Architectural Alternatives to Implement High-Performance Delta-Sigma Modulators

RÉSUMÉ Le besoin d’appareils portatifs, de téléphones intelligents et de systèmes microélectroniques implantables médicaux s’accroît remarquablement. Cependant, l’optimisation de l’alimentation de tous ces appareils électroniques portables est l’un des principaux défis en raison du manque de piles à grande capacité utilisées pour les alimenter. C’est un fait bien établi que le convertisseur analogique-numérique (CAN) est l’un des blocs les plus critiques de ces appareils et qu’il doit convertir efficacement les signaux analogiques au monde numérique pour effectuer un post-traitement tel que l’extraction de caractéristiques. Parmi les différents types de CAN, les modulateurs Delta Sigma (��M) ont été utilisés dans ces appareils en raison des fonctionnalités alléchantes qu’ils offrent. En raison du suréchantillonnage et pour éloigner le bruit de la bande d’intérêt, un CAN haute résolution peut être obtenu avec les architectures ��. Il offre également un compromis entre la fréquence d’échantillonnage et la résolution, tout en offrant une architecture programmable pour réaliser un CAN flexible. Ces CAN peuvent être implémentés avec des blocs analogiques de faible précision. De plus, ils peuvent être efficacement optimisés au niveau de l’architecture et circuits correspondants. Cette dernière caractéristique a été une motivation pour proposer différentes architectures au fil des ans. Cette thèse contribue à ce sujet en explorant de nouvelles architectures pour optimiser la structure ��M en termes de résolution, de consommation d’énergie et de surface de silicium. Des soucis particuliers doivent également être pris en compte pour faciliter la mise en œuvre du ��M. D’autre part, les nouveaux procédés CMOS de conception et fabrication apportent des améliorations remarquables en termes de vitesse, de taille et de consommation d’énergie lors de la mise en œuvre de circuits numériques. Une telle mise à l’échelle agressive des procédés, rend la conception de blocs analogiques tel que un amplificateur de transconductance opérationnel (OTA), difficile. Par conséquent, des soins spéciaux sont également pris en compte dans cette thèse pour surmonter les problèmes énumérés. Ayant mentionné ci-dessus que cette thèse est principalement composée de deux parties principales. La première concerne les nouvelles architectures implémentées en mode de tension et la seconde partie contient une nouvelle architecture réalisée en mode hybride tension et temps.----------ABSTRACT The need for hand-held devices, smart-phones and medical implantable microelectronic sys-tems, is remarkably growing up. However, keeping all these electronic devices power optimized is one of the main challenges due to the lack of long life-time batteries utilized to power them up. It is a well-established fact that analog-to-digital converter (ADC) is one of the most critical building blocks of such devices and it needs to efficiently convert analog signals to the digital world to perform post processing such as channelizing, feature extraction, etc. Among various type of ADCs, Delta Sigma Modulators (��Ms) have been widely used in those devices due to the tempting features they offer. In fact, due to oversampling and noise-shaping technique a high-resolution ADC can be achieved with �� architectures. It also offers a compromise between sampling frequency and resolution while providing a highly-programmable approach to realize an ADC. Moreover, such ADCs can be implemented with low-precision analog blocks. Last but not the least, they are capable of being effectively power optimized at both architectural and circuit levels. The latter has been a motivation to proposed different architectures over the years.This thesis contributes to this topic by exploring new architectures to effectively optimize the ��M structure in terms of resolution, power consumption and chip area. Special cares must also be taken into account to ease the implementation of the ��M. On the other hand, advanced node CMOS processes bring remarkable improvements in terms of speed, size and power consumption while implementing digital circuits. Such an aggressive process scaling, however, make the design of analog blocks, e.g. operational transconductance amplifiers (OTAs), cumbersome. Therefore, special cares are also taken into account in this thesis to overcome the mentioned issues. Having had above mentioned discussion, this thesis is mainly split in two main categories. First category addresses new architectures implemented in a pure voltage domain and the second category contains new architecture realized in a hybrid voltage and time domain. In doing so, the thesis first focuses on a switched-capacitor implementation of a ��M while presenting an architectural solution to overcome the limitations of the previous approaches. This limitations include a power hungry adder in a conventional feed-forward topology as well as power hungry OTAs

