130 research outputs found

    Efficient Sharing of Optical Resources in Low-Power Optical Networks-on-Chip

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    With the ever-growing core counts in modern computing systems, NoCs consume an increasing part of the power budget due to bandwidth and power density limitations of electrical interconnects. To maintain performance and power scaling, alternative technologies are required, with silicon photonics, sophisticated network designs are required to minimize static power overheads. In this paper, we propose Amon, a low-power ONoC that decreases number of μRings, wavelengths and path losses to reduce power consumption. Amom performs destination checking prior to data transmission on an underlying control network, allowing the sharing per-Watt by at least 23% (up to 70%), while reducing power without latency overheads on both synthetic and realistic applications. For aggressive optical technology parameters, Amom considerably outperforms all alternative NoCs in terms of power, outlining its increasing superiority as technology matures

    Accelerating Fully Connected Neural Network on Optical Network-on-Chip (ONoC)

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    Fully Connected Neural Network (FCNN) is a class of Artificial Neural Networks widely used in computer science and engineering, whereas the training process can take a long time with large datasets in existing many-core systems. Optical Network-on-Chip (ONoC), an emerging chip-scale optical interconnection technology, has great potential to accelerate the training of FCNN with low transmission delay, low power consumption, and high throughput. However, existing methods based on Electrical Network-on-Chip (ENoC) cannot fit in ONoC because of the unique properties of ONoC. In this paper, we propose a fine-grained parallel computing model for accelerating FCNN training on ONoC and derive the optimal number of cores for each execution stage with the objective of minimizing the total amount of time to complete one epoch of FCNN training. To allocate the optimal number of cores for each execution stage, we present three mapping strategies and compare their advantages and disadvantages in terms of hotspot level, memory requirement, and state transitions. Simulation results show that the average prediction error for the optimal number of cores in NN benchmarks is within 2.3%. We further carry out extensive simulations which demonstrate that FCNN training time can be reduced by 22.28% and 4.91% on average using our proposed scheme, compared with traditional parallel computing methods that either allocate a fixed number of cores or allocate as many cores as possible, respectively. Compared with ENoC, simulation results show that under batch sizes of 64 and 128, on average ONoC can achieve 21.02% and 12.95% on reducing training time with 47.85% and 39.27% on saving energy, respectively.Comment: 14 pages, 10 figures. This paper is under the second review of IEEE Transactions of Computer

    Handshake and Circulation Flow Control in Nanaphotonic Interconnects

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    Nanophotonics has been proposed to design low latency and high bandwidth Network-On-Chip (NOC) for future Chip Multi-Processors (CMPs). Recent nanophotonic NOC designs adopt the token-based arbitration coupled with credit-based flow control, which leads to low bandwidth utilization. This thesis proposes two handshake schemes for nanophotonic interconnects in CMPs, Global Handshake (GHS) and Distributed Handshake (DHS), which get rid of the traditional credit-based flow control, reduce the average token waiting time, and finally improve the network throughput. Furthermore, we enhance the basic handshake schemes with setaside buffer and circulation techniques to overcome the Head-Of-Line (HOL) blocking. The evaluations show that the proposed handshake schemes improve network throughput by up to 11x under synthetic workloads. With the extracted trace traffic from real applications, the handshake schemes can reduce the communication delay by up to 55%. The basic handshake schemes add only 0.4% hardware overhead for optical components and negligible power consumption. In addition, the performance of the handshake schemes is independent of on-chip buffer space, which makes them feasible in a large scale nanophotonic interconnect design

    Multi-level analysis of on-chip optical wireless links

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    Networks-on-chip are being regarded as a promising solution to meet the on-going requirement for higher and higher computation capacity. In view of future kilo-cores architectures, electrical wired connections are likely to become inefficient and alternative technologies are being widely investigated. Wireless communications on chip may be therefore leveraged to overcome the bottleneck of physical interconnections. This work deals with wireless networks-on-chip at optical frequencies, which can simplify the network layout and reduce the communication latency, easing the antenna on-chip integration process at the same time. On the other end, optical wireless communication on-chip can be limited by the heavy propagation losses and the possible cross-link interference. Assessment of the optical wireless network in terms of bit error probability and maximum communication range is here investigated through a multi-level approach. Manifold aspects, concurring to the final system performance, are simultaneously taken into account, like the antenna radiation properties, the data-rate of the core-to core communication, the geometrical and electromagnetic layout of the chip and the noise and interference level. Simulations results suggest that communication up to some hundreds of \u3bcm can be pursued provided that the antenna design and/or the target data-rate are carefully tailored to the actual layout of the chip

