Robust and Traffic Aware Medium Access Control Mechanisms for Energy-Efficient mm-Wave Wireless Network-on-Chip Architectures

To cater to the performance/watt needs, processors with multiple processing cores on the same chip have become the de-facto design choice. In such multicore systems, Network-on-Chip (NoC) serves as a communication infrastructure for data transfer among the cores on the chip. However, conventional metallic interconnect based NoCs are constrained by their long multi-hop latencies and high power consumption, limiting the performance gain in these systems. Among, different alternatives, due to the CMOS compatibility and energy-efficiency, low-latency wireless interconnect operating in the millimeter wave (mm-wave) band is nearer term solution to this multi-hop communication problem. This has led to the recent exploration of millimeter-wave (mm-wave) wireless technologies in wireless NoC architectures (WiNoC). To realize the mm-wave wireless interconnect in a WiNoC, a wireless interface (WI) equipped with on-chip antenna and transceiver circuit operating at 60GHz frequency range is integrated to the ports of some NoC switches. The WIs are also equipped with a medium access control (MAC) mechanism that ensures a collision free and energy-efficient communication among the WIs located at different parts on the chip. However, due to shrinking feature size and complex integration in CMOS technology, high-density chips like multicore systems are prone to manufacturing defects and dynamic faults during chip operation. Such failures can result in permanently broken wireless links or cause the MAC to malfunction in a WiNoC. Consequently, the energy-efficient communication through the wireless medium will be compromised. Furthermore, the energy efficiency in the wireless channel access is also dependent on the traffic pattern of the applications running on the multicore systems. Due to the bursty and self-similar nature of the NoC traffic patterns, the traffic demand of the WIs can vary both spatially and temporally. Ineffective management of such traffic variation of the WIs, limits the performance and energy benefits of the novel mm-wave interconnect technology. Hence, to utilize the full potential of the novel mm-wave interconnect technology in WiNoCs, design of a simple, fair, robust, and efficient MAC is of paramount importance. The main goal of this dissertation is to propose the design principles for robust and traffic-aware MAC mechanisms to provide high bandwidth, low latency, and energy-efficient data communication in mm-wave WiNoCs. The proposed solution has two parts. In the first part, we propose the cross-layer design methodology of robust WiNoC architecture that can minimize the effect of permanent failure of the wireless links and recover from transient failures caused by single event upsets (SEU). Then, in the second part, we present a traffic-aware MAC mechanism that can adjust the transmission slots of the WIs based on the traffic demand of the WIs. The proposed MAC is also robust against the failure of the wireless access mechanism. Finally, as future research directions, this idea of traffic awareness is extended throughout the whole NoC by enabling adaptiveness in both wired and wireless interconnection fabric

Scalability of broadcast performance in wireless network-on-chip

Networks-on-Chip (NoCs) are currently the paradigm of choice to interconnect the cores of a chip multiprocessor. However, conventional NoCs may not suffice to fulfill the on-chip communication requirements of processors with hundreds or thousands of cores. The main reason is that the performance of such networks drops as the number of cores grows, especially in the presence of multicast and broadcast traffic. This not only limits the scalability of current multiprocessor architectures, but also sets a performance wall that prevents the development of architectures that generate moderate-to-high levels of multicast. In this paper, a Wireless Network-on-Chip (WNoC) where all cores share a single broadband channel is presented. Such design is conceived to provide low latency and ordered delivery for multicast/broadcast traffic, in an attempt to complement a wireline NoC that will transport the rest of communication flows. To assess the feasibility of this approach, the network performance of WNoC is analyzed as a function of the system size and the channel capacity, and then compared to that of wireline NoCs with embedded multicast support. Based on this evaluation, preliminary results on the potential performance of the proposed hybrid scheme are provided, together with guidelines for the design of MAC protocols for WNoC.Peer ReviewedPostprint (published version