High efficiency delta-sigma modulation data converters

Enabled by continued device scaling in CMOS technology, more and more functions that were previously realized in separate chips are getting integrated on a single chip nowadays. Integration on silicon has opened the door to new portable wireless applications, and initiated a widespread use of these devices in our common everyday life. Wide signal bandwidth, high linearity and dynamic range, and low power dissipation are required of embedded data converters that are the performance-limiting key building blocks of those systems. Thus, power-efficient and highly-linear data conversion over wide range of signal bands is essential to get the full benefits from device scaling. This continued trend keeps innovation in the design of data converter continuing. Traditionally, delta-sigma modulation data converters proved to be very effective in applications where high resolution was necessary in a relatively narrow signal band. There have been active research efforts across academia and industry on the extension of achievable signal bandwidth without compromising the performance of these data converters. In this dissertation, architectural innovations, combined with effective design techniques for delta-sigma modulation data converters, are presented to overcome the associated limitations. The effectiveness of the proposed approaches is demonstrated by test results for the following state-of-the-art prototype designs: (1) a 0.8 V, 2.6 mW, 88 dB dual-channel audio delta-sigma modulation D/A converter with headphone driver; (2) an 88 dB ring-coupled delta-sigma ADC with 1.9 MHz bandwidth and -102.4 dB THD; (3) a multi-cell noise-coupled delta-sigma ADC with 1.9 MHz bandwidth, 88 dB DR, and -98 dB THD; (4) an 8.1 mW, 82 dB self-coupled delta-sigma ADC with 1.9 MHz bandwidth and -97 dB THD; (5) a noise-coupled time-interleaved delta-sigma ADC with 4.2 MHz bandwidth, -98 dB THD, and 79 dB SNDR; (6) a noise-coupled time-interleaved delta-sigma ADC with 2.5 MHz bandwidth, -104 dB THD, and 81 dB SNDR. As an extension of this research, two novel architectures for efficient double-sampling delta-sigma ADCs and improved low-distortion delta-sigma ADC are proposed, and validated by extensive simulations.Keywords: improved low-distortion modulator, time interleaving, data converter, multi-cell ADC, efficient double sampling, noise coupling, delta-sigma modulatio

Low-voltage low-power continuous-time delta-sigma modulator designs

Ph.DDOCTOR OF PHILOSOPH

Interface Circuits for Microsensor Integrated Systems

ca. 200 words; this text will present the book in all promotional forms (e.g. flyers). Please describe the book in straightforward and consumer-friendly terms. [Recent advances in sensing technologies, especially those for Microsensor Integrated Systems, have led to several new commercial applications. Among these, low voltage and low power circuit architectures have gained growing attention, being suitable for portable long battery life devices. The aim is to improve the performances of actual interface circuits and systems, both in terms of voltage mode and current mode, in order to overcome the potential problems due to technology scaling and different technology integrations. Related problems, especially those concerning parasitics, lead to a severe interface design attention, especially concerning the analog front-end and novel and smart architecture must be explored and tested, both at simulation and prototype level. Moreover, the growing demand for autonomous systems gets even harder the interface design due to the need of energy-aware cost-effective circuit interfaces integrating, where possible, energy harvesting solutions. The objective of this Special Issue is to explore the potential solutions to overcome actual limitations in sensor interface circuits and systems, especially those for low voltage and low power Microsensor Integrated Systems. The present Special Issue aims to present and highlight the advances and the latest novel and emergent results on this topic, showing best practices, implementations and applications. The Guest Editors invite to submit original research contributions dealing with sensor interfacing related to this specific topic. Additionally, application oriented and review papers are encouraged.

