An Optimal Gate Design for the Synthesis of Ternary Logic Circuits

Department of Electrical EngineeringOver the last few decades, CMOS-based digital circuits have been steadily developed. However, because of the power density limits, device scaling may soon come to an end, and new approaches for circuit designs are required. Multi-valued logic (MVL) is one of the new approaches, which increases the radix for computation to lower the complexity of the circuit. For the MVL implementation, ternary logic circuit designs have been proposed previously, though they could not show advantages over binary logic, because of unoptimized synthesis techniques. In this thesis, we propose a methodology to design ternary gates by modeling pull-up and pull-down operations of the gates. Our proposed methodology makes it possible to synthesize ternary gates with a minimum number of transistors. From HSPICE simulation results, our ternary designs show significant power-delay product reductions; 49 % in the ternary full adder and 62 % in the ternary multiplier compared to the existing methodology. We have also compared the number of transistors in CMOS-based binary logic circuits and ternary device-based logic circuits We propose a methodology for using ternary values effectively in sequential logic. Proposed ternary D flip-flop is designed to normally operate in four-edges of a ternary clock signal. A quad-edge-triggered ternary D flip-flop (QETDFF) is designed with static gates using CNTFET. From HSPICE simulation results, we have confirmed that power-delay-product (PDP) of QETDFF is reduced by 82.31 % compared to state of the art ternary D flip-flop. We synthesize a ternary serial adder using QETDFF. PDP of the proposed ternary serial adder is reduced by 98.23 % compared to state of the art design.ope

Novel Ternary Logic Gates Design in Nanoelectronics

In this paper, standard ternary logic gates are initially designed to considerably reduce static power consumption. This study proposes novel ternary gates based on two supply voltages in which the direct current is eliminated and the leakage current is reduced considerably. In addition, ST-OR and ST-AND are generated directly instead of ST-NAND and ST-NOR. The proposed gates have a high noise margin near V_(DD)/4. The simulation results indicated that the power consumption and PDP underwent a~sharp decrease and noise margin showed a considerable increase in comparison to both one supply and two supply based designs in previous works. PDP is improved in the proposed OR, as compared to one supply and two supply based previous works about 83% and 63%, respectively. Also, a memory cell is designed using the proposed STI logic gate, which has a considerably lower static power to store logic ‘1’ and the static noise margin, as compared to other designs

Designing a Novel High Performance Four-to-Two Compressor Cell Based on CNTFET Technology for Low Voltages

Compressor cell is often placed in critical path of multiplier circuits to perform partial product summation. Therefore it plays a significant role in determining the entire performance of multiplier and digital system. Respecting to the necessity of low power design for portable electronic, designing a low power and high performance compressors seems to be a good solution to overcome of these problems for computations. In this paper a novel high performance four-to-two compressor cell is proposed using Carbon Nanotube Field Effect Transistors (CNTFETs) technology. The new cell is based on Majority Function, NOR, and NAND gates. The main advantage of proposed design in comparison with former cells is the ease of obtaining CARRY output by means of Majority function. Simulations have been done with 32nm technology node using Synopsys HSPICE software. Simulation results confirm the priority of the proposed cell compared to other state-of-the-art four-to-two compressor cells

Energy Efficient CNTFET Based Full Adder Using Hybrid Logic

Full Adder is the basic element for arithmetic operations used in Very Large Scale Integrated (VLSI) circuits, therefore, optimization of 1-bit full adder cell improves the overall performance of electronic devices. Due to unique mechanical and electrical characteristics, carbon nanotube field effect transistors (CNTFET) are found to be the most suitable alternative for metal oxide field effect transistor (MOSFET). CNTFET transistor utilizes carbon nanotube (CNT) in the channel region. In this paper, high speed, low power and reduced transistor count full adder cell using CNTFET 32nm technology is presented. Two input full swing XOR gate is designed using 4 transistors which is further used to generate Sum and Carry output signals with the help of Gate-Diffusion-Input (GDI) Technique thus reducing the number of transistors involved. Proposed design simulated in Cadence Virtuoso with 32nm CNTFET technology and results is better design as compared to existing circuits in terms of Power, Delay, Power-Delay-Product (PDP), Energy Consumption and Energy-Delay-Product (EDP)

