RFID Logic circuit with oxide TFTs modeled by genetic algorithms

Nos últimos anos, a necessidade por técnicas de identificação com velocidades de leitura superiores e maior flexibilidade relativamente à memória e programabilidade, levaram ao desenvolvimento de tecnologias de identificação de rádio frequência (RFID). Esta tecnologia já provou o seu valor no futuro da Internet das coisas (IoT), ao permitir a possibilidade de marcar qualquer tipo de produto facilmente e com baixo custo por etiqueta, enquanto possibilita a conexão deste tipo de etiquetas com smartphones para aumentar a ligação entre os dispositivos RFID e a vida quotidiana. Além disto, a introdução de transístores de filme fino (TFT) de óxidos amorfos em circuitos RFID, abre um novo mundo de aplicações, visto que este tipo de dispositivos permite o uso de substratos transparentes e/ou flexíveis, devido à possibilidade de usar baixas temperaturas durante o processo de fabrico para este tipo de transístores. Neste trabalho, foi usado o Modelo a-Si Nível 61 com a ajuda de algoritmos genéticos para criar modelos de transístores de a-IGZO produzidos com um dielétrico de porta depositado por métodos de solução usando spin-coating. Com estes modelos, foi dimensionado um circuito digital de RFID, usando uma topologia em que o transístor de carga está em configuração de díodo, para ler uma memória ROM de 16-bit e posteriormente codificar o sinal através de uma codificação de Manchester com uma taxa de transferência de 14 kbit/s. Este tipo de circuitos utilizando substratos transparentes e/ou flexíveis pode possibilitar no futuro a criação de embalagens inteligentes para bens domésticos e a posterior integração numa configuração de frigoríficos inteligentes. Isto significa que poderá ser possível uma pessoa ser avisada quando é necessário comprar um produto ou quando ultrapassa o prazo de validade.In recent years, the need for identification techniques, with faster reading speed and more flexibility regarding memory and programmability, led to the development of Radio Frequency Identification technologies. This technology has already proven to be essential in the future of Internet-of-Things, by allowing the possibility of tagging any type of product easily and at low cost per tag, while also allowing the interface of these tags, with common smartphones to increase the connectivity of RFID devices in daily life. Furthermore, the introduction of amorphous IGZO thin film transistors in RFID circuits, opens a new world of applications since this type of devices allows the use of transparent and/or flexible substrates, due to the low temperatures required during the fabrication process. In this work, it was used the a-Si Level 61 TFT Model together with genetic algorithms, to model a-IGZO transistors produced, with a gate dielectric deposited by a solution method using spin coating. With these models, it was designed an RFID logic circuit, which employs diode connected structures, to read a 16-bit Read Only Memory and encode the signal using a Manchester encoding technique, with a data rate of 14 kbit/s. These types of circuits using transparent and/or flexible substrates could allow, in the future, the creation of smart packaging for regular house goods and integrate it in a smart fridge configuration. Meaning that, it could be possible to a person either to be advised when to buy a certain item or when it reaches the expiration date