Design techniques for low noise and high speed A/D converters

Analog-to-digital (A/D) conversion is a process that bridges the real analog world to digital signal processing. It takes a continuous-time, continuous amplitude signal as its input and outputs a discrete-time, discrete-amplitude signal. The resolution and sampling rate of an A/D converter vary depending on the application. Recently, there has been a growing demand for broadband (>1 MHz), high-resolution (>14bits) A/D converters. Applications that demand such converters include asymmetric digital subscriber line (ADSL) modems, cellular systems, high accuracy instrumentation, and medical imaging systems. This thesis suggests some design techniques for such high resolution and high sampling rate A/D converters. As the A/D converter performance keeps on increasing it becomes increasingly difficult for the input driver to settle to required accuracy within the sampling time. This is because of the use of larger sampling capacitor (increased resolution) and a decrease in sampling time (higher speed). So there is an increasing trend to have a driver integrated onchip along with A/D converter. The first contribution of this thesis is to present a new precharge scheme which enables integrating the input buffer with A/D converter in standard CMOS process. The buffer also uses a novel multi-path common mode feedback scheme to stabilize the common mode loop at high speeds. Another major problem in achieving very high Signal to Noise and Distortion Ratio (SNDR) is the capacitor mismatch in Digital to Analog Converters (DAC) inherent in the A/D converters. The mismatch between the capacitor causes harmonic distortion, which may not be acceptable. The analysis of Dynamic Element Matching (DEM) technique as applicable to broadband data-converters is presented and a novel second order notch-DEM is introduced. In this thesis we present a method to calibrate the DAC. We also show that a combination of digital error correction and dynamic element matching is optimal in terms of test time or calibration time. Even if we are using dynamic element matching techniques, it is still critical to get the best matching of unit elements possible in a given technology. The matching obtained may be limited either by random variations in the unit capacitor or by gradient effects. In this thesis we present layout techniques for capacitor arrays, and the matching results obtained in measurement from a test-chip are presented. Thus we present various design techniques for high speed and low noise A/D converters in this thesis. The techniques described are quite general and can be applied to most of the types of A/D converters

Providing Bi-Directional, Analog, and Differential Signal Transmission Capability to an Electronic Prototyping Platform

