High-performance Zinc Oxide Thin-Film Transistors For Large Area Electronics

The increasing demand for high performance electronics that can be fabricated onto large area substrates employing low manufacturing cost techniques in recent years has fuelled the development of novel semiconductor materials such as organics and metal oxides, with tailored physical characteristics that are absent in their traditional inorganic counterparts such as silicon. Metal oxide semiconductors, in particular, are highly attractive for implementation into thin-film transistors because of their high charge carrier mobility, optical transparency, excellent chemical stability, mechanical stress tolerance and processing versatility. This thesis focuses on the development of high performance transistors based on zinc oxide (ZnO) semiconducting films grown by spray pyrolysis (SP), a low cost and highly scalable method that has never been used before for the manufacturing of oxide-based thin-film transistors. The physical properties of as-grown ZnO films have been studied using a range of techniques. Despite the simplicity of SP, as-fabricated transistors exhibit electrical characteristics comparable to those obtained from ZnO devices produced using highly sophisticated deposition processes. In particular, electron mobility up to 25 cm2/Vs has been achieved in transistors based on pristine ZnO films grown at 400 °C onto Si/SiO2 substrates utilising aluminium source-drain (S-D) electrodes. A strong dependence of the saturation mobility on the work function of S-D electrodes and the transistor channel length (L) has been established. Short channel transistors are found to exhibit improved performance as compared to long channel ones. This was attributed to grain boundary effects that tend to dominate charge transport in devices with L < 40 μm. High mobility, low operating voltage (<1.5 V) ZnO transistors have also been developed and characterised. This was achieved through the combination of SP, for the deposition of ZnO, and thermally stable solution-processed self-assembling monolayer gate dielectrics. Detailed study of the temperature dependence of the operating characteristics of ZnO transistors revealed a thermally activated electron transport process that was described by invoking the multiple trapping and release model. Importantly, ZnO transistors fabricated by SP are found to exhibit highly stable operating characteristics with a shelf lifetime of several months. The simple SPbased fabrication paradigm demonstrated in this thesis expands the possibilities for the development of advanced simple as well as multi-component oxide semiconductors far beyond those accessible by traditional deposition methods such as sputtering. Furthermore, it offers unprecedented processing scalability hence making it attractive for the manufacturing of future ubiquitous oxide electronics

Solution processed metal oxide microelectronics: from materials to devices

Owing to their many interesting characteristics, the application of metal oxide based electronics has been growing at a considerable rate for the past ten years. High performance, optical transparency, chemical stability and suitability toward low cost deposition methods make them well suited to a number of new and interesting application areas which conventional materials such as silicon, or more recently organic materials, are unable to satisfy.The work presented in this thesis is focussed on the optimisation of high performance metal oxide based electronics combined with use of spray pyrolysis, as a low cost deposition method. The findings presented here are split into three main areas, starting with an initial discussion on the physical and electronic properties of films deposited by spray pyrolysis. The results demonstrate a number of deposition criteria that aid in the optimisation and fabrication of high performance zinc oxide (ZnO) based thin-film transistors (TFTs) with charge carrier mobilities as high a 20 cm2/Vs. Solution processed gallium oxide TFTs with charge carrier mobilities of ~0.5 cm2/Vs are also demonstrated, highlighting the flexibility of the deposition method. The second part of the work explores the use of facile chemical doping methods suitable for spray pyrolysed ZnO based TFTs. By blending different precursor materials in solution prior to deposition, it has been possible to adjust certain material characteristics, and in turn device performance. Through the addition of lithium it has been possible alter the films grain structure, leading to significantly improved charge carrier mobilities as high as ~54 cm2/Vs. Additionally the inclusion of beryllium during film deposition has been demonstrated to control TFT threshold voltages, leading to improved integrated circuit performance. The final segment of work demonstrates the flexibility of spray pyrolysis through the deposition of a number of high-k dielectric materials. These high performance dielectrics are integrated into the fabrication of TFTs already benefiting from the findings of the previously discussed work, leading to highly optimised low-voltage TFTs. The performance of these devices represent some of best currently available from solution processed ZnO TFTs with charge carrier mobilities as high as 85 cm2/Vs operating at 3.5 V.Open Acces

