Enhancing Variation-aware Analog Circuits Sizing

Today's analog design and verification face significant challenges due to circuit complexity and short time-to-market windows. Moreover, variations in design parameters have an adversely impact on the correctness and performance of analog circuits. Circuit sizing consists in determining the device sizes and biasing voltages and currents such that the circuit satisfies its specifications. Traditionally, analog circuit sizing has been carried out by optimization-based methods, which of course will still be important in the future. Unfortunately, these techniques cannot guarantee an exhaustive coverage of the design search space and hence, are not able to ensure the non-existence of higher quality design solutions. The sizing problem becomes more complicated and computationally expensive under design parameters fluctuation. Indeed, existing yield analysis methods are computationally expensive and still encounter issues in problems with a high-dimensional process parameter space. In this thesis, we present new approaches for enhancing variation-aware analog circuit sizing. The circuit sizing problem is encoded using nonlinear constraints. A new algorithm using Satisfiability Modulo Theory (SMT) solving techniques exhaustively explores the analog design space and computes a continuous set of feasible sizing solutions. Next, a yield optimization stage aims to select the candidate design solution with the highest yield rate in the presence of process parameters variation. For this purpose, a novel method for the computation of parametric yield is proposed. The method combines the advantages of sparse regression and SMT solving techniques. The key idea is to characterize the failure regions as a collection of hyperrectangles in the parameters space. The yield estimation is based on a geometric calculation of probabilistic volumes subtended by the located hyperrectangles. The method can provide very large speed-up over Monte Carlo methods, when a high prediction accuracy is required. A new approach for improving analog yield optimization is also proposed. The optimization is performed in two steps. First, a global optimization phase samples the most potential optimal sub-regions of the feasible design space. The global search locates a design point near the optimal solution. Second, a local optimization phase uses the near optimal solution as a starting point. Also, it constructs linear interpolating models of the yield to explore the basin of convergence and to reach the global optimum. We illustrate the efficiency of the proposed methods on various analog circuits. The application of the yield analysis method on an integrated ring oscillator and a 6T static RAM proves that it is suitable for handling problems with tens of process parameters and can provide speedup of 5X-2000X over Monte Carlo methods. Furthermore, the application of our yield optimization methodology on the examples of a two-stage amplifier and a cascode amplifier shows that our approach can achieve higher quality in analog synthesis and unrivaled coverage of the analog design space when compared to traditional optimization techniques

Algorithms for Verification of Analog and Mixed-Signal Integrated Circuits

Over the past few decades, the tremendous growth in the complexity of analog and mixed-signal (AMS) systems has posed great challenges to AMS verification, resulting in a rapidly growing verification gap. Existing formal methods provide appealing completeness and reliability, yet they suffer from their limited efficiency and scalability. Data oriented machine learning based methods offer efficient and scalable solutions but do not guarantee completeness or full coverage. Additionally, the trend towards shorter time to market for AMS chips urges the development of efficient verification algorithms to accelerate with the joint design and testing phases. This dissertation envisions a hierarchical and hybrid AMS verification framework by consolidating assorted algorithms to embrace efficiency, scalability and completeness in a statistical sense. Leveraging diverse advantages from various verification techniques, this dissertation develops algorithms in different categories. In the context of formal methods, this dissertation proposes a generic and comprehensive model abstraction paradigm to model AMS content with a unifying analog representation. Moreover, an algorithm is proposed to parallelize reachability analysis by decomposing AMS systems into subsystems with lower complexity, and dividing the circuit's reachable state space exploration, which is formulated as a satisfiability problem, into subproblems with a reduced number of constraints. The proposed modeling method and the hierarchical parallelization enhance the efficiency and scalability of reachability analysis for AMS verification. On the subject of learning based method, the dissertation proposes to convert the verification problem into a binary classification problem solved using support vector machine (SVM) based learning algorithms. To reduce the need of simulations for training sample collection, an active learning strategy based on probabilistic version space reduction is proposed to perform adaptive sampling. An expansion of the active learning strategy for the purpose of conservative prediction is leveraged to minimize the occurrence of false negatives. Moreover, another learning based method is proposed to characterize AMS systems with a sparse Bayesian learning regression model. An implicit feature weighting mechanism based on the kernel method is embedded in the Bayesian learning model for concurrent quantification of influence of circuit parameters on the targeted specification, which can be efficiently solved in an iterative method similar to the expectation maximization (EM) algorithm. Besides, the achieved sparse parameter weighting offers favorable assistance to design analysis and test optimization

MICROELECTRONICS PACKAGING TECHNOLOGY ROADMAPS, ASSEMBLY RELIABILITY, AND PROGNOSTICS

This paper reviews the industry roadmaps on commercial-off-the shelf (COTS) microelectronics packaging technologies covering the current trends toward further reducing size and increasing functionality. Due tothe breadth of work being performed in this field, this paper presents only a number of key packaging technologies. The topics for each category were down-selected by reviewing reports of industry roadmaps including the International Technology Roadmap for Semiconductor (ITRS) and by surveying publications of the International Electronics Manufacturing Initiative (iNEMI) and the roadmap of association connecting electronics industry (IPC). The paper also summarizes the findings of numerous articles and websites that allotted to the emerging and trends in microelectronics packaging technologies. A brief discussion was presented on packaging hierarchy from die to package and to system levels. Key elements of reliability for packaging assemblies were presented followed by reliabilty definition from a probablistic failure perspective. An example was present for showing conventional reliability approach using Monte Carlo simulation results for a number of plastic ball grid array (PBGA). The simulation results were compared to experimental thermal cycle test data. Prognostic health monitoring (PHM) methods, a growing field for microelectronics packaging technologies, were briefly discussed. The artificial neural network (ANN), a data-driven PHM, was discussed in details. Finally, it presented inter- and extra-polations using ANN simulation for thermal cycle test data of PBGA and ceramic BGA (CBGA) assemblies

