Fast and accurate SER estimation for large combinational blocks in early stages of the design

Soft Error Rate (SER) estimation is an important challenge for integrated circuits because of the increased vulnerability brought by technology scaling. This paper presents a methodology to estimate in early stages of the design the susceptibility of combinational circuits to particle strikes. In the core of the framework lies MASkIt , a novel approach that combines signal probabilities with technology characterization to swiftly compute the logical, electrical, and timing masking effects of the circuit under study taking into account all input combinations and pulse widths at once. Signal probabilities are estimated applying a new hybrid approach that integrates heuristics along with selective simulation of reconvergent subnetworks. The experimental results validate our proposed technique, showing a speedup of two orders of magnitude in comparison with traditional fault injection estimation with an average estimation error of 5 percent. Finally, we analyze the vulnerability of the Decoder, Scheduler, ALU, and FPU of an out-of-order, superscalar processor design.This work has been partially supported by the Spanish Ministry of Economy and Competitiveness and Feder Funds under grant TIN2013-44375-R, by the Generalitat de Catalunya under grant FI-DGR 2016, and by the FP7 program of the EU under contract FP7-611404 (CLERECO).Peer ReviewedPostprint (author's final draft

Analysis and Design of Resilient VLSI Circuits

The reliable operation of Integrated Circuits (ICs) has become increasingly difficult to achieve in the deep sub-micron (DSM) era. With continuously decreasing device feature sizes, combined with lower supply voltages and higher operating frequencies, the noise immunity of VLSI circuits is decreasing alarmingly. Thus, VLSI circuits are becoming more vulnerable to noise effects such as crosstalk, power supply variations and radiation-induced soft errors. Among these noise sources, soft errors (or error caused by radiation particle strikes) have become an increasingly troublesome issue for memory arrays as well as combinational logic circuits. Also, in the DSM era, process variations are increasing at an alarming rate, making it more difficult to design reliable VLSI circuits. Hence, it is important to efficiently design robust VLSI circuits that are resilient to radiation particle strikes and process variations. The work presented in this dissertation presents several analysis and design techniques with the goal of realizing VLSI circuits which are tolerant to radiation particle strikes and process variations. This dissertation consists of two parts. The first part proposes four analysis and two design approaches to address radiation particle strikes. The analysis techniques for the radiation particle strikes include: an approach to analytically determine the pulse width and the pulse shape of a radiation induced voltage glitch in combinational circuits, a technique to model the dynamic stability of SRAMs, and a 3D device-level analysis of the radiation tolerance of voltage scaled circuits. Experimental results demonstrate that the proposed techniques for analyzing radiation particle strikes in combinational circuits and SRAMs are fast and accurate compared to SPICE. Therefore, these analysis approaches can be easily integrated in a VLSI design flow to analyze the radiation tolerance of such circuits, and harden them early in the design flow. From 3D device-level analysis of the radiation tolerance of voltage scaled circuits, several non-intuitive observations are made and correspondingly, a set of guidelines are proposed, which are important to consider to realize radiation hardened circuits. Two circuit level hardening approaches are also presented to harden combinational circuits against a radiation particle strike. These hardening approaches significantly improve the tolerance of combinational circuits against low and very high energy radiation particle strikes respectively, with modest area and delay overheads. The second part of this dissertation addresses process variations. A technique is developed to perform sensitizable statistical timing analysis of a circuit, and thereby improve the accuracy of timing analysis under process variations. Experimental results demonstrate that this technique is able to significantly reduce the pessimism due to two sources of inaccuracy which plague current statistical static timing analysis (SSTA) tools. Two design approaches are also proposed to improve the process variation tolerance of combinational circuits and voltage level shifters (which are used in circuits with multiple interacting power supply domains), respectively. The variation tolerant design approach for combinational circuits significantly improves the resilience of these circuits to random process variations, with a reduction in the worst case delay and low area penalty. The proposed voltage level shifter is faster, requires lower dynamic power and area, has lower leakage currents, and is more tolerant to process variations, compared to the best known previous approach. In summary, this dissertation presents several analysis and design techniques which significantly augment the existing work in the area of resilient VLSI circuit design

Cross-Layer Resiliency Modeling and Optimization: A Device to Circuit Approach

The never ending demand for higher performance and lower power consumption pushes the VLSI industry to further scale the technology down. However, further downscaling of technology at nano-scale leads to major challenges. Reduced reliability is one of them, arising from multiple sources e.g. runtime variations, process variation, and transient errors. The objective of this thesis is to tackle unreliability with a cross layer approach from device up to circuit level

