System-on-chip Computing and Interconnection Architectures for Telecommunications and Signal Processing

This dissertation proposes novel architectures and design techniques targeting SoC building blocks for telecommunications and signal processing applications. Hardware implementation of Low-Density Parity-Check decoders is approached at both the algorithmic and the architecture level. Low-Density Parity-Check codes are a promising coding scheme for future communication standards due to their outstanding error correction performance. This work proposes a methodology for analyzing effects of finite precision arithmetic on error correction performance and hardware complexity. The methodology is throughout employed for co-designing the decoder. First, a low-complexity check node based on the P-output decoding principle is designed and characterized on a CMOS standard-cells library. Results demonstrate implementation loss below 0.2 dB down to BER of 10^{-8} and a saving in complexity up to 59% with respect to other works in recent literature. High-throughput and low-latency issues are addressed with modified single-phase decoding schedules. A new "memory-aware" schedule is proposed requiring down to 20% of memory with respect to the traditional two-phase flooding decoding. Additionally, throughput is doubled and logic complexity reduced of 12%. These advantages are traded-off with error correction performance, thus making the solution attractive only for long codes, as those adopted in the DVB-S2 standard. The "layered decoding" principle is extended to those codes not specifically conceived for this technique. Proposed architectures exhibit complexity savings in the order of 40% for both area and power consumption figures, while implementation loss is smaller than 0.05 dB. Most modern communication standards employ Orthogonal Frequency Division Multiplexing as part of their physical layer. The core of OFDM is the Fast Fourier Transform and its inverse in charge of symbols (de)modulation. Requirements on throughput and energy efficiency call for FFT hardware implementation, while ubiquity of FFT suggests the design of parametric, re-configurable and re-usable IP hardware macrocells. In this context, this thesis describes an FFT/IFFT core compiler particularly suited for implementation of OFDM communication systems. The tool employs an accuracy-driven configuration engine which automatically profiles the internal arithmetic and generates a core with minimum operands bit-width and thus minimum circuit complexity. The engine performs a closed-loop optimization over three different internal arithmetic models (fixed-point, block floating-point and convergent block floating-point) using the numerical accuracy budget given by the user as a reference point. The flexibility and re-usability of the proposed macrocell are illustrated through several case studies which encompass all current state-of-the-art OFDM communications standards (WLAN, WMAN, xDSL, DVB-T/H, DAB and UWB). Implementations results are presented for two deep sub-micron standard-cells libraries (65 and 90 nm) and commercially available FPGA devices. Compared with other FFT core compilers, the proposed environment produces macrocells with lower circuit complexity and same system level performance (throughput, transform size and numerical accuracy). The final part of this dissertation focuses on the Network-on-Chip design paradigm whose goal is building scalable communication infrastructures connecting hundreds of core. A low-complexity link architecture for mesochronous on-chip communication is discussed. The link enables skew constraint looseness in the clock tree synthesis, frequency speed-up, power consumption reduction and faster back-end turnarounds. The proposed architecture reaches a maximum clock frequency of 1 GHz on 65 nm low-leakage CMOS standard-cells library. In a complex test case with a full-blown NoC infrastructure, the link overhead is only 3% of chip area and 0.5% of leakage power consumption. Finally, a new methodology, named metacoding, is proposed. Metacoding generates correct-by-construction technology independent RTL codebases for NoC building blocks. The RTL coding phase is abstracted and modeled with an Object Oriented framework, integrated within a commercial tool for IP packaging (Synopsys CoreTools suite). Compared with traditional coding styles based on pre-processor directives, metacoding produces 65% smaller codebases and reduces the configurations to verify up to three orders of magnitude

Leveraging new platforms to provide students with a realistic SoC design experience

Recently there have been a slew of digital design products released that promise to simplify the task of giving students a real-world System-on-Chip (SoC) design experience. These “programmable SoCs” from companies such as Xilinx, Cypress, and Altera combine modern multi-core ARM processors connected to an FPGA through a widely used SoC interconnect standard. This paper discusses a Real Time Embedded System Course I designed that uses the Xilinx Zynq platform to give students first-hand experience with modern System-on-Chip design methodologies and the challenges that designers face in both hardware and software bring-up for a modern IP-based design. The first portion of this paper discusses how students were trained to use the Zynq platform. The first weeks of the class were dedicated to teaching students the basics of real-time system and custom hardware design. Students used a Zynq-based port of Free-RTOS to learn about Real-time operating systems. Through a series of laboratory assignments, students are taught how to interface the RTOS with custom hardware that they place on the FPGA portion of the chip. The course material developed for this portion of the class will be posted online so that other educators may use it in their teaching. The second part of this paper discusses some of the projects proposed and completed by students, and any difficulties the students faced along the way. From two weeks into the class, students are asked to form groups of up to four and propose a final project. For their final project, students are required to design and build a complete working system of their choice. Their final project is required to make use of both the processor running RTOS and at least one custom IP block running on the FPGA. In the final section of this paper I examine student feedback for the course, and comment on some of the challenges I faced in integrating the Zynq PSoC platform, and its corresponding development tools, into the classroom

