Next generation RFID telemetry design for biomedical implants.

The design and development of a Radio Frequency Identification (RFID) based pressure-sensing system to increase the range of current Intra-Ocular Pressure (IOP) sensing systems is described in this dissertation. A large number of current systems use near-field inductive coupling for the transfer of energy and data, which limits the operational range to only a few centimeters and does not allow for continuous monitoring of pressure. Increasing the powering range of the telemetry system will offer the possibility of continuous monitoring since the reader can be attached to a waist belt or put on a night stand when sleeping. The system developed as part of this research operates at Ultra-High Frequencies (UHF) and makes use of the electromagnetic far field to transfer energy and data, which increases the potential range of operation and allows for the use of smaller antennas. The system uses a novel electrically small antenna (ESA) to receive the incident RF signal. A four stage Schottky circuit rectifies and multiplies the received RF signal and provides DC power to a Colpitts oscillator. The oscillator is connected to a pressure sensor and provides an output signal frequency that is proportional to the change in pressure. The system was fabricated using a mature, inexpensive process. The performance of the system compares well with current state of the art, but uses a smaller antenna and a less expensive fabrication process. The system was able to operate over the desired range of 1 m using a half-wave dipole antenna. It was possible to power the system over a range of at least 6.4 cm when the electrically small antenna was used as the receiving antenna

A Fully-Integrated Reconfigurable Dual-Band Transceiver for Short Range Wireless Communications in 180 nm CMOS

© 2015 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.A fully-integrated reconfigurable dual-band (760-960 MHz and 2.4-2.5 GHz) transceiver (TRX) for short range wireless communications is presented. The TRX consists of two individually-optimized RF front-ends for each band and one shared power-scalable analog baseband. The sub-GHz receiver has achieved the maximum 75 dBc 3rd-order harmonic rejection ratio (HRR3) by inserting a Q-enhanced notch filtering RF amplifier (RFA). In 2.4 GHz band, a single-ended-to-differential RFA with gain/phase imbalance compensation is proposed in the receiver. A ΣΔ fractional-N PLL frequency synthesizer with two switchable Class-C VCOs is employed to provide the LOs. Moreover, the integrated multi-mode PAs achieve the output P1dB (OP1dB) of 16.3 dBm and 14.1 dBm with both 25% PAE for sub-GHz and 2.4 GHz bands, respectively. A power-control loop is proposed to detect the input signal PAPR in real-time and flexibly reconfigure the PA's operation modes to enhance the back-off efficiency. With this proposed technique, the PAE of the sub-GHz PA is improved by x3.24 and x1.41 at 9 dB and 3 dB back-off powers, respectively, and the PAE of the 2.4 GHz PA is improved by x2.17 at 6 dB back-off power. The presented transceiver has achieved comparable or even better performance in terms of noise figure, HRR, OP1dB and power efficiency compared with the state-of-the-art.Peer reviewe

Interface Circuits for Microsensor Integrated Systems

ca. 200 words; this text will present the book in all promotional forms (e.g. flyers). Please describe the book in straightforward and consumer-friendly terms. [Recent advances in sensing technologies, especially those for Microsensor Integrated Systems, have led to several new commercial applications. Among these, low voltage and low power circuit architectures have gained growing attention, being suitable for portable long battery life devices. The aim is to improve the performances of actual interface circuits and systems, both in terms of voltage mode and current mode, in order to overcome the potential problems due to technology scaling and different technology integrations. Related problems, especially those concerning parasitics, lead to a severe interface design attention, especially concerning the analog front-end and novel and smart architecture must be explored and tested, both at simulation and prototype level. Moreover, the growing demand for autonomous systems gets even harder the interface design due to the need of energy-aware cost-effective circuit interfaces integrating, where possible, energy harvesting solutions. The objective of this Special Issue is to explore the potential solutions to overcome actual limitations in sensor interface circuits and systems, especially those for low voltage and low power Microsensor Integrated Systems. The present Special Issue aims to present and highlight the advances and the latest novel and emergent results on this topic, showing best practices, implementations and applications. The Guest Editors invite to submit original research contributions dealing with sensor interfacing related to this specific topic. Additionally, application oriented and review papers are encouraged.