RÉSUMÉ Les réseaux d’interconnexions programmables (FPIN) se retrouvent largement utilisés dans plusieurs structures bien connues telles que les FPGA, les plateformes de prototypages ainsi que dans plusieurs architectures de réseaux intégrés. Le but de la présente thèse est d’améliorer la structure actuelle des FPIN ainsi que les plateformes de prototypages se basant sur cette technologie afin d’y intégrer d’autres fonctionnalités telles que des interfaces pour les signaux bidirectionnels de type drain-ouvert, les signaux analogiques ou bien les signaux différentiels. Cette thèse présente trois différents circuits qui ont été implémentés dans cette optique. Les interconnexions de ces trois circuits peuvent être reconfigurées pour supporter une interface de type bidirectionnelle drain-ouvert, de type analogique ou différentielle, le tout au travers un réseau d’interconnexions configurable numérique unidirectionnel, ou FPIN. Le besoin d’une telle interface fut tout d’abord envisagé dans le contexte du WaferBoard, qui consiste en une plateforme reconfigurable de prototypage pour les systèmes électroniques. Le cœur de ce WaferBoard consiste en un circuit intégré à l’échelle d’une tranche entière de silicium, qui est constitué d’une matrice bidimensionnelle de cellules. Une large partie de la surface disponible s’en retrouve déjà utilisée par des plots configurables (CIO), l’aiguillage des multiplexeurs du FPIN, des registres dédiés à la chaine JTAG et d’autres circuiteries de contrôle. De ce fait, il en devient primordial que les interfaces bidirectionnelle drain-ouvert, analogique et différentielle soit les plus compactes possibles. Puisque ces circuits d’interfaces seront dédiés pour une plateforme utilisant une tranche de silicium (wafer-scale), l’architecture de ces derniers doit être robuste en regard des variations de procédé, de la température ainsi que de l’alimentation. La première contribution de cette thèse est l’élaboration et la conception d’une interface de type drain-ouvert ainsi que de son support d’interconnexion bidirectionnel utilisant un réseau numérique unidirectionnel à signalisation asymétrique (à l’opposé de la signalisation différentielle) FPIN. L’interface proposée peut interconnecter plusieurs nœuds d’un FPIN. À l’aide de cette interface, le réseau d’interconnexions peut imiter le comportement et le fonctionnement d’un bus de type drain-ouvert (ou collecteur-ouvert) (tel qu’utilisé par le protocole I2C). De ce fait, plusieurs plots de type drain-ouvert provenant d’une multitude de circuits-intégrés (ICs) différents peuvent y être connectés au travers le FPIN à l’aide de l’interface proposée.----------ABSTRACT Field programmable interconnection networks (FPINs) are ubiquitously found embedded in field-programmable gate arrays (FPGAs), in prototyping platforms, and in many Network-on-Chip architectures. The aim of this research was to augment the application domains of current FPIN-based prototyping and emulation platforms by supporting open-drain bi-directional signals, analog signals or differential signals. Three interface circuits have been elaborated and developed to that end in this thesis. These three interface circuits can support reconfigurable routing of open-drain bi-directional, analog and differential signals through an uni-directional digital FPIN. The need for such interface circuits were originally conceived in the context of the WaferBoard, a system prototyping platform. The core of the WaferBoard is a wafer-scale IC that is composed of a two dimensional array of unit cells. Available area was already over-utilized by the configurable I/O (CIO) buffers, crossbar multiplexers of the FPIN, registers of the JTAG chain, and other control circuits. Thus, the interface circuits for open-drain bi-directional, analog and differential signaling had to be made very compact. As the implementation of these interface circuits target “wafer-scale” integration, these interface circuits had to be very robust to parametric variations (process, temperature, power supply). The first contribution of this thesis is the elaboration and development of an open-drain interface circuit and a corresponding interconnect topology to support bi-directional communication through the uni-directional digital FPIN of prototyping platforms. The proposed interface can interconnect multiple nodes in a FPIN. With that interface, the interconnection network imitates the behavior of open-drain (or open-collector) buses (e.g., those following the I2C protocol). Thus, multiple open-drain I/Os from external integrated circuits (ICs) can be connected together through the FPIN by the proposed interface circuit. The interface that has been fabricated in a 0.13 µm CMOS technology takes 65 µm × 22 µm per pin. Test results show that several instances of this interface can be interconnected through the proposed interconnect topology

Analog-to-digital converter circuit and system design to improve with CMOS scaling

textThere is a need to rethink the design of analog/mixed-signal circuits to be viable in state-of-the-art nanometer-scale CMOS processes due to the hostile environment they create for analog circuits. Reduced supply voltages and smaller capacitances are beneficial to circuit speed and digital circuit power efficiency; however, these changes along with smaller dimensions and close coupling of fast-switching digital circuits have made high-accuracy voltage domain analog processing increasingly difficult. In this work, techniques to improve analog-to-digital converters (ADC) for nanometer-scale processes are explored. First, I propose a mostly-digital time-based oversampling delta-sigma (∆Σ) ADC architecture. This system uses time, rather than voltage, as the analog variable for its quantizer, where the noise shaping process is realized by modulating the width of a variable-width digital "pulse." The merits of this architecture render it not only viable to scaling, but also enable improved circuit performance with ever-increasing time resolution of scaled CMOS processes. This is in contrast to traditional voltage-based analog circuit design, whose performance generally decreases with scaling due to increasingly higher voltage uncertainty due to supply voltage reduction and short-channel effects. In conjunction with Dr. Woo Young Jung while he was a Ph.D. student at The University of Texas at Austin, two prototype implementations of the proposed architecture were designed and fabricated in TSMC 180 nm CMOS and IBM 45 nm Silicon-On-Insulator (SOI) processes. The prototype ADCs demonstrate that the architecture can achieve bandwidths of 5-20 MHz and ∼50 dB SNR with very small area. The first generation ADC core occupies an area of only 0.0275 mm² , while the second generation ADC core occupies 0.0192 mm² . The two prototypes can be categorized as some of the smallestarea modulators in the literature. Second, I analyze the measured results of the prototype ADC chips, and determine the source for the harmonic distortion. I then demonstrate a digital calibration algorithm that sufficiently mitigates the distortion. This calibration approach falls in the general philosophy of digitally-assisted analog systems. In this philosophy, digital calibration and post-correction are favored over traditional analog solutions, in which there is a high cost to the analog solution either in complexity, power, or area.Electrical and Computer Engineerin