Miniaturized Transistors, Volume II

In this book, we aim to address the ever-advancing progress in microelectronic device scaling. Complementary Metal-Oxide-Semiconductor (CMOS) devices continue to endure miniaturization, irrespective of the seeming physical limitations, helped by advancing fabrication techniques. We observe that miniaturization does not always refer to the latest technology node for digital transistors. Rather, by applying novel materials and device geometries, a significant reduction in the size of microelectronic devices for a broad set of applications can be achieved. The achievements made in the scaling of devices for applications beyond digital logic (e.g., high power, optoelectronics, and sensors) are taking the forefront in microelectronic miniaturization. Furthermore, all these achievements are assisted by improvements in the simulation and modeling of the involved materials and device structures. In particular, process and device technology computer-aided design (TCAD) has become indispensable in the design cycle of novel devices and technologies. It is our sincere hope that the results provided in this Special Issue prove useful to scientists and engineers who find themselves at the forefront of this rapidly evolving and broadening field. Now, more than ever, it is essential to look for solutions to find the next disrupting technologies which will allow for transistor miniaturization well beyond silicon’s physical limits and the current state-of-the-art. This requires a broad attack, including studies of novel and innovative designs as well as emerging materials which are becoming more application-specific than ever before

Optimization of Printed Electronics

Solution processed circuits are expected to be the main components to achieve low cost, large area, flexible electronics. However, the commercialization of solution processed flexible electronics face several challenges. The passive component such as capacitors are limited in frequency range and operating voltage. The active component such as transistors suffer from low mobility ultimately leading to limited current-carrying capacity. Just as in traditional silicon technology, the fabrication process and material choices significantly impact the performance of the fabricated devices. My thesis focuses on the optimization of the performance of printed capacitors and transistors through investigation of several aspects of the device structure and fabrication process. The first part of this work focuses on the optimization of printed nanoparticle/polymer composite capacitors. Thin film metal oxide nanoparticle/polymer composites have enormous potential to achieve printable high-k dielectrics. The combination of high-k ceramic nanoparticle and polymer enables room temperature deposition of high dielectric constant film without the need of high temperature sintering process. The polymer matrix host fills the packing voids left behind by the nanoparticles resulting to higher effective dielectric permittivity as a system and suppresses surface states leading to reduced dielectric loss. Such composite systems have been employed in a number of flexible electronic applications such as the dielectrics in capacitors and thin film transistors. One of the most important properties of thin film capacitors is the breakdown field. In a typical capacitor system, the breakdown process leads to catastrophic failure that destroys the capacitor; however, in a nanoparticle/polymer composite system with self-healing property, the point of breakdown is not well-defined. The breakdown of the dielectric or electrodes in the system limits the leakage observed. It is possible, however, to define a voltage/field tolerance. Field tolerance is defined as the highest practical field at which the device stays operational with low failure rate by qualifying the devices with defined leakage current density. In my work, the optimization of the field tolerance of (Ba,Sr)TiO₃ (BST)/parylene-C composite capacitors is achieved by studying the influence of the electromigration parameter on leakage and field strength through the inherit asymmetrical structure of the fabricated capacitors. One approach to creating these composites is to use a spin-coated nanoparticle film together with vapor deposited polymers, which can yield high performance, but also forms a structurally asymmetric device. The performance of a nanoparticle BST/parylene-C composite capacitor is compared to that of a nanoparticle BST capacitor without the polymer layer under both directions of bias. The composite device shows a five orders of magnitude improvement in the leakage current under positive bias of the bottom electrode relative to the pure-particle device, and four orders of magnitude improvement when the top electrode is positively biased. The voltage tolerance of the device is also improved, and it is asymmetric (44 V vs. 28 V in bottom and top positive bias, respectively). This study demonstrates the advantage of this class of composite device construction, but also shows that proper application of the device bias in this type of asymmetrical system can yield an additional benefit. The dependence of the