    Multi-level analysis of on-chip optical wireless links

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    Networks-on-chip are being regarded as a promising solution to meet the on-going requirement for higher and higher computation capacity. In view of future kilo-cores architectures, electrical wired connections are likely to become inefficient and alternative technologies are being widely investigated. Wireless communications on chip may be therefore leveraged to overcome the bottleneck of physical interconnections. This work deals with wireless networks-on-chip at optical frequencies, which can simplify the network layout and reduce the communication latency, easing the antenna on-chip integration process at the same time. On the other end, optical wireless communication on-chip can be limited by the heavy propagation losses and the possible cross-link interference. Assessment of the optical wireless network in terms of bit error probability and maximum communication range is here investigated through a multi-level approach. Manifold aspects, concurring to the final system performance, are simultaneously taken into account, like the antenna radiation properties, the data-rate of the core-to core communication, the geometrical and electromagnetic layout of the chip and the noise and interference level. Simulations results suggest that communication up to some hundreds of μm can be pursued provided that the antenna design and/or the target data-rate are carefully tailored to the actual layout of the chip

    Thermal Aware Design Method for VCSEL-Based On-Chip Optical Interconnect

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    Optical Network-on-Chip (ONoC) is an emerging technology considered as one of the key solutions for future generation on-chip interconnects. However, silicon photonic devices in ONoC are highly sensitive to temperature variation, which leads to a lower efficiency of Vertical-Cavity Surface-Emitting Lasers (VCSELs), a resonant wavelength shift of Microring Resonators (MR), and results in a lower Signal to Noise Ratio (SNR). In this paper, we propose a methodology enabling thermal-aware design for optical interconnects relying on CMOS-compatible VCSEL. Thermal simulations allow designing ONoC interfaces with low gradient temperature and analytical models allow evaluating the SNR.Comment: IEEE International Conference on Design Automation and Test in Europe (DATE 2015), Mar 2015, Grenoble, France. 201

    Towards Compelling Cases for the Viability of Silicon-Nanophotonic Technology in Future Many-core Systems

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    Many crossbenchmarking results reported in the open literature raise optimistic expectations on the use of optical networks-on-chip (ONoCs) for high-performance and low-power on-chip communications in future Manycore Systems. However, these works ultimately fail to make a compelling case for the viability of silicon-nanophotonic technology for two fundamental reasons: (1)Lack of aggressive electrical baselines (ENoCs). (2) Inaccuracy in physical- and architecture-layer analysis of the ONoC. This thesis aims at providing the guidelines and minimum requirements so that nanophotonic emerging technology may become of practical relevance. The key enabler for this study is a cross-layer design methodology of the optical transport medium, ranging from the consideration of the predictability gap between ONoC logic schemes and their physical implementations, up to architecture-level design issues such as the network interface and its co-design requirements with the memory hierarchy. In order to increase the practical relevance of the study, we consider a consolidated electrical NoC counterpart with an optimized architecture from a performance and power viewpoint. The quality metrics of this latter are derived from synthesis and place&route on an industrial 40nm low-power technology library. Building on this methodology, we are able to provide a realistic energy efficiency comparison between ONoC and ENoC both at the level of the system interconnect and of the system as a whole, pointing out the sensitivity of the results to the maturity of the underlying silicon nanophotonic technology, and at the same time paving the way towards compelling cases for the viability of such technology in next generation many-cores systems

    Accelerating Communication in On-Chip Interconnection Networks

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    Due to the ever-shrinking feature size in CMOS process technology, it is expected that future chip multiprocessors (CMPs) will have hundreds or thousands of processing cores. To support a massively large number of cores, packet-switched on-chip interconnection networks have become a de facto communication paradigm in CMPs. However, the on-chip networks have several drawbacks, such as limited on-chip resources, increasing communication latency, and insufficient communication bandwidth. In this dissertation, several schemes are proposed to accelerate communication in on-chip interconnection networks within area and cost budgets to overcome the problems. First, an early transition scheme for fully adaptive routing algorithms is proposed to improve network throughput. Within a limited number of resources, previously proposed fully adaptive routing algorithms have low utilization in escape channels. To increase utilization of escape channels, it transfers packets earlier before the normal channels are full. Second, a pseudo-circuit scheme is proposed to reduce network latency using communication temporal locality. Reducing per-hop router delay becomes more important for communication latency reduction in larger on-chip interconnection networks. To improve communication latency, the previous arbitration information is reused to bypass switch arbitration. For further acceleration, we also propose two aggressive schemes, pseudo-circuit speculation and buffer bypassing. Third, two handshake schemes are proposed to improve network throughput for nanophotonic interconnects. Nanophotonic interconnects have been proposed to replace metal wires with optical links in on-chip interconnection networks for low latency and power consumptions as well as high bandwidth. To minimize the average token waiting time of the nanophotonic interconnects, the traditional credit-based flow control is removed. Thus, the handshake schemes increase link utilization and enhance network throughput

    Open-access silicon photonics: current status and emerging initiatives

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    Silicon photonics is widely acknowledged as a game-changing technology driven by the needs of datacom and telecom. Silicon photonics builds on highly capital-intensive manufacturing infrastructure, and mature open-access silicon photonics platforms are translating the technology from research fabs to industrial manufacturing levels. To meet the current market demands for silicon photonics manufacturing, a variety of open-access platforms is offered by CMOS pilot lines, R&D institutes, and commercial foundries. This paper presents an overview of existing and upcoming commercial and noncommercial open-access silicon photonics technology platforms. We also discuss the diversity in these open-access platforms and their key differentiators
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