Cross-layer Soft Error Analysis and Mitigation at Nanoscale Technologies

This thesis addresses the challenge of soft error modeling and mitigation in nansoscale technology nodes and pushes the state-of-the-art forward by proposing novel modeling, analyze and mitigation techniques. The proposed soft error sensitivity analysis platform accurately models both error generation and propagation starting from a technology dependent device level simulations all the way to workload dependent application level analysis

An advanced Framework for efficient IC optimization based on analytical models engine

En base als reptes sorgits a conseqüència de l'escalat de la tecnologia, la present tesis desenvolupa i analitza un conjunt d'eines orientades a avaluar la sensibilitat a la propagació d'esdeveniments SET en circuits microelectrònics. S'han proposant varies mètriques de propagació de SETs considerant l'impacto dels emmascaraments lògic, elèctric i combinat lògic-elèctric. Aquestes mètriques proporcionen una via d'anàlisi per quantificar tant les regions més susceptibles a propagar SETs com les sortides més susceptibles de rebre'ls. S'ha desenvolupat un conjunt d'algorismes de cerca de camins sensibilitzables altament adaptables a múltiples aplicacions, un sistema lògic especific i diverses tècniques de simplificació de circuits. S'ha demostrat que el retard d'un camí donat depèn dels vectors de sensibilització aplicats a les portes que formen part del mateix, essent aquesta variació de retard comparable a la atribuïble a les variacions paramètriques del proces.En base a los desafíos surgidos a consecuencia del escalado de la tecnología, la presente tesis desarrolla y analiza un conjunto de herramientas orientadas a evaluar la sensibilidad a la propagación de eventos SET en circuitos microelectrónicos. Se han propuesto varias métricas de propagación de SETs considerando el impacto de los enmascaramientos lógico, eléctrico y combinado lógico-eléctrico. Estas métricas proporcionan una vía de análisis para cuantificar tanto las regiones más susceptibles a propagar eventos SET como las salidas más susceptibles a recibirlos. Ha sido desarrollado un conjunto de algoritmos de búsqueda de caminos sensibilizables altamente adaptables a múltiples aplicaciones, un sistema lógico especifico y diversas técnicas de simplificación de circuitos. Se ha demostrado que el retardo de un camino dado depende de los vectores de sensibilización aplicados a las puertas que forman parte del mismo, siendo esta variación de retardo comparable a la atribuible a las variaciones paramétricas del proceso.Based on the challenges arising as a result of technology scaling, this thesis develops and evaluates a complete framework for SET propagation sensitivity. The framework comprises a number of processing tools capable of handling circuits with high complexity in an efficient way. Various SET propagation metrics have been proposed considering the impact of logic, electric and combined logic-electric masking. Such metrics provide a valuable vehicle to grade either in-circuit regions being more susceptible of propagating SETs toward the circuit outputs or circuit outputs more susceptible to produce SET. A quite efficient and customizable true path finding algorithm with a specific logic system has been constructed and its efficacy demonstrated on large benchmark circuits. It has been shown that the delay of a path depends on the sensitization vectors applied to the gates within the path. In some cases, this variation is comparable to the one caused by process parameters variation