Novel High Performance Ultra Low Power Static Random Access Memories (SRAMs) Based on Next Generation Technologies

Title from PDF of title page viewed January 27, 2021Dissertation advisor: Masud H. ChowdhuryVitaIncludes bibliographical references (page 107-120)Thesis (Ph.D.)--School of Computing and Engineering. University of Missouri--Kansas City, 2019Next Big Thing Is Surely Small: Nanotechnology Can Bring Revolution. Nanotechnology leads the world towards many new applications in various fields of computing, communication, defense, entertainment, medical, renewable energy and environment. These nanotechnology applications require an energy-efficient memory system to compute and process. Among all the memories, Static Random Access Memories (SRAMs) are high performance memories and occupies more than 50% of any design area. Therefore, it is critical to design high performance and energy-efficient SRAM design. Ultra low power and high speed applications require a new generation memory capable of operating at low power as well as low execution time. In this thesis, a novel 8T SRAM design is proposed that offers significantly faster access time and lowers energy consumption along with better read stability and write ability. The proposed design can be used in the conventional SRAM as well as in computationally intensive applications like neural networks and machine learning classifiers [1]-[4]. Novel 8T SRAM design offers higher energy efficiency, reliability, robustness and performance compared to the standard 6T and other existing 8T and 9T designs. It offers the advantages of a 10T SRAM without the additional area, delay and power overheads of the 10T SRAM. The proposed 8T SRAM would be able to overcome many other limitations of the conventional 6T and other 7T, 8T and 9T designs. The design employs single bitline for the write operation, therefore the number of write drivers are reduced. The defining feature of the proposed 8T SRAM is its hybrid design, which is the combination of two techniques: (i) the utilization of single-ended bitline and (ii) the utilization of virtual ground. The single-ended bitline technique ensures separate read and write operations, which eventually reduces the delay and power consumption during the read and write operations. It's independent read and write paths allow the use of the minimum sized access transistors and aid in a disturb-free read operation. The virtual ground weakens the positive feedback in the SRAM cell and improves its write ability. The virtual ground technique is also used to reduce leakages. The proposed design does not require precharging the bitlines for the read operation, which reduces the area and power overheads of the memory system by eliminating the precharging circuit. The design isolates the storage node from the read path, which improves the read stability. For reliability study, we have investigated the static noise margin (SNM) of the proposed 8T SRAM, for which, we have used two methods – (i) the traditional SNM method with the butterfly curve, (ii) the N-curve method A comparative analysis is performed between the proposed and the existing SRAM designs in terms of area, total power consumption during the read and write operations, and stability and reliability. All these advantages make the proposed 8T SRAM design an ideal candidate for the conventional and computationally intensive applications like machine learning classifier and deep learning neural network. In addition to this, there is need for next generation technologies to design SRAM memory because the conventional CMOS technology is approaching its physical and performance boundaries and as a consequence, becoming incompatible with ultra-low-power applications. Emerging devices such as Tunnel Field Effect Transistor (TFET)) and Graphene Nanoribbon Field Effect Transistor (GNRFET) devices are highly potential candidates to overcome the limitations of MOSFET because of their ability to achieve subthreshold slopes below 60 mV/decade and very low leakage currents [6]-[9]. This research also explores novel TFET and GNRFET based 6T SRAM. The thesis evaluates the standby leakage power in the Tunnel FET (TFET) based 6T SRAM cell for different pull-up, pull-down, and pass-gate transistors ratios (PU: PD: PG) and compared to 10nm FinFET based 6T SRAM designs. It is observed that the 10nm TFET based SRAMs have 107.57%, 163.64%, and 140.44% less standby leakage power compared to the 10nm FinFET based SRAMs when the PU: PD: PG ratios are 1:1:1, 1:5:2 and 2:5:2, respectively. The thesis also presents an analysis of the stability and reliability of sub-10nm TFET based 6T SRAM circuit with a reduced supply voltage of 500mV. The static noise margin (SNM), which is a critical measure of SRAM stability and reliability, is determined for hold, read and write operations of the 6T TFET SRAM cell. The robustness of the optimized TFET based 6T SRAM circuit is also evaluated at different supply voltages. Simulations were done in HSPICE and Cadence tools. From the analysis, it is clear that the main advantage of the TFET based SRAM would be the significant improvement in terms of leakage or standby power consumption. Compared to the FinFET based SRAM the standby leakage power of the T-SRAMs are 107.57%, 163.64%, and 140.44% less for 1:1:1, 1:5:2 and 2:5:2 configurations, respectively. Since leakage/standby power is the primary source of power consumption in the SRAM, and the overall system energy efficiency depends on SRAM power consumption, TFET based SRAM would lead to massive improvement of the energy efficiency of the system. Therefore, T-SRAMs are more suitable for ultra-low power applications. In addition to this, the thesis evaluates the standby leakage power of types of Graphene Nanoribbon FETs based 6T SRAM bitcell and compared to 10nm FinFET based 6T SRAM bitcell. It is observed that the 10nm MOS type GNRFET based SRAMs have 16.43 times less standby leakage power compared to the 10nm FinFET based SRAMs. The double gate SB-GNRFET based SRAM consumes 1.35E+03 times less energy compared to the 10nm FinFET based SRAM during write. However, during read double gate SB-GNRFET based SRAM consume 15 times more energy than FinFET based SRAM. It is also observed that GNRFET based SRAMs are more stable and reliable than FinFET based SRAM.Introduction -- Background -- Novel High Performance Ultra Low Power SRAM Design -- Tunnel FET Based SRAM Design -- Graphene Nanoribbon FET Based SRAM Design -- Double-gate FDSOI Based SRAM Designs -- Novel CNTFET and MEMRISTOR Based Digital Designs -- Conclusio

