Design and debugging of multi-step analog to digital converters

With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process

Concepts for smart AD and DA converters

This thesis studies the `smart' concept for application to analog-to-digital and digital-to-analog converters. The smart concept aims at improving performance - in a wide sense - of AD/DA converters by adding on-chip intelligence to extract imperfections and to correct for them. As the smart concept can correct for certain imperfections, it can also enable the use of more efficient architectures, thus yielding an additional performance boost. Chapter 2 studies trends and expectations in converter design with respect to applications, circuit design and technology evolution. Problems and opportunities are identfied, and an overview of performance criteria is given. Chapter 3 introduces the smart concept that takes advantage of the expected opportunities (described in chapter 2) in order to solve the anticipated problems. Chapter 4 applies the smart concept to digital-to-analog converters. In the discussed example, the concept is applied to reduce the area of the analog core of a current-steering DAC. It is shown that a sub-binary variable-radix approach reduces the area of the current-source elements substantially (10x compared to state-of-the-art), while maintaining accuracy by a self-measurement and digital pre-correction scheme. Chapter 5 describes the chip implementation of the sub-binary variable-radix DAC and discusses the experimental results. The results confirm that the sub-binary variable-radix design can achieve the smallest published current-source-array area for the given accuracy (12bit). Chapter 6 applies the smart concept to analog-to-digital converters, with as main goal the improvement of the overall performance in terms of a widely used figure-of-merit. Open-loop circuitry and time interleaving are shown to be key to achieve high-speed low-power solutions. It is suggested to apply a smart approach to reduce the effect of the imperfections, unintentionally caused by these key factors. On high-level, a global picture of the smart solution is proposed that can solve the problems while still maintaining power-efficiency. Chapter 7 deals with the design of a 500MSps open-loop track-and-hold circuit. This circuit is used as a test case to demonstrate the proposed smart approaches. Experimental results are presented and compared against prior art. Though there are several limitations in the design and the measurement setup, the measured performance is comparable to existing state-of-the-art. Chapter 8 introduces the first calibration method that counteracts the accuracy issues of the open-loop track-and-hold. A description of the method is given, and the implementation of the detection algorithm and correction circuitry is discussed. The chapter concludes with experimental measurement results. Chapter 9 introduces the second calibration method that targets the accuracy issues of time-interleaved circuits, in this case a 2-channel version of the implemented track-and-hold. The detection method, processing algorithm and correction circuitry are analyzed and their implementation is explained. Experimental results verify the usefulness of the method

An accurate, trimless, high PSRR, low-voltage, CMOS bandgap reference IC

Bandgap reference circuits are used in a host of analog, digital, and mixed-signal systems to establish an accurate voltage standard for the entire IC. The accuracy of the bandgap reference voltage under steady-state (dc) and transient (ac) conditions is critical to obtain high system performance. In this work, the impact of process, power-supply, load, and temperature variations and package stresses on the dc and ac accuracy of bandgap reference circuits has been analyzed. Based on this analysis, the a bandgap reference that 1. has high dc accuracy despite process and temperature variations and package stresses, without resorting to expensive trimming or noisy switching schemes, 2. has high dc and ac accuracy despite power-supply variations, without using large off-chip capacitors that increase bill-of-material costs, 3. has high dc and ac accuracy despite load variations, without resorting to error-inducing buffers, 4. is capable of producing a sub-bandgap reference voltage with a low power-supply, to enable it to operate in modern, battery-operated portable applications, 5. utilizes a standard CMOS process, to lower manufacturing costs, and 6. is integrated, to consume less board space has been proposed. The functionality of critical components of the system has been verified through prototypes after which the performance of the complete system has been evaluated by integrating all the individual components on an IC. The proposed CMOS bandgap reference can withstand 5mA of load variations while generating a reference voltage of 890mV that is accurate with respect to temperature to the first order. It exhibits a trimless, dc 3-sigma accuracy performance of 0.84% over a temperature range of -40°C to 125°C and has a worst case ac power-supply ripple rejection (PSRR) performance of 30dB up to 50MHz using 60pF of on-chip capacitance. All the proposed techniques lead to the development of a CMOS bandgap reference that meets the low-cost, high-accuracy demands of state-of-the-art System-on-Chip environments.Ph.D.Committee Chair: Rincon-Mora, Gabriel; Committee Member: Ayazi, Farrokh; Committee Member: Bhatti, Pamela; Committee Member: Leach, W. Marshall; Committee Member: Morley, Thoma