Reliable chip design from low powered unreliable components

The pace of technological improvement of the semiconductor market is driven by Moore’s Law, enabling chip transistor density to double every two years. The transistors would continue to decline in cost and size but increase in power. The continuous transistor scaling and extremely lower power constraints in modern Very Large Scale Integrated(VLSI) chips can potentially supersede the benefits of the technology shrinking due to reliability issues. As VLSI technology scales into nanoscale regime, fundamental physical limits are approached, and higher levels of variability, performance degradation, and higher rates of manufacturing defects are experienced. Soft errors, which traditionally affected only the memories, are now also resulting in logic circuit reliability degradation. A solution to these limitations is to integrate reliability assessment techniques into the Integrated Circuit(IC) design flow. This thesis investigates four aspects of reliability driven circuit design: a)Reliability estimation; b) Reliability optimization; c) Fault-tolerant techniques, and d) Delay degradation analysis. To guide the reliability driven synthesis and optimization of combinational circuits, highly accurate probability based reliability estimation methodology christened Conditional Probabilistic Error Propagation(CPEP) algorithm is developed to compute the impact of gate failures on the circuit output. CPEP guides the proposed rewriting based logic optimization algorithm employing local transformations. The main idea behind this methodology is to replace parts of the circuit with functionally equivalent but more reliable counterparts chosen from a precomputed subset of Negation-Permutation-Negation(NPN) classes of 4-variable functions. Cut enumeration and Boolean matching driven by reliability-aware optimization algorithm are used to identify the best possible replacement candidates. Experiments on a set of MCNC benchmark circuits and 8051 functional microcontroller units indicate that the proposed framework can achieve up to 75% reduction of output error probability. On average, about 14% SER reduction is obtained at the expense of very low area overhead of 6.57% that results in 13.52% higher power consumption. The next contribution of the research describes a novel methodology to design fault tolerant circuitry by employing the error correction codes known as Codeword Prediction Encoder(CPE). Traditional fault tolerant techniques analyze the circuit reliability issue from a static point of view neglecting the dynamic errors. In the context of communication and storage, the study of novel methods for reliable data transmission under unreliable hardware is an increasing priority. The idea of CPE is adapted from the field of forward error correction for telecommunications focusing on both encoding aspects and error correction capabilities. The proposed Augmented Encoding solution consists of computing an augmented codeword that contains both the codeword to be transmitted on the channel and extra parity bits. A Computer Aided Development(CAD) framework known as CPE simulator is developed providing a unified platform that comprises a novel encoder and fault tolerant LDPC decoders. Experiments on a set of encoders with different coding rates and different decoders indicate that the proposed framework can correct all errors under specific scenarios. On average, about 1000 times improvement in Soft Error Rate(SER) reduction is achieved. Last part of the research is the Inverse Gaussian Distribution(IGD) based delay model applicable to both combinational and sequential elements for sub-powered circuits. The Probability Density Function(PDF) based delay model accurately captures the delay behavior of all the basic gates in the library database. The IGD model employs these necessary parameters, and the delay estimation accuracy is demonstrated by evaluating multiple circuits. Experiments results indicate that the IGD based approach provides a high matching against HSPICE Monte Carlo simulation results, with an average error less than 1.9% and 1.2% for the 8-bit Ripple Carry Adder(RCA), and 8-bit De-Multiplexer(DEMUX) and Multiplexer(MUX) respectively

Cross-Layer Optimization for Power-Efficient and Robust Digital Circuits and Systems

With the increasing digital services demand, performance and power-efficiency become vital requirements for digital circuits and systems. However, the enabling CMOS technology scaling has been facing significant challenges of device uncertainties, such as process, voltage, and temperature variations. To ensure system reliability, worst-case corner assumptions are usually made in each design level. However, the over-pessimistic worst-case margin leads to unnecessary power waste and performance loss as high as 2.2x. Since optimizations are traditionally confined to each specific level, those safe margins can hardly be properly exploited. To tackle the challenge, it is therefore advised in this Ph.D. thesis to perform a cross-layer optimization for digital signal processing circuits and systems, to achieve a global balance of power consumption and output quality. To conclude, the traditional over-pessimistic worst-case approach leads to huge power waste. In contrast, the adaptive voltage scaling approach saves power (25% for the CORDIC application) by providing a just-needed supply voltage. The power saving is maximized (46% for CORDIC) when a more aggressive voltage over-scaling scheme is applied. These sparsely occurred circuit errors produced by aggressive voltage over-scaling are mitigated by higher level error resilient designs. For functions like FFT and CORDIC, smart error mitigation schemes were proposed to enhance reliability (soft-errors and timing-errors, respectively). Applications like Massive MIMO systems are robust against lower level errors, thanks to the intrinsically redundant antennas. This property makes it applicable to embrace digital hardware that trades quality for power savings.Comment: 190 page