field tolerance of nanoparticle/polymer composite capacitors on the electromigration parameter of the electrodes is investigated using the symmetrical dielectric system. The breakdown is suppressed by selecting the polarity used in nanoparticle (Ba,Sr)TiO₃/parylene-C composite film-based capacitors. Metals including gold, silver, copper, chromium, and aluminum with comparable surface conditions were examined as the electrodes. The asymmetric silver, aluminum, gold, copper, and chromium electrode devices show a 64 %, 29 %, 28 %, 17 %, 33 %, improvement in the effective maximum operating field, respectively, when comparing bias polarity. The field at which filament formation is observed shows a clear dependence on the electromigration properties of the electrode material and demonstrates that use of electromigration resistant metal electrodes offers an additional route to improving the performance of capacitors using this nanoparticle/polymer composite architecture. The second part of my thesis focuses on the novel pneumatic printing process that enables manipulation of the crystal growth of the organic semiconductors to achieve oriented crystal with high mobility. Small molecule organic semiconductors are attracting immense attention as the active material for the large-area flexible electronics due to their solution processability, mechanical flexibility, and potential for high performance. However, the ability to rapidly pattern and deposit multiple materials and control the thin-film morphology are significant challenges facing industrial scale production. A novel and simple pneumatic nozzle printing approach is developed to control the crystallization of organic thin-films and deposit multiple materials with wide range of viscosity including on the same substrate. Pneumatic printing uses capillary action between the nozzle and substrate combined with control of air pressure to dispense the solution from a dispense tip with a reservoir. Orientation and size of the crystals is controlled by tuning the printing direction, speed, and the temperature of the substrate. The main advantages of pneumatic printing technique are 1) simple setup and process, 2) multi-material layered deposition applicable to wide range of solution viscosity, 3) control over crystal growth. The manipulation of crystal growth will be discussed in the next chapter. This method for performance optimization and patterning has great potential for advancing printed electronics. The dependence of the mobility of printed thin film 6,13-bis(triisopropylsilylethynyl) pentacene [TIPS-pentacene] and C8-BTBT on printing conditions is investigated, and the result indicates that the formation of well-ordered crystals occurs at an optimal head translation speed. A maximum mobility of 0.75 cm²/(Vs) is achieved with 0.3 mm/s printing speed and 1.3 cm²/(Vs) with 0.3 mm/s printing speed at 50C for TIPS-pentacene and C8-BTBT respectively. In summary, pneumatic printing technique can be an attractive route to industrial scale large area flexible electronics fabrication

Wide Bandgap Based Devices: Design, Fabrication and Applications, Volume II

Wide bandgap (WBG) semiconductors are becoming a key enabling technology for several strategic fields, including power electronics, illumination, and sensors. This reprint collects the 23 papers covering the full spectrum of the above applications and providing contributions from the on-going research at different levels, from materials to devices and from circuits to systems

Photovoltaic energy systems: Program summary fiscal year 1983

An overview of government funded activities in photovoltaic energy conversion research is given. Introductory information, a list of directing organizations, a list of acronyms and abbreviations, and an index of current contractors are given

Understanding Quantum Technologies 2022

Understanding Quantum Technologies 2022 is a creative-commons ebook that provides a unique 360 degrees overview of quantum technologies from science and technology to geopolitical and societal issues. It covers quantum physics history, quantum physics 101, gate-based quantum computing, quantum computing engineering (including quantum error corrections and quantum computing energetics), quantum computing hardware (all qubit types, including quantum annealing and quantum simulation paradigms, history, science, research, implementation and vendors), quantum enabling technologies (cryogenics, control electronics, photonics, components fabs, raw materials), quantum computing algorithms, software development tools and use cases, unconventional computing (potential alternatives to quantum and classical computing), quantum telecommunications and cryptography, quantum sensing, quantum technologies around the world, quantum technologies societal impact and even quantum fake sciences. The main audience are computer science engineers, developers and IT specialists as well as quantum scientists and students who want to acquire a global view of how quantum technologies work, and particularly quantum computing. This version is an extensive update to the 2021 edition published in October 2021.Comment: 1132 pages, 920 figures, Letter forma