DESIGN OF MULTI-VALUED LOGIC CELLS USING SINGLE-ELECTRON DEVICES

This thesis proposes a new single-electron tunneling based NDC block and develops an analytical model which can be used for related circuit designs and/or their performance optimization. A piece-wise model is used to describe the I-V characteristics of the proposed NDC block. Four applications based on this NDC block are proposed: (1) Multiple-valued logic static memory cell (2) Schmitt trigger (3) Three-stage ring oscillator (4) ternary full adder using hybrid single-electron transistor and MOS technology. Simulation was done using Cadence Spectre simulator with 180nnm CMOS model and SET MIB macro mode to estimate the performance

Ultra-Low Power Ternary CMOS Platform for Physical Synthesis of Multi-Valued Logic and Memory Applications

Department of Electrical EngineeringMotivation of this work is to provide feasible, scalable, and designable multi-valued logic (MVL) device platform for physical synthesis of MVL circuits. Especially, ternary device and its general logic functions are focused, owing to most efficiently reduced circuit complexity per radix (R) increase. By designing the OFF-state constant current, not only the standby power (PS) issue of additional intermediate state is overcome, but also continuous supply voltage (VDD) scaling and dynamic power (PD) scaling are possible owing to single-step I-V characteristics. By applying a novel ternary device concept to CMOS technology with OFF-state current mechanism of band-to-band tunneling (BTBT) currents (IBTBT) and subthreshold diffusion current (Isub), the logic changes from binary to ternary are confirmed using mixed-mode device simulation. I experimentally demonstrate ternary CMOS (T-CMOS) and verified its low-power standard ternary inverter (STI) operation by designing channel profiles in conventional binary CMOS. The realized complementary ternary n/pMOS (T-n/pMOS) have fully gate bias (VG)-independent and symmetrical IBTBT of ~10 pA/???m based on proven ion-implantation process, which produces stable and designable intermediate state (VOM) at exactly VDD/2. To present T-CMOS design frameworks in terms of static noise margin (SNM) enhancement and ultra-low power operation, I develop the compact model of T-CMOS and verify the physical model parameters with experimental data. Through the feasible design of Isub with abrupt channel profile based on low thermal budget process, STI has a SNM of 283 mV (80 % of ideal SNM) at VDD= 1V operation and intermediate state stability of ??VOM < ?? 0.1V, even considering the random-dopant fluctuation (RDF) of 32 nm and 22 nm technology. Continuous VDD scaling below 0.5V (SNM= 40% at VDD = 0.3V) enables STI operation with ultra-low PD and PS based on exponentially reduced IBTBT currents. As MVL and memory (MVM) applications, minimum(MIN)/maximum(MAX) gates, analog-to-digital converter (ADC) circuit, and 5-state latch are studied with T-CMOS compact model. Especially ADC circuits revolutionary decreases number of device and circuit interconnection with 9.6% area of binary system.ope