Development of Robust Analog and Mixed-Signal Circuits in the Presence of Process- Voltage-Temperature Variations

Continued improvements of transceiver systems-on-a-chip play a key role in the advancement of mobile telecommunication products as well as wireless systems in biomedical and remote sensing applications. This dissertation addresses the problems of escalating CMOS process variability and system complexity that diminish the reliability and testability of integrated systems, especially relating to the analog and mixed-signal blocks. The proposed design techniques and circuit-level attributes are aligned with current built-in testing and self-calibration trends for integrated transceivers. In this work, the main focus is on enhancing the performances of analog and mixed-signal blocks with digitally adjustable elements as well as with automatic analog tuning circuits, which are experimentally applied to conventional blocks in the receiver path in order to demonstrate the concepts. The use of digitally controllable elements to compensate for variations is exemplified with two circuits. First, a distortion cancellation method for baseband operational transconductance amplifiers is proposed that enables a third-order intermodulation (IM3) improvement of up to 22dB. Fabricated in a 0.13µm CMOS process with 1.2V supply, a transconductance-capacitor lowpass filter with the linearized amplifiers has a measured IM3 below -70dB (with 0.2V peak-to-peak input signal) and 54.5dB dynamic range over its 195MHz bandwidth. The second circuit is a 3-bit two-step quantizer with adjustable reference levels, which was designed and fabricated in 0.18µm CMOS technology as part of a continuous-time SigmaDelta analog-to-digital converter system. With 5mV resolution at a 400MHz sampling frequency, the quantizer's static power dissipation is 24mW and its die area is 0.4mm^2. An alternative to electrical power detectors is introduced by outlining a strategy for built-in testing of analog circuits with on-chip temperature sensors. Comparisons of an amplifier's measurement results at 1GHz with the measured DC voltage output of an on-chip temperature sensor show that the amplifier's power dissipation can be monitored and its 1-dB compression point can be estimated with less than 1dB error. The sensor has a tunable sensitivity up to 200mV/mW, a power detection range measured up to 16mW, and it occupies a die area of 0.012mm^2 in standard 0.18µm CMOS technology. Finally, an analog calibration technique is discussed to lessen the mismatch between transistors in the differential high-frequency signal path of analog CMOS circuits. The proposed methodology involves auxiliary transistors that sense the existing mismatch as part of a feedback loop for error minimization. It was assessed by performing statistical Monte Carlo simulations of a differential amplifier and a double-balanced mixer designed in CMOS technologies

Very-Large-Scale-Integration Circuit Techniques in Internet-of-Things Applications

Heading towards the era of Internet-of-things (IoT) means both opportunity and challenge for the circuit-design community. In a system where billions of devices are equipped with the ability to sense, compute, communicate with each other and perform tasks in a coordinated manner, security and power management are among the most critical challenges. Physically unclonable function (PUF) emerges as an important security primitive in hardware-security applications; it provides an object-specific physical identifier hidden within the intrinsic device variations, which is hard to expose and reproduce by adversaries. Yet, designing a compact PUF robust to noise, temperature and voltage remains a challenge. This thesis presents a novel PUF design approach based on a pair of ultra-compact analog circuits whose output is proportional to absolute temperature. The proposed approach is demonstrated through two works: (1) an ultra-compact and robust PUF based on voltage-compensated proportional-to-absolute-temperature voltage generators that occupies 8.3× less area than the previous work with the similar robustness and twice the robustness of the previously most compact PUF design and (2) a technique to transform a 6T-SRAM array into a robust analog PUF with minimal overhead. In this work, similar circuit topology is used to transform a preexisting on-chip SRAM into a PUF, which further reduces the area in (1) with no robustness penalty. In this thesis, we also explore techniques for power management circuit design. Energy harvesting is an essential functionality in an IoT sensor node, where battery replacement is cost-prohibitive or impractical. Yet, existing energy-harvesting power management units (EH PMU) suffer from efficiency loss in the two-step voltage conversion: harvester-to-battery and battery-to-load. We propose an EH PMU architecture with hybrid energy storage, where a capacitor is introduced in addition to the battery to serve as an intermediate energy buffer to minimize the battery involvement in the system energy flow. Test-case measurements show as much as a 2.2× improvement in the end-to-end energy efficiency. In contrast, with the drastically reduced power consumption of IoT nodes that operates in the sub-threshold regime, adaptive dynamic voltage scaling (DVS) for supply-voltage margin removal, fully on-chip integration and high power conversion efficiency (PCE) are required in PMU designs. We present a PMU–load co-design based on a fully integrated switched-capacitor DC-DC converter (SC-DC) and hybrid error/replica-based regulation for a fully digital PMU control. The PMU is integrated with a neural spike processor (NSP) that achieves a record-low power consumption of 0.61 µW for 96 channels. A tunable replica circuit is added to assist the error regulation and prevent loss of regulation. With automatic energy-robustness co-optimization, the PMU can set the SC-DC’s optimal conversion ratio and switching frequency. The PMU achieves a PCE of 77.7% (72.2%) at VIN = 0.6 V (1 V) and at the NSP’s margin-free operating point