Analysis and Design of Resilient VLSI Circuits

The reliable operation of Integrated Circuits (ICs) has become increasingly difficult to achieve in the deep sub-micron (DSM) era. With continuously decreasing device feature sizes, combined with lower supply voltages and higher operating frequencies, the noise immunity of VLSI circuits is decreasing alarmingly. Thus, VLSI circuits are becoming more vulnerable to noise effects such as crosstalk, power supply variations and radiation-induced soft errors. Among these noise sources, soft errors (or error caused by radiation particle strikes) have become an increasingly troublesome issue for memory arrays as well as combinational logic circuits. Also, in the DSM era, process variations are increasing at an alarming rate, making it more difficult to design reliable VLSI circuits. Hence, it is important to efficiently design robust VLSI circuits that are resilient to radiation particle strikes and process variations. The work presented in this dissertation presents several analysis and design techniques with the goal of realizing VLSI circuits which are tolerant to radiation particle strikes and process variations. This dissertation consists of two parts. The first part proposes four analysis and two design approaches to address radiation particle strikes. The analysis techniques for the radiation particle strikes include: an approach to analytically determine the pulse width and the pulse shape of a radiation induced voltage glitch in combinational circuits, a technique to model the dynamic stability of SRAMs, and a 3D device-level analysis of the radiation tolerance of voltage scaled circuits. Experimental results demonstrate that the proposed techniques for analyzing radiation particle strikes in combinational circuits and SRAMs are fast and accurate compared to SPICE. Therefore, these analysis approaches can be easily integrated in a VLSI design flow to analyze the radiation tolerance of such circuits, and harden them early in the design flow. From 3D device-level analysis of the radiation tolerance of voltage scaled circuits, several non-intuitive observations are made and correspondingly, a set of guidelines are proposed, which are important to consider to realize radiation hardened circuits. Two circuit level hardening approaches are also presented to harden combinational circuits against a radiation particle strike. These hardening approaches significantly improve the tolerance of combinational circuits against low and very high energy radiation particle strikes respectively, with modest area and delay overheads. The second part of this dissertation addresses process variations. A technique is developed to perform sensitizable statistical timing analysis of a circuit, and thereby improve the accuracy of timing analysis under process variations. Experimental results demonstrate that this technique is able to significantly reduce the pessimism due to two sources of inaccuracy which plague current statistical static timing analysis (SSTA) tools. Two design approaches are also proposed to improve the process variation tolerance of combinational circuits and voltage level shifters (which are used in circuits with multiple interacting power supply domains), respectively. The variation tolerant design approach for combinational circuits significantly improves the resilience of these circuits to random process variations, with a reduction in the worst case delay and low area penalty. The proposed voltage level shifter is faster, requires lower dynamic power and area, has lower leakage currents, and is more tolerant to process variations, compared to the best known previous approach. In summary, this dissertation presents several analysis and design techniques which significantly augment the existing work in the area of resilient VLSI circuit design

Testability and redundancy techniques for improved yield and reliability of CMOS VLSI circuits

The research presented in this thesis is concerned with the design of fault-tolerant integrated circuits as a contribution to the design of fault-tolerant systems. The economical manufacture of very large area ICs will necessitate the incorporation of fault-tolerance features which are routinely employed in current high density dynamic random access memories. Furthermore, the growing use of ICs in safety-critical applications and/or hostile environments in addition to the prospect of single-chip systems will mandate the use of fault-tolerance for improved reliability. A fault-tolerant IC must be able to detect and correct all possible faults that may affect its operation. The ability of a chip to detect its own faults is not only necessary for fault-tolerance, but it is also regarded as the ultimate solution to the problem of testing. Off-line periodic testing is selected for this research because it achieves better coverage of physical faults and it requires less extra hardware than on-line error detection techniques. Tests for CMOS stuck-open faults are shown to detect all other faults. Simple test sequence generation procedures for the detection of all faults are derived. The test sequences generated by these procedures produce a trivial output, thereby, greatly simplifying the task of test response analysis. A further advantage of the proposed test generation procedures is that they do not require the enumeration of faults. The implementation of built-in self-test is considered and it is shown that the hardware overhead is comparable to that associated with pseudo-random and pseudo-exhaustive techniques while achieving a much higher fault coverage through-the use of the proposed test generation procedures. The consideration of the problem of testing the test circuitry led to the conclusion that complete test coverage may be achieved if separate chips cooperate in testing each other's untested parts. An alternative approach towards complete test coverage would be to design the test circuitry so that it is as distributed as possible and so that it is tested as it performs its function. Fault correction relies on the provision of spare units and a means of reconfiguring the circuit so that the faulty units are discarded. This raises the question of what is the optimum size of a unit? A mathematical model, linking yield and reliability is therefore developed to answer such a question and also to study the effects of such parameters as the amount of redundancy, the size of the additional circuitry required for testing and reconfiguration, and the effect of periodic testing on reliability. The stringent requirement on the size of the reconfiguration logic is illustrated by the application of the model to a typical example. Another important result concerns the effect of periodic testing on reliability. It is shown that periodic off-line testing can achieve approximately the same level of reliability as on-line testing, even when the time between tests is many hundreds of hours

Improving timing verification and delay testing methodologies for IC designs

textThe task of ensuring the correct temporal behavior of IC designs, both before and after fabrication, is extremely important. It is becoming even more imperative as the demand for performance increases and process technology advances into the deep sub-micron region. This dissertation tackles the key issues in the timing verification and delay testing methodologies. An efficient methodology is presented to identify false timing paths in the timing verification methodology which utilizes ATPG technique and timing information from an ordered list of timing paths according to the delay information. This dissertation also presents a speed binning methodology which utilizes structural delay tests successfully instead of functional tests. In addition, it establishes a methodology which quantifies the correlation between the timing verification prediction and actual silicon measurement of timing paths. This quantification methodology lays the foundation for further research to study the impact of deep submicron effects on design performanceElectrical and Computer Engineerin