Technological Solution beyond MOSFET and Binary Logic Device

Title from PDF of title page viewed January 31, 2019Thesis advisor: Masud ChowdhuryVitaIncludes bibliographical references (pages 64-70)Thesis (M.S.)--School of Computing and Engineering, University of Missouri--Kansas City, 2018Today’s technology is based on the binary number system-based circuitry, which is the outcome of the simple on and off switching mechanism of the prevailing transistors. Consideration of higher radix number system can eradicate or lessen many limitations of binary number system such as the saturation of Moore’s law. The most substantial potential benefits of higher radix approaches are the decrease of wiring complexity. Excessive scaling of the technologies has led the researchers beyond Binary Logic and MOSFET technology. TFET considered as one of the most promising options for low-power application for beyond MOSFET technologies. Graphene Nano Ribbon, due to its high-carrier mobility, tunable bandgap and its outstanding electrostatic control of device gate becomes ideal choice for channel material of TFET. This paper proposes double gated ultra-thin body (UTB) TFET device model using Graphene nano ribbon as the channel material. In this paper evaluation of the model by performing the comparative analysis with InAs as the channel material in terms of Ec-Ev on and off state and Id-Vg characteristics is presented. The feasibility of multi valued logic system in real-world rests on two serious aspects, such as, the easiness of mathematical approach for implementing the multivalued logic into today’s technology and the sufficiency of synthesis techniques. In this paper, we have focused on the different technology available for implementing multivalued logic especially ternary logic. Ternary logic devices are expected to lead to an exponential increase of the information handling capability, which binary logic cannot support. Memory capacitor or memcapacitor is an emerging device that exhibits hysteresis behavior, which can be manipulated by external parameters, such as, the applied electric field or voltage. One of the unique properties of the memcapacitor is that by using the percolation approach, we can achieve Metal-Insulator-Transition (MIT) phenomenon, which can be utilized to obtain a staggered hysteresis loop. For multivalued logic devices staggered hysteresis behavior is the critical requirement. In this paper, we propose a new conceptual design of a ternary logic device by vertically stacking dielectric material interleaved with layers of graphene nanoribbon (GNR) between two external metal plates. The proposed device structure displays the memcapacitive behavior with the fast switching metal-to-insulator transition in picosecond scale. The device model is later extended into a vertical-cascaded version, which acts as a ternary device.Introduction -- Multi valued logic -- Overview of different MVL technologies -- Graphene memcapacitor based ternary logic device -- Graphene nano ribbon based TFET -- Conclusion and future wor

Multiple bit error correcting architectures over finite fields

This thesis proposes techniques to mitigate multiple bit errors in GF arithmetic circuits. As GF arithmetic circuits such as multipliers constitute the complex and important functional unit of a crypto-processor, making them fault tolerant will improve the reliability of circuits that are employed in safety applications and the errors may cause catastrophe if not mitigated. Firstly, a thorough literature review has been carried out. The merits of efficient schemes are carefully analyzed to study the space for improvement in error correction, area and power consumption. Proposed error correction schemes include bit parallel ones using optimized BCH codes that are useful in applications where power and area are not prime concerns. The scheme is also extended to dynamically correcting scheme to reduce decoder delay. Other method that suits low power and area applications such as RFIDs and smart cards using cross parity codes is also proposed. The experimental evaluation shows that the proposed techniques can mitigate single and multiple bit errors with wider error coverage compared to existing methods with lesser area and power consumption. The proposed scheme is used to mask the errors appearing at the output of the circuit irrespective of their cause. This thesis also investigates the error mitigation schemes in emerging technologies (QCA, CNTFET) to compare area, power and delay with existing CMOS equivalent. Though the proposed novel multiple error correcting techniques can not ensure 100% error mitigation, inclusion of these techniques to actual design can improve the reliability of the circuits or increase the difficulty in hacking crypto-devices. Proposed schemes can also be extended to non GF digital circuits