Design Of Crack Detection System Software For IC Package Using Blob Analysis And Neural Network.

In this research, three methods for the detection of crack defects on integrated circuit (IC) packages are proposed. These methods use blob analysis technique in image processing stage, and use multi-layered perceptron (MLP) neural network to classify the IC package

X‐ray microscopy and automatic detection of defects in through silicon vias in three‐dimensional integrated circuits

Through silicon vias (TSVs) are a key enabling technology for interconnection and realization of complex three-dimensional integrated circuit (3D-IC) components. In order to perform failure analysis without the need of destructive sample preparation, x-ray microscopy (XRM) is a rising method of analyzing the internal structure of samples. However, there is still a lack of evaluated scan recipes or best practices regarding XRM parameter settings for the study of TSVs in the current state of literature. There is also an increased interest in automated machine learning and deep learning approaches for qualitative and quantitative inspection processes in recent years. Especially deep learning based object detection is a well-known methodology for fast detection and classification capable of working with large volumetric XRM datasets. Therefore, a combined XRM and deep learning object detection workflow for automatic micrometer accurate defect location on liner-TSVs was developed throughout this work. Two measurement setups including detailed information about the used parameters for either full IC device scan or detailed TSV scan were introduced. Both are able to depict delamination defects and finer structures in TSVs with either a low or high resolution. The combination of a 0.4 objective with a beam voltage of 40 kV proved to be a good combination for achieving optimal imaging contrast for the full-device scan. However, detailed TSV scans have demonstrated that the use of a 20 objective along with a beam voltage of 140 kV significantly improves image quality. A database with 30,000 objects was created for automated data analysis, so that a well-established object recognition method for automated defect analysis could be integrated into the process analysis. This RetinaNet-based object detection method achieves a very strong average precision of 0.94. It supports the detection of erroneous TSVs in both top view and side view, so that defects can be detected at different depths. Consequently, the proposed workflow can be used for failure analysis, quality control or process optimization in R&D environments

Характерні дефекти одержуваних екструзією полімерних профілів та шляхи їх усунення

Products made of polymeric materials are becoming more common. At the same time, requirements for quality, accuracy of shape and sizes of products are increasing. Meeting the demand for domestic plastic products is impossible without improving the design and process parameters of equipment and polymer processing procedures. The aim of the research, described in the paper, is an analysis of the main factors affecting the quality of coextrusion formation of multilayer polymeric products and methods to eliminate defects. Production of pipes and gutters is carried out using coextrusion formation with subsequent calibration. The main defects that may occur in the polymeric profile production are "wave" defect, underfills, streaks, scratches, length distortion of the profile (saber), violation of adhesive interaction of layers and phase distribution boundary. The analysis of specific defects, their features and causes was performed. Most appropriate practical ways to eliminate defects using correction of process and design parameters were proposed. Correction of process parameters includes reducing or increasing the worm rotation rate, varying the worm temperature, temperature at the outlet of the working cylinder, temperature control in the first zones of the working cylinder (in the raw charging zone), increasing or decreasing pressure in the head. Design parameters subject to correction include the channel depth in the dosage area and compression zone length, head channel profile, length of calibration and cooling zones.Проведен обзор процессов и оборудования экструзионного и соэкструзионного формования изделий из поливинилхлорида. Рассмотрена типовая схема изготовления профильных изделий. Выполнен анализ характерных общих и локальных дефектов, их признаков и причин возникновения. Предложены наиболее целесообразные в практическом использовании пути устранения дефектов с помощью изменения как технологических, так и конструктивных параметров.Проведено огляд процесів та обладнання екструзійного та соекструзійного формування виробів з полівінілхлориду. Розглянуто типову схему виробництва профільних виробів. Зроблено аналіз характерних загальних та локальних дефектів, їхніх ознак та причин виникнення. Запропоновано найбільш доцільні у практичному використанні шляхи усунення дефектів за допомогою змінювання як технологічних, так і конструктивних параметрів