Design Techniques for High Speed Low Voltage and Low Power Non-Calibrated Pipeline Analog to Digital Converters

The profound digitization of modern microelectronic modules made Analog-to- Digital converters (ADC) key components in many systems. With resolutions up to 14bits and sampling rates in the 100s of MHz, the pipeline ADC is a prime candidate for a wide range of applications such as instrumentation, communications and consumer electronics. However, while past work focused on enhancing the performance of the pipeline ADC from an architectural standpoint, little has been done to individually address its fundamental building blocks. This work aims to achieve the latter by proposing design techniques to improve the performance of these blocks with minimal power consumption in low voltage environments, such that collectively high performance is achieved in the pipeline ADC. Towards this goal, a Recycling Folded Cascode (RFC) amplifier is proposed as an enhancement to the general performance of the conventional folded cascode. Tested in Taiwan Semiconductor Manufacturing Company (TSMC) 0.18?m Complementary Metal Oxide Semiconductor (CMOS) technology, the RFC provides twice the bandwidth, 8-10dB additional gain, more than twice the slew rate and improved noise performance over the conventional folded cascode-all at no additional power or silicon area. The direct auto-zeroing offset cancellation scheme is optimized for low voltage environments using a dual level common mode feedback (CMFB) circuit, and amplifier differential offsets up to 50mV are effectively cancelled. Together with the RFC, the dual level CMFB was used to implement a sample and hold amplifier driving a singleended load of 1.4pF and using only 2.6mA; at 200MS/s better than 9bit linearity is achieved. Finally a power conscious technique is proposed to reduce the kickback noise of dynamic comparators without resorting to the use of pre-amplifiers. When all techniques are collectively used to implement a 1Vpp 10bit 160MS/s pipeline ADC in Semiconductor Manufacturing International Corporation (SMIC) 0.18[mu]m CMOS, 9.2 effective number of bits (ENOB) is achieved with a near Nyquist-rate full scale signal. The ADC uses an area of 1.1mm2 and consumes 42mW in its analog core. Compared to recent state-of-the-art implementations in the 100-200MS/s range, the presented pipeline ADC uses the least power per conversion rated at 0.45pJ/conversion-step

Time interleaved counter analog to digital converters

The work explores extending time interleaving in A/D converters, by applying a high-level of parallelism to one of the slowest and simplest types of data-converters, the counter ADC. The motivation for the work is to realise high-performance re-configurable A/D converters for use in multi-standard and multi-PHY communication receivers with signal bandwidths in the 10s to 100s of MHz. The counter ADC requires only a comparator, a ramp signal, and a digital counter, where the comparator compares the sampled input against all possible quantisation levels sequentially. This work explores arranging counter ADCs in large time-interleaved arrays, building a Time Interleaved Counter (TIC) ADC. The key to realising a TIC ADC is distributed sampling and a global multi-phase ramp generator realised with a novel figure-of-8 rotating resistor ring. Furthermore Counter ADCs allow for re-configurability between effective sampling rate and resolution due to their sequential comparison of reference levels in conversion. A prototype TIC ADC of 128-channels was fabricated and measured in 0.13μm CMOS technology, where the same block can be configured to operate as a 7-bit 1GS/s, 8-bit 500MS/s, or 9-bit 250MS/s dataconverter. The ADC achieves a sub 400fJ/step FOM in all modes of configuration