Book of Knowledge (BOK) for NASA Electronic Packaging Roadmap

The objective of this document is to update the NASA roadmap on packaging technologies (initially released in 2007) and to present the current trends toward further reducing size and increasing functionality. Due to the breadth of work being performed in the area of microelectronics packaging, this report presents only a number of key packaging technologies detailed in three industry roadmaps for conventional microelectronics and a more recently introduced roadmap for organic and printed electronics applications. The topics for each category were down-selected by reviewing the 2012 reports of the International Technology Roadmap for Semiconductor (ITRS), the 2013 roadmap reports of the International Electronics Manufacturing Initiative (iNEMI), the 2013 roadmap of association connecting electronics industry (IPC), the Organic Printed Electronics Association (OE-A). The report also summarizes the results of numerous articles and websites specifically discussing the trends in microelectronics packaging technologies

A Probabilistic Machine Learning Approach for the Uncertainty Quantification of Electronic Circuits Based on Gaussian Process Regression

This paper introduces a probabilistic machine learning framework for the uncertainty quantification (UQ) of electronic circuits based on Gaussian process regression (GPR). As opposed to classical surrogate modeling techniques, GPR inherently provides information on the model uncertainty. The main contribution of this work is twofold. First, it describes how, in an UQ scenario, the model uncertainty can be combined with the uncertainty of the input design parameters to provide confidence bounds for the statistical estimates of the system outputs, such as moments and probability distributions. These confidence bounds allows assessing the accuracy of the predicted statistics. Second, in order to deal with dynamic multi-output systems, principal component analysis (PCA) is effectively employed to compress the time-dependent output variables into a smaller set of components, for which the training of individual GPR models becomes feasible. The uncertainty on the principal components is then propagated back to the original output variables. Several application examples, ranging from a trivial RLC circuit to real-life designs, are used to illustrate and validate the advocated approach

A MICROGYRO WITH QUARTZ FORK SENSOR

ABSTRACT Mainly targeting the automotive application, Systron Donner's MicroGyro with quartz fork sensor uses a vibrating quartz tuning fork to sense angular rate, acting as a Coriolis sensor, coupled to a similar fork as a pickup to produce the rate output signal. In this paper, the theoretical analysis of the quartz fork model is presented. Following that, the control of the drive magnitude and design of the pickup path are discussed in details. Experiment results from mechanical testing and electrical testing are presented to show that the MicroGyro has achieved 0.03°/s/rtHz

Concepts for Short Range Millimeter-wave Miniaturized Radar Systems with Built-in Self-Test

This work explores short-range millimeter wave radar systems, with emphasis on miniaturization and overall system cost reduction. The designing and implementation processes, starting from the system level design considerations and characterization of the individual components to final implementation of the proposed architecture are described briefly. Several D-band radar systems are developed and their functionality and performances are demonstrated

ENABLING IOT AUTHENTICATION, PRIVACY AND SECURITY VIA BLOCKCHAIN

Although low-power and Internet-connected gadgets and sensors are increasingly integrated into our lives, the optimal design of these systems remains an issue. In particular, authentication, privacy, security, and performance are critical success factors. Furthermore, with emerging research areas such as autonomous cars, advanced manufacturing, smart cities, and building, usage of the Internet of Things (IoT) devices is expected to skyrocket. A single compromised node can be turned into a malicious one that brings down whole systems or causes disasters in safety-critical applications. This dissertation addresses the critical problems of (i) device management, (ii) data management, and (iii) service management in IoT systems. In particular, we propose an integrated platform solution for IoT device authentication, data privacy, and service security via blockchain-based smart contracts. We ensure IoT device authentication by blockchain-based IC traceability system, from its fabrication to its end-of-life, allowing both the supplier and a potential customer to verify an IC’s provenance. Results show that our proposed consortium blockchain framework implementation in Hyperledger Fabric for IC traceability achieves a throughput of 35 transactions per second (tps). To corroborate the blockchain information, we authenticate the IC securely and uniquely with an embedded Physically Unclonable Function (PUF). For reliable Weak PUF-based authentication, our proposed accelerated aging technique reduces the cumulative burn-in cost by ∼ 56%. We also propose a blockchain-based solution to integrate the privacy of data generated from the IoT devices by giving users control of their privacy. The smart contract controlled trust-base ensures that the users have private access to their IoT devices and data. We then propose a remote configuration of IC features via smart contracts, where an IC can be programmed repeatedly and securely. This programmability will enable users to upgrade IC features or rent upgraded IC features for a fixed period after users have purchased the IC. We tailor the hardware to meet the blockchain performance. Our on-die hardware module design enforces the hardware configuration’s secure execution and uses only 2,844 slices in the Xilinx Zedboard Zynq Evaluation board. The blockchain framework facilitates decentralized IoT, where interacting devices are empowered to execute digital contracts autonomously

NASA Tech Briefs, August 2000

Topics include: Simulation/Virtual Reality; Test and Measurement; Computer-Aided Design and Engineering; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Medical Design

JTEC Panel report on electronic manufacturing and packaging in Japan

This report summarizes the status of electronic manufacturing and packaging technology in Japan in comparison to that in the United States, and its impact on competition in electronic manufacturing in general. In addition to electronic manufacturing technologies, the report covers technology and manufacturing infrastructure, electronics manufacturing and assembly, quality assurance and reliability in the Japanese electronics industry, and successful product realization strategies. The panel found that Japan leads the United States in almost every electronics packaging technology. Japan clearly has achieved a strategic advantage in electronics production and process technologies. Panel members believe that Japanese competitors could be leading U.S. firms by as much as a decade in some electronics process technologies