Infrastructures and Algorithms for Testable and Dependable Systems-on-a-Chip

Every new node of semiconductor technologies provides further miniaturization and higher performances, increasing the number of advanced functions that electronic products can offer. Silicon area is now so cheap that industries can integrate in a single chip usually referred to as System-on-Chip (SoC), all the components and functions that historically were placed on a hardware board. Although adding such advanced functionality can benefit users, the manufacturing process is becoming finer and denser, making chips more susceptible to defects. Today’s very deep-submicron semiconductor technologies (0.13 micron and below) have reached susceptibility levels that put conventional semiconductor manufacturing at an impasse. Being able to rapidly develop, manufacture, test, diagnose and verify such complex new chips and products is crucial for the continued success of our economy at-large. This trend is expected to continue at least for the next ten years making possible the design and production of 100 million transistor chips. To speed up the research, the National Technology Roadmap for Semiconductors identified in 1997 a number of major hurdles to be overcome. Some of these hurdles are related to test and dependability. Test is one of the most critical tasks in the semiconductor production process where Integrated Circuits (ICs) are tested several times starting from the wafer probing to the end of production test. Test is not only necessary to assure fault free devices but it also plays a key role in analyzing defects in the manufacturing process. This last point has high relevance since increasing time-to-market pressure on semiconductor fabrication often forces foundries to start volume production on a given semiconductor technology node before reaching the defect densities, and hence yield levels, traditionally obtained at that stage. The feedback derived from test is the only way to analyze and isolate many of the defects in today’s processes and to increase process’s yield. With the increasing need of high quality electronic products, at each new physical assembly level, such as board and system assembly, test is used for debugging, diagnosing and repairing the sub-assemblies in their new environment. Similarly, the increasing reliability, availability and serviceability requirements, lead the users of high-end products performing periodic tests in the field throughout the full life cycle. To allow advancements in each one of the above scaling trends, fundamental changes are expected to emerge in different Integrated Circuits (ICs) realization disciplines such as IC design, packaging and silicon process. These changes have a direct impact on test methods, tools and equipment. Conventional test equipment and methodologies will be inadequate to assure high quality levels. On chip specialized block dedicated to test, usually referred to as Infrastructure IP (Intellectual Property), need to be developed and included in the new complex designs to assure that new chips will be adequately tested, diagnosed, measured, debugged and even sometimes repaired. In this thesis, some of the scaling trends in designing new complex SoCs will be analyzed one at a time, observing their implications on test and identifying the key hurdles/challenges to be addressed. The goal of the remaining of the thesis is the presentation of possible solutions. It is not sufficient to address just one of the challenges; all must be met at the same time to fulfill the market requirements

SoC Test: Trends and Recent Standards

The well-known approaching test cost crisis, where semiconductor test costs begin to approach or exceed manufacturing costs has led test engineers to apply new solutions to the problem of testing System-On-Chip (SoC) designs containing multiple IP (Intellectual Property) cores. While it is not yet possible to apply generic test architectures to an IP core within a SoC, the emergence of a number of similar approaches, and the release of new industry standards, such as IEEE 1500 and IEEE 1450.6, may begin to change this situation. This paper looks at these standards and at some techniques currently used by SoC test engineers. An extensive reference list is included, reflecting the purpose of this publication as a review paper

A high level test processor and test program generator

Embedded test within integrated systems allows to overcome some of the difficulties found when testing using only an external tester. The reutilization of a reconfigurable FPGA-like block that may exist in certain SoC systems, enables the implementation of on-chip test processors highly optimized to meet the specific requirements of the test procedure for each block. The fast reconfiguration of SRAM-based FPGA blocks allows sharing the same physical area among the set of different circuits that may be necessary to implement the on-chip test suite of the whole system. This paper addresses the high level generation of specific programmable processors for testing different blocks within integrated systems, taking advantage of such existing programmable resources. The work presented herein proposes a methodology and a set of automation tools to enable the automatic generation of dedicated custom processor architectures for specific test operations, as well as the corresponding test programs. This facility can be seen as disposing of a highly flexible and optimised embedded tester, supplied as an intellectual property (IP) module and its software. The approach being proposed is based in the implementation of a test processor as an Application Specific Instruction-Set Processor (ASIP), whose set of conventional and dedicated instructions are automatically derived from a software specification of the test operation to be implemented. The actual configuration of the test processor is determined by the type of instructions the test designer uses in the test program. The processors instruction set is configured automatically from the source code of the program to be run, in order to include only the exact instructions required for that task. The generation of a test processor starts with a software specification of the test operation to be performed. Presently, this specification is done using a program written in an assembly level language whose instruction set comprises all the general purpose instructions supported by the processor core, plus an extra set of complex instructions that are responsible for the operation of the peripheral specific blocks. From this specification, a custom programmable processor is generated as a set of synthesisable HDL modules, including the identification of peripheral blocks associated to specific instructions, and the set of constrains and assignments required to instantiate and map these modules onto the FPGA. These descriptions are then forwarded to the specific FPGA technology mapping and implementation tools, to create an application-specific processor that includes only the instructions referred in the source code