Excitons in monolayer semiconductors in complex environments and under external fields

The focus of this piece of work lies on the investigation of fundamental properties of tightly bound electron-hole pairs, so-called excitons, that are readily formed in the studied two dimensional semiconductor systems, upon excitation with light of adequate energy. Hereby the thesis is sectioned into four different projects. Firstly, the spatial extent of the exciton quasi-particles in ground (1s) and first excited (2s) state in monolayers of the transition metal dichalcogenide WS2 are investigated utilizing magneto-optical spectroscopy in fields up to 29 T. From these findings additional confirmation of a Wannier-Mott type nature of the excitons is found and further support for the applicability of an effective mass hydrogen-like model in these systems is given. The second project is concerned with the influence of disorder in the dielectric environment of this ultra-thin material and its impact on its optical response. Moreover, detailed insight is provided into how such disorder can be suppressed in a controlled way over large areas of up to 100’s of µm² by encapsulating samples in atomically-flat layers of insulating hexagonal boron nitride. In the third project, the transport properties of exciton states in such samples with suppressed disorder is studied at ambient conditions as well as at cryogenic temperatures. In the first case a strong increase of the diffusion efficiency is observed as compared to previous studies of disordered structures, whereas at low temperatures a generally high diffusion efficiency is found which shows an intriguing non-trivial decrease with increasing lattice temperature. Finally, the last project focuses on a different thin-film material system, that of layered hybrid perovskites, where a way to preserve the optical properties of these volatile materials by encapsulation with hexagonal boron nitride is discussed. Such stabilized systems then allow the following study of exciton dynamics as well as exciton transport in these materials

Solution-processed metal oxide dielectrics and semiconductors for thin film transistor applications

Transparent thin film transistors (TFTs) have been the subject of extensive scientific research over the last couple of decades, for applications in displays and imaging, as their implementation in active-matrix liquid crystal displays backplanes is expected to improve their performance in terms of switching times and stability. To this end, several material systems have emerged as contenders to address this need for a high performance, low power, large-area electronics i.e. thin film silicon, organic semiconductors and metal oxides. The electronic limitations of thin film silicon are well documented, and although organic semiconductors have seen significant improvements in recent years, their persistent low mobility and instability means that they are unlikely to progress beyond niche applications. This thesis is focused on the investigation of the physical properties of metal oxides and their implementation in TFTs. Metal oxide based TFTs were fabricated by spray pyrolysis, a simple and large-area-compatible deposition technique. More precisely, the implementation of titanium-aluminate and niobium-aluminate both wide band gap and high-k gate dielectric metal oxides in solution processed ZnO-based TFTs was studied and high performance, low operational voltage devices were fabricated. ZnO-based TFTs employing stoichiometric Al2O3-TiO2 (k~13, Eg~4.5 eV) or Nb2O5-Al2O3 (k~13.5, Eg~5.1 eV) as gate dielectric exhibited low leakage currents, high on-off current modulation ratios, high field-effect mobilities and low subthreshold voltage swings. Furthermore, the implementation of solution-processed crystalline indium-zinc oxide (c-IZO) as active channel material in TFTs was equally investigated and high-performance c-IZO-based TFTs employing Al2O3 were fabricated. The effects of metal cation doping in c-IZO matrix were investigated in particular, and c-IZO:X (X:Ga,Y,Zr,Nb) based TFTs were fabricated and their properties were assessed for each dopant. Amongst them, Yttrium doped c-IZO (c-YIZO)-based TFTs exhibited the best performance in terms of low off-state currents, high field-effect mobilities and low subthreshold voltage swings