended to commercial 2D IC tools, so that steps such as timing optimization and clock tree synthesis can be applied. Finally, a voltage-drop-aware partitioning technique is presented that can alleviate IR-drop issues, without any impact on the performance or maximum operating temperature of the chip.Ph.D
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