On-chip interconnect schemes for reconfigurable system-on-chip

On-chip communication architectures can have a great influence on the speed and area of System-on-Chip designs, and this influence is expected to be even more pronounced on reconfigurable System-on-Chip (rSoC) designs. To date, little research has been conducted on the performance implications of different on-chip communication architectures for rSoC designs. This paper motivates the need for such research and analyses current and proposed interconnect technologies for rSoC design. The paper also describes work in progress on implementation of a simple serial bus and a packet-switched network, as well as a methodology for quantitatively evaluating the performance of these interconnection structures in comparison to conventional buses

Pre-validation of SoC via hardware and software co-simulation

Abstract. System-on-chips (SoCs) are complex entities consisting of multiple hardware and software components. This complexity presents challenges in their design, verification, and validation. Traditional verification processes often test hardware models in isolation until late in the development cycle. As a result, cooperation between hardware and software development is also limited, slowing down bug detection and fixing. This thesis aims to develop, implement, and evaluate a co-simulation-based pre-validation methodology to address these challenges. The approach allows for the early integration of hardware and software, serving as a natural intermediate step between traditional hardware model verification and full system validation. The co-simulation employs a QEMU CPU emulator linked to a register-transfer level (RTL) hardware model. This setup enables the execution of software components, such as device drivers, on the target instruction set architecture (ISA) alongside cycle-accurate RTL hardware models. The thesis focuses on two primary applications of co-simulation. Firstly, it allows software unit tests to be run in conjunction with hardware models, facilitating early communication between device drivers, low-level software, and hardware components. Secondly, it offers an environment for using software in functional hardware verification. A significant advantage of this approach is the early detection of integration errors. Software unit tests can be executed at the IP block level with actual hardware models, a task previously only possible with costly system-level prototypes. This enables earlier collaboration between software and hardware development teams and smoothens the transition to traditional system-level validation techniques.Järjestelmäpiirin esivalidointi laitteiston ja ohjelmiston yhteissimulaatiolla. Tiivistelmä. Järjestelmäpiirit (SoC) ovat monimutkaisia kokonaisuuksia, jotka koostuvat useista laitteisto- ja ohjelmistokomponenteista. Tämä monimutkaisuus asettaa haasteita niiden suunnittelulle, varmennukselle ja validoinnille. Perinteiset varmennusprosessit testaavat usein laitteistomalleja eristyksissä kehityssyklin loppuvaiheeseen saakka. Tämän myötä myös yhteistyö laitteisto- ja ohjelmistokehityksen välillä on vähäistä, mikä hidastaa virheiden tunnistamista ja korjausta. Tämän diplomityön tavoitteena on kehittää, toteuttaa ja arvioida laitteisto-ohjelmisto-yhteissimulointiin perustuva esivalidointimenetelmä näiden haasteiden ratkaisemiseksi. Menetelmä mahdollistaa laitteiston ja ohjelmiston varhaisen integroinnin, toimien luonnollisena välietappina perinteisen laitteistomallin varmennuksen ja koko järjestelmän validoinnin välillä. Yhteissimulointi käyttää QEMU suoritinemulaattoria, joka on yhdistetty rekisterinsiirtotason (RTL) laitteistomalliin. Tämä mahdollistaa ohjelmistokomponenttien, kuten laiteajureiden, suorittamisen kohdejärjestelmän käskysarja-arkkitehtuurilla (ISA) yhdessä kellosyklitarkkojen RTL laitteistomallien kanssa. Työ keskittyy kahteen yhteissimulaation pääsovellukseen. Ensinnäkin se mahdollistaa ohjelmiston yksikkötestien suorittamisen laitteistomallien kanssa, varmistaen kommunikaation laiteajurien, matalan tason ohjelmiston ja laitteistokomponenttien välillä. Toiseksi se tarjoaa ympäristön ohjelmiston käyttämiseen toiminnallisessa laitteiston varmennuksessa. Merkittävä etu tästä lähestymistavasta on integraatiovirheiden varhainen havaitseminen. Ohjelmiston yksikkötestejä voidaan suorittaa jo IP-lohkon tasolla oikeilla laitteistomalleilla, mikä on aiemmin ollut mahdollista vain kalliilla järjestelmätason prototyypeillä. Tämä mahdollistaa aikaisemman ohjelmisto- ja laitteistokehitystiimien välisen yhteistyön ja helpottaa siirtymistä perinteisiin järjestelmätason validointimenetelmiin