A Multi-functional Touch Panel for Multi-Dimensional Sensing in Interactive Displays

This thesis presents a flexible graphene/polyvinylidene difluoride (PVDF)/graphene sandwich for three-dimensional touch interactivity. Here, an x-y plane touch is sensed using graphene capacitive elements, while force sensing in the z-direction is by a piezoelectric PVDF/graphene sandwich. By employing different frequency bands for the capacitive- and force-induced electrical signals, the two stimuli are detected simultaneously, achieving three-dimensional touch sensing. Static force sensing and elimination of propagated stress are achieved by augmenting the transient piezo output with the capacitive touch, thus overcoming the intrinsic inability of the piezoelectric material in detecting non-transient force signals and avoiding force touch mis-registration by propagated stress. As a capacitive signal is important for force touch interpretation, optimization algorithms have been developed and implemented. With correlated double sampling (CDS) and spatial low-pass filtering (SLPF) based techniques, the signal-to-noise ratio (SNR) of the capacitive touch signal is boosted by 15.6 dB, indicating improved detection accuracy. In terms of the readout speed, fixed pattern and random pattern related down-sampling techniques are applied, giving rise to reductions in both readout time (11.3 ms) and power consumption (8.79 mW).China Scholarship Counci

Ultra-low Power Circuits for Internet of Things (IOT)

Miniaturized sensor nodes offer an unprecedented opportunity for the semiconductor industry which led to a rapid development of the application space: the Internet of Things (IoT). IoT is a global infrastructure that interconnects physical and virtual things which have the potential to dramatically improve people's daily lives. One of key aspect that makes IoT special is that the internet is expanding into places that has been ever reachable as device form factor continue to decreases. Extremely small sensors can be placed on plants, animals, humans, and geologic features, and connected to the Internet. Several challenges, however, exist that could possibly slow the development of IoT. In this thesis, several circuit techniques as well as system level optimizations to meet the challenging power/energy requirement for the IoT design space are described. First, a fully-integrated temperature sensor for battery-operated, ultra-low power microsystems is presented. Sensor operation is based on temperature independent/dependent current sources that are used with oscillators and counters to generate a digital temperature code. Second, an ultra-low power oscillator designed for wake-up timers in compact wireless sensors is presented. The proposed topology separates the continuous comparator from the oscillation path and activates it only for short period when it is required. As a result, both low power tracking and generation of precise wake-up signal is made possible. Third, an 8-bit sub-ranging SAR ADC for biomedical applications is discussed that takes an advantage of signal characteristics. ADC uses a moving window and stores the previous MSBs voltage value on a series capacitor to achieve energy saving compared to a conventional approach while maintaining its accuracy. Finally, an ultra-low power acoustic sensing and object recognition microsystem that uses frequency domain feature extraction and classification is presented. By introducing ultra-low 8-bit SAR-ADC with 50fF input capacitance, power consumption of the frontend amplifier has been reduced to single digit nW-level. Also, serialized discrete Fourier transform (DFT) feature extraction is proposed in a digital back-end, replacing a high-power/area-consuming conventional FFT.PHDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttps://deepblue.lib.umich.edu/bitstream/2027.42/137157/1/seojeong_1.pd

Integrated Circuits and Systems for Smart Sensory Applications

Connected intelligent sensing reshapes our society by empowering people with increasing new ways of mutual interactions. As integration technologies keep their scaling roadmap, the horizon of sensory applications is rapidly widening, thanks to myriad light-weight low-power or, in same cases even self-powered, smart devices with high-connectivity capabilities. CMOS integrated circuits technology is the best candidate to supply the required smartness and to pioneer these emerging sensory systems. As a result, new challenges are arising around the design of these integrated circuits and systems for sensory applications in terms of low-power edge computing, power management strategies, low-range wireless communications, integration with sensing devices. In this Special Issue recent advances in application-specific integrated circuits (ASIC) and systems for smart sensory applications in the following five emerging topics: (I) dedicated short-range communications transceivers; (II) digital smart sensors, (III) implantable neural interfaces, (IV) Power Management Strategies in wireless sensor nodes and (V) neuromorphic hardware

A Low-Power, Reconfigurable, Pipelined ADC with Automatic Adaptation for Implantable Bioimpedance Applications

Biomedical monitoring systems that observe various physiological parameters or electrochemical reactions typically cannot expect signals with fixed amplitude or frequency as signal properties can vary greatly even among similar biosignals. Furthermore, advancements in biomedical research have resulted in more elaborate biosignal monitoring schemes which allow the continuous acquisition of important patient information. Conventional ADCs with a fixed resolution and sampling rate are not able to adapt to signals with a wide range of variation. As a result, reconfigurable analog-to-digital converters (ADC) have become increasingly more attractive for implantable biosensor systems. These converters are able to change their operable resolution, sampling rate, or both in order convert changing signals with increased power efficiency. Traditionally, biomedical sensing applications were limited to low frequencies. Therefore, much of the research on ADCs for biomedical applications focused on minimizing power consumption with smaller bias currents resulting in low sampling rates. However, recently bioimpedance monitoring has become more popular because of its healthcare possibilities. Bioimpedance monitoring involves injecting an AC current into a biosample and measuring the corresponding voltage drop. The frequency of the injected current greatly affects the amplitude and phase of the voltage drop as biological tissue is comprised of resistive and capacitive elements. For this reason, a full spectrum of measurements from 100 Hz to 10-100 MHz is required to gain a full understanding of the impedance. For this type of implantable biomedical application, the typical low power, low sampling rate analog-to-digital converter is insufficient. A different optimization of power and performance must be achieved. Since SAR ADC power consumption scales heavily with sampling rate, the converters that sample fast enough to be attractive for bioimpedance monitoring do not have a figure-of-merit that is comparable to the slower converters. Therefore, an auto-adapting, reconfigurable pipelined analog-to-digital converter is proposed. The converter can operate with either 8 or 10 bits of resolution and with a sampling rate of 0.1 or 20 MS/s. Additionally, the resolution and sampling rate are automatically determined by the converter itself based on the input signal. This way, power efficiency is increased for input signals of varying frequency and amplitude