Network-on-Chip

Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems

On Energy Efficient Computing Platforms

In accordance with the Moore's law, the increasing number of on-chip integrated transistors has enabled modern computing platforms with not only higher processing power but also more affordable prices. As a result, these platforms, including portable devices, work stations and data centres, are becoming an inevitable part of the human society. However, with the demand for portability and raising cost of power, energy efficiency has emerged to be a major concern for modern computing platforms. As the complexity of on-chip systems increases, Network-on-Chip (NoC) has been proved as an efficient communication architecture which can further improve system performances and scalability while reducing the design cost. Therefore, in this thesis, we study and propose energy optimization approaches based on NoC architecture, with special focuses on the following aspects. As the architectural trend of future computing platforms, 3D systems have many bene ts including higher integration density, smaller footprint, heterogeneous integration, etc. Moreover, 3D technology can signi cantly improve the network communication and effectively avoid long wirings, and therefore, provide higher system performance and energy efficiency. With the dynamic nature of on-chip communication in large scale NoC based systems, run-time system optimization is of crucial importance in order to achieve higher system reliability and essentially energy efficiency. In this thesis, we propose an agent based system design approach where agents are on-chip components which monitor and control system parameters such as supply voltage, operating frequency, etc. With this approach, we have analysed the implementation alternatives for dynamic voltage and frequency scaling and power gating techniques at different granularity, which reduce both dynamic and leakage energy consumption. Topologies, being one of the key factors for NoCs, are also explored for energy saving purpose. A Honeycomb NoC architecture is proposed in this thesis with turn-model based deadlock-free routing algorithms. Our analysis and simulation based evaluation show that Honeycomb NoCs outperform their Mesh based counterparts in terms of network cost, system performance as well as energy efficiency.Siirretty Doriast

Dual Data Rate Network-on-Chip Architectures

Networks-on-Chip (NoCs) are becoming increasing important for the performance of modern multi-core systems-on-chip. The performance of current NoCs is limited, among others, by two factors: their limited clock frequency and long router pipeline. The clock frequency of a network defines the limits of its saturation throughput. However, for high throughput routers, clock is constrained by the control logic (for virtual channel and switch allocation) whereas the datapath (crossbar switch and links) possesses significant slack. This slack in the datapath wastes network throughput potential. Secondly, routers require flits to go through a large number of pipeline stages increasing packet latency at low traffic loads. These stages include router resource allocation, switch traversal (ST) and link traversal (LT). The allocation stages are used to manage contention among flits attempting to simultaneously access switch and links, and the ST stage is needed to change the routing dimension. In some cases, these stages are not needed and then requiring flits to go through them increases packet latency. The aim of this thesis is to improve NoC performance, in terms of network throughput, by removing the slack in the router datapath, and in terms of average packet latency, by enabling incoming flits to bypass, when possible, allocation and ST stages. More precisely, this thesis introduces Dual Data-Rate (DDR) NoC architectures which exploit the slack present in the NoC datapath to operate it at DDR. This requires a clock with period twice the datapath delay and removes the control logic from the critical path. DDR datapaths enable throughput higher than existing single data-rate (SDR) networks where the clock period is defined by the control logic. Additionally, this thesis supplements DDR NoC architectures with varying levels of pipeline stage bypassing capabilities to reduce low-load packet latency. In order to avoid complex logic required for bypassing from all inputs to all outputs, this thesis implements and evaluates a simplified bypassing approach. DDR NoC routers support bypassing of the allocation stage for flits propagating an in-network straight hop (i.e. East to West, North to South and vice versa) and when entering or exiting the network. Disabling bypassing during XY-turns limits its benefits, but, for most routing algorithms under low traffic loads, flits encounter at most one XY-turn on their way to the destination. Bypassing allocation stage enables incoming flits to directly initiate ST, when required conditions are met, and propagate at one cycle per hop. Furthermore, DDR NoC routers allow flits to bypass the ST stage when propagating a straight hop from the head of a specific input VC. Restricting ST bypassing from a specific VC further simplifies check logic to have clock period defined by datapath delays. Bypassing ST requires dedicated bypass paths from non-local input ports to opposite output ports. It enables flits to propagate half a cycle per hop. This thesis shows that compared to current state-of-the-art SDR NoCs, operating router’s datapath at DDR improves throughput by up to 20%. Adding to a DDR NoC an allocation bypassing mechanism for straight hops reduces its packet latency by up to 45%, while maintaining the DDR throughput advantage. Enhancing allocation bypassing to include flits entering and exiting the network further reduces latency by another 24%. Finally, adding ST bypassing further reduces latency by another 32%. Overall, DDR NoCs offer up to 40% lower latency and about 20% higher throughput compared to the SDR networks