Advanced CMOS Integrated Circuit Design and Application

The recent development of various application systems and platforms, such as 5G, B5G, 6G, and IoT, is based on the advancement of CMOS integrated circuit (IC) technology that enables them to implement high-performance chipsets. In addition to development in the traditional fields of analog and digital integrated circuits, the development of CMOS IC design and application in high-power and high-frequency operations, which was previously thought to be possible only with compound semiconductor technology, is a core technology that drives rapid industrial development. This book aims to highlight advances in all aspects of CMOS integrated circuit design and applications without discriminating between different operating frequencies, output powers, and the analog/digital domains. Specific topics in the book include: Next-generation CMOS circuit design and application; CMOS RF/microwave/millimeter-wave/terahertz-wave integrated circuits and systems; CMOS integrated circuits specially used for wireless or wired systems and applications such as converters, sensors, interfaces, frequency synthesizers/generators/rectifiers, and so on; Algorithm and signal-processing methods to improve the performance of CMOS circuits and systems

Bio-inspired collective analog computation

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2012.This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.Cataloged from student-submitted PDF version of thesis.Includes bibliographical references (p. 101-102).In this thesis, I present electronic circuit systems that mimic collective analog com- putation found in biology. By combining the advantages of analog and digital computation, these systems can lead to highly complex, rapid, and energy-efficient systems such as an analog supercomputer that is capable of simulating a great number of bio- chemical reactions in cells. To this end, I first implement a neuron-inspired collective analog adder in a standard 0.5 [mu]m CMOS process. It serves as a prototype system that visualizes fundamental design ideas and techniques for building a collective analog computation system. Next, I build a cell-inspired analog circuit system which efficiently models bacterial genetic circuits in a cell, which can provide a powerful modeling and simulation tool for the design and analysis of circuits in synthetic and systems biology.by Sung Sik Woo.S.M

Impact of atomistic device variability on analogue circuit design

Scaling of complementary metal-oxide-semiconductor (CMOS) technology has benefited the semiconductor industry for almost half a century. For CMOS devices with a physical gate-length in the sub-100 nm range, extreme device variability is introduced and has become a major stumbling block for next generation analogue circuit design. Both opportunities and challenges have therefore confronted analogue circuit designers. Small geometry device can enable high-speed analogue circuit designs, such as data conversion interfaces that can work in the radio frequency range. These designs can be co-integrated with digital systems to achieve low cost, high-performance, single-chip solutions that could only be achieved using multi-chip solutions in the past. However, analogue circuit designs are extremely vulnerable to device mismatch, since a large number of symmetric transistor pairs and circuit cells are required. The increase in device variability from sub-100 nm processes has therefore significantly reduced the production yield of the conventional designs. Mismatch models have been developed to analytically evaluate the magnitude of random variations. Based on measurements from custom designed test structures, the statistics of process variation can be estimated using design related parameters. However, existing models can no longer accurately estimate the magnitude of mismatch for sub-100 nm “atomistic” devices, since short-channel effects have become important. In this thesis, a new mismatch model for small geometry devices will be proposed to address this problem. Based on knowledge of the matching performance obtained from the mismatch model, design solutions are desired at different design levels for a variety of circuit topologies. In this thesis, transistor level compensation solutions have been investigated and closed-loop compensation circuits have been proposed. At circuit level, a latch-based comparator has been used to develop a compensation solution because this type of comparator is extremely sensitive to the device mismatch. These comparators are also used as the fundamental building block for the analogue-to-digital converters (ADC). The proposed comparator compensation scheme is used to improve the performance of a high-speed flash ADC