Index to 1981 NASA Tech Briefs, volume 6, numbers 1-4

Short announcements of new technology derived from the R&D activities of NASA are presented. These briefs emphasize information considered likely to be transferrable across industrial, regional, or disciplinary lines and are issued to encourage commercial application. This index for 1981 Tech Briefs contains abstracts and four indexes: subject, personal author, originating center, and Tech Brief Number. The following areas are covered: electronic components and circuits, electronic systems, physical sciences, materials, life sciences, mechanics, machinery, fabrication technology, and mathematics and information sciences

Tailored composite microstructures via direct ink writing with acoustophoresis

Additive manufacturing techniques which enable control over the placement and orientation of particles within composite inks can produce structures with tailored gradients in structural and functional properties. One such technique is direct ink writing with acoustophoresis (DIWA), wherein a composite ink is extruded through a direct-write nozzle containing a standing bulk acoustic wave which aligns and positions particles. Driving force-based scaling relationships contextualize processing-structure relationships in DIWA. In a series of experiments which progress in geometric complexity from basic primitives to complete structures, a physical framework is constructed for controlling filament microstructures and external geometries in DIWA. In isolated filaments, there are trade-offs between focusing and form holding. Increasing the ink viscosity, increasing the print speed, and decreasing the acoustic wave amplitude widen the spatial distribution of particles in agreement with scaling relationships for acoustophoresis, but more viscous inks improve form holding. In the print bead between the nozzle and substrate, digital image analysis is used to measure filament stability, nozzle wetting, and rotational flows in the low-viscosity inks required for acoustophoresis. Viscocapillary lubrication theory accurately predicts the bounds of stability, and the contact line position and angle can be used to detect the beginnings of filament rupture, allowing for algorithms which prevent rupture in-situ. In polygonal prisms, the internal structure of filaments changes during deposition into layer-by-layer and bath support gels. Filament microstructures change during deposition, during relaxation, and when the nozzle returns to write neighboring lines. Experimental flow fields and particle distributions suggest that inertia and viscoplasticity influence the filament microstructure just after deposition and the microstructure of neighboring filaments, and interfacial energy and gravity cause filaments to spread after deposition. An analytical model is proposed to diagnose sources of direction dependent microstructures as a function of acoustics, inertia, viscous dissipation, and stage calibration. The support geometry can be used to accentuate or suppress aspects of this direction dependence. Finally, inertia swells written corners, and capillarity smooths written corners, leading to distortions in filament microstructures at corners. Bath support suppresses these corner defects

Advanced Applications of Rapid Prototyping Technology in Modern Engineering

Rapid prototyping (RP) technology has been widely known and appreciated due to its flexible and customized manufacturing capabilities. The widely studied RP techniques include stereolithography apparatus (SLA), selective laser sintering (SLS), three-dimensional printing (3DP), fused deposition modeling (FDM), 3D plotting, solid ground curing (SGC), multiphase jet solidification (MJS), laminated object manufacturing (LOM). Different techniques are associated with different materials and/or processing principles and thus are devoted to specific applications. RP technology has no longer been only for prototype building rather has been extended for real industrial manufacturing solutions. Today, the RP technology has contributed to almost all engineering areas that include mechanical, materials, industrial, aerospace, electrical and most recently biomedical engineering. This book aims to present the advanced development of RP technologies in various engineering areas as the solutions to the real world engineering problems

ReSCon '09, Research Student Conference: Book of Abstracts

The second SED Research Student Conference (ReSCon2009) was hosted over three days, 22-24 June 2009, in the Lecture Centre at Brunel University. The conference consisted of technical presentations, a poster session and social events. The abstracts and presentations were the result of ongoing research by postgraduate research students from the School of Engineering and Design at Brunel University. The conference is held annually, and ReSCon plays a key role in contributing to research and innovations within the School

EG-ICE 2021 Workshop on Intelligent Computing in Engineering

The 28th EG-ICE International Workshop 2021 brings together international experts working at the interface between advanced computing and modern engineering challenges. Many engineering tasks require open-world resolutions to support multi-actor collaboration, coping with approximate models, providing effective engineer-computer interaction, search in multi-dimensional solution spaces, accommodating uncertainty, including specialist domain knowledge, performing sensor-data interpretation and dealing with incomplete knowledge. While results from computer science provide much initial support for resolution, adaptation is unavoidable and most importantly, feedback from addressing engineering challenges drives fundamental computer-science research. Competence and knowledge transfer goes both ways