Energy-efficient electrical and silicon-photonic networks in many core systems

Thesis (Ph.D.)--Boston UniversityDuring the past decade, the very large scale integration (VLSI) community has migrated towards incorporating multiple cores on a single chip to sustain the historic performance improvement in computing systems. As the core count continuously increases, the performance of network-on-chip (NoC), which is responsible for the communication between cores, caches and memory controllers, is increasingly becoming critical for sustaining the performance improvement. In this dissertation, we propose several methods to improve the energy efficiency of both electrical and silicon-photonic NoCs. Firstly, for electrical NoC, we propose a flow control technique, Express Virtual Channel with Taps (EVC-T), to transmit both broadcast and data packets efficiently in a mesh network. A low-latency notification tree network is included to maintain t he order of broadcast packets. The EVC-T technique improves the NoC latency by 24% and the system energy efficiency in terms of energy-delay product (EDP) by 13%. In the near future, the silicon-photonic links are projected to replace the electrical links for global on-chip communication due to their lower data-dependent power and higher bandwidth density, but the high laser power can more than offset these advantages. Therefore, we propose a silicon-photonic multi-bus NoC architecture and a methodology that can reduce the laser power by 49% on average through bandwidth reconfiguration at runtime based on the variations in bandwidth requirements of applications. We also propose a technique to reduce the laser power by dynamically activating/deactivating the 12 cache banks and switching ON/ OFF the corresponding silicon-photonic links in a crossbar NoC. This cache-reconfiguration based technique can save laser power by 23.8% and improves system EDP by 5.52% on average. In addition, we propose a methodology for placing and sharing on-chip laser sources by jointly considering the bandwidth requirements, thermal constraints and physical layout constraints. Our proposed methodology for placing and sharing of on-chip laser sources reduces laser power. In addition to reducing the laser power to improve the energy efficiency of silicon-photonic NoCs, we propose to leverage the large bandwidth provided by silicon-photonic NoC to share computing resources. The global sharing of floating-point units can save system area by 13.75% and system power by 10%

Hybrid Nanophotonic NOC Design for GPGPU

Due to the massive computational power, Graphics Processing Units (GPUs) have become a popular platform for executing general purpose parallel applications. The majority of on-chip communications in GPU architecture occur between memory controllers and compute cores, thus memory controllers become hot spots and bottle neck when conventional mesh interconnection networks are used. Leveraging this observation, we reduce the network latency and improve throughput by providing a nanophotonic ring network which connects all memory controllers. This new interconnection network employs a new routing algorithm that combines Dimension Ordered Routing (DOR) and nanophotonic ring algorithms. By exploring this new topology, we can achieve to reduce interconnection network latency by 17% on average (up to 32%) and improve IPC by 5% on average (up to 11.5%). We also analyze application characteristics of six CUDA benchmarks on the GPGPU-Sim simulator to obtain better perspective for designing high performance GPU interconnection network

Equalized on-chip interconnect : modeling, analysis, and design

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2010.Cataloged from PDF version of thesis.Includes bibliographical references (p. 115-118).This thesis work explores the use of equalization techniques to improve throughput and reduce power consumption of on-chip interconnect. A theoretical model for an equalized on-chip interconnect is first suggested to provide mathematical formulation for the link behavior. Based on the model, a fast-design space exploration methodology is demonstrated to search for the optimal link design parameters (wire and circuit) and to generate the optimal performance-power trade-off curve for the equalized interconnects. This thesis also proposes new circuit techniques, which improve the revealed demerits of the conventional circuit topologies. The proposed charge-injection transmitter directly conducts pre-emphasis current from the supply into the channel, eliminating the power overhead of analog current subtraction in the conventional transmit pre-emphasis, while significantly relaxing the driver coefficient accuracy requirements. The transmitter utilizes a power efficient nonlinear driver by compensating non-linearity with pre-distorted equalization coefficients. A trans-impedance amplifier at the receiver achieves low static power consumption, large signal amplitude, and high bandwidth by mitigating limitations of purely-resistive termination. A test chip is fabricated in 90-nm bulk CMOS technology and tested over a 10 mm, 2[micro]m pitched on-chip differential wire. The transceiver consumes 0.37-0.63 pJ/b with 2-6 Gb/s/ch.by Byungsub Kim.Ph.D