Energy-efficient data converter design in scaled CMOS technology

Data converters bridge the physical and digital worlds. They have been the crucial building blocks in modern electronic systems, and are expected to have a growing significance in the booming era of Internet-of-Things (IoT) and 5G communications. The applications raise energy-efficiency requirements for both low-speed and high-speed converters since they are widely deployed in wireless sensor nodes and portable devices. To explore the solutions, the author worked on three directions: 1) techniques to improve the efficiency of the low-speed converters including the comparator; 2) techniques to develop high-speed data converters including the reference stabilization; 3) new architecture to improve the efficiency of the capacitance-to-digital converter (CDC). In the first part, a power-efficient 10-bit SAR ADC featured with a gain-boosted dynamic comparator is presented. In energy-constrained applications, the converter is usually supplied with low supply voltage (e.g., 0.3 V-0.5 V), which reduces the comparator pre-amplifier (pre-amp) gain and results in higher noise. A novel comparator topology with a dynamic common-gate stage is proposed to increase the pre-amplification gain, thereby reducing noise and offset. Besides, statistical estimation and loading switching techniques are combined to further improve energy efficiency. A 40-nm CMOS prototype achieves a Walden FoM of 1.5 fJ/conversion-step while operating at 100-kS/s from a 0.5-V supply. To further improve the energy-efficiency of the comparator, a novel dynamic pre-amp is proposed. By using an inverter-based input pair powered by a floating reservoir capacitor, the pre-amp realizes both current reuse and dynamic bias, thereby significantly boosting g [subscript m] /I [subscript D] and reducing noise. Moreover, it greatly reduces the influence of the input common-mode (CM) voltage on the comparator performance, including noise, offset, and delay. A prototype comparator in 180-nm achieves 46-μV input-referred noise while consuming only 1 pJ per comparison under 1.2-V supply, which represents greater than 7 times energy efficiency boost compared to that of a Strong-Arm (SA) latch. The second part of this dissertation focuses on high-speed data converter techniques. A 10-bit high-speed two-stage loop-unrolled SAR ADC is presented. To reduce the SAR logic delay and power, each bit uses a dedicated comparator to store its output and generate an asynchronous clock for the next comparison. To suppress the comparator offset mismatch induced non-linearity, a shared pre-amp are employed in the second fine stage, which is implemented by a dynamic latch to avoid static power consumption. The prototype ADC in 40-nm CMOS achieves 55-dB peak SNDR at 200-MS/s sampling rate without any calibration. A key limiting factor for the SAR ADC to simultaneously achieve high speed and high resolution is the reference ripple settling problem caused by DAC switching. Unlike prior techniques that aim to minimize the reference ripple which requires large reference buffer power or on-chip decoupling capacitance area, this work proposes a new perspective: it provides an extra path for the full-sized reference ripple to couple to the comparator but with an opposite polarity, so that the effect of the reference ripple is canceled out, thus ensuring an accurate conversion result. The prototype 10-bit 120-MS/s SAR ADC is fabricated in 40-nm CMOS process and achieves an SNDR of 55 dB with only 3 pF reference decoupling capacitor. Finally, this dissertation also presents the design of an incremental time-domain two-step CDC. Unlike the classic two-step CDC, this work replaces the OTA-based active-RC integrator with a VCO-based integrator and performs time domain (TD) ΔΣ modulation. The VCO is mostly digital and consumes low power. Featuring the infinite DC gain in phase domain and intrinsic spatial phase quantization, this TDΔΣ enables a CDC design, achieving 85-dB SQNR by having only a 4-bit quantizer, a 1st-order loop and a low OSR of 15. The prototype fabricated in 40-nm CMOS achieves a resolution of 0.29 fF while dissipating only 0.083 nJ per conversion, which improves the energy efficiency by greater than 2 times comparing to that of state-of-the-art CDCsElectrical and Computer Engineerin

Design and debugging of multi-step analog to digital converters

With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process