High-throughput large-area plastic nanoelectronics

Large-area electronics (LAE) manufacturing has been a key focus of both academic and industrial research, especially within the last decade. The growing interest is born out of the possibility of adding attractive properties (flexibility, light weight or minimal thickness) at low cost to well-established technologies, such as photovoltaics, displays, sensors or enabling the realisation of emerging technologies such as wearable devices and the Internet of Things. As such there has been great progress in the development of materials specifically designed to be employed in solution processed (plastic) electronics, including organic, transparent metal oxide and nanoscale semiconductors, as well as progress in the deposition methods of these materials using low-cost high-throughput printing techniques, such as gravure printing, inkjet printing, and roll-to-roll vacuum deposition. Meanwhile, industry innovation driven by Moore’s law has pushed conventional silicon-based electronic components to the nanoscale. The processes developed for LAE must strive to reach these dimensions. Given that the complex and expensive patterning techniques employed by the semiconductor industry so far are not compatible with LAE, there is clearly a need to develop large-area high throughput nanofabrication techniques. This thesis presents progress in adhesion lithography (a-Lith), a nanogap electrode fabrication process that can be applied over large areas on arbitrary substrates. A-Lith is a self-alignment process based on the alteration of surface energies of a starting metal electrode which allows the removal of any overlap of a secondary metal electrode. Importantly, it is an inexpensive, scalable and high throughput technique, and, especially if combined with low temperature deposition of the active material, it is fundamentally compatible with large-area fabrication of nanoscale electronic devices on flexible (plastic) substrates. Herein, I present routes towards process optimisation with a focus on gap size reduction and yield maximisation. Asymmetric gaps with sizes below 10 nm and yields of > 90 % for hundreds of electrode pairs generated on a single substrate are demonstrated. These large width electrode nanogaps represent the highest aspect ratio nanogaps (up to 108) fabricated to date. As a next step, arrays of Schottky nanodiodes are fabricated by deposition of a suitable semiconductor from solution into the nanogap structures. Of principal interest is the wide bandgap transparent semiconductor, zinc oxide (ZnO). Lateral ZnO Schottky diodes show outstanding characteristics, with on-off ratios of up to 106 and forward current values up to 10 mA for obtained upon combining a-Lith with low-temperature solution processing. These unique devices are further investigated for application in rectifier circuits, and in particular for potential use in radio frequency identification (RFID) tag technology. The ZnO diodes are found to surpass the 13.56 MHz frequency bernchmark used in commercial applications and approach the ultra-high frequency (UHF) band (hundreds of megahertz), outperforming current state of the art printed diodes. Solution processed fullerene (C60) is also shown to approach the UHF band in this co-planar device configuration, highlighting the viability of a-Lith for enabling large-area flexible radio frequency nanoelectronics. Finally, resistive switching memory device arrays based on a-Lith patterned nanogap aluminium symmetric electrodes are demonstrated for the first time. These devices are based either on empty aluminium nanogap electrodes, or with the gap filled with a solution-processed semiconductor, the latter being ZnO, the semiconducting polymer poly(9,9-dioctylfluorene-alt-benzothiadiazole) (F8BT) or carbon nanotube/polyfluorene blends. The switching mechanism, retention time and switching speed are investigated and compared with published data. The fabrication of arrays of these devices illustrates the potential of a-Lith as a simple technique for the realisation of large-area high-density memory applications.Open Acces

Printable Spacecraft: Flexible Electronic Platforms for NASA Missions

Why printed electronics? Why should NASA use printed electronics to make a spacecraft? Three words provide the answer: universal, impactful, progressive. The technology is universal because the applications it can affect are broad and diverse from simple sensors to fully functional spacecraft. The impact of flexible, printed electronics range from straightforward mass, volume and cost savings all the way to enabling new mission concepts. The benefits of the technology will become progressively larger from what is achievable today so that investments will pay dividends tomorrow, next year and next decade. We started off three years ago asking the question can you build an entire spacecraft out of printed electronics? In other words, can you design and fabricate a fully integrated, electronic system that performs the same end-to-end functions of a spacecraft - take scientific measurements, perform data processing, provide data storage, transmit the data, powers itself, orients and propels itself - all out of thin flexible sheets of printed electronics? This "Printable Spacecraft" pushes the limits of printed flexible electronics performance. So the answer is yes, more or less. In our studies for the NIAC (NASA Innovative Advanced Concepts) program, we have explored this question further, to explain more completely what "more or less" means and to outline what is needed to make the answer a definitive "yes". Despite its appealing "Flat Stanley"-like (a book series by Jeff Brown) qualities, making a Printable Spacecraft is not as easy as flattening the Cassini spacecraft with a bulletin board, as was Stanley Lamchop's fate. But, if NASA invests in the design challenges, the materials challenges, the performance challenges of printed electronics, it might find itself with a spacecraft that can enable as many adventures and advantages as Flat Stanley including putting it in an envelope and mailing it to the planet of your choice. You just have to let your imagination take over. In this report we document the work of the Phase 2 Printable Spacecraft task conducted under the guidance and leadership of the NIAC program. In Phase One of the NIAC task entitled "Printable Spacecraft", we investigated the viability of printed electronics technologies for creating multi-functional spacecraft platforms. Mission concepts and architectures that could be enhanced or enabled with this technology were explored. In Phase 2 we tried to answer the more practical questions such as can you really build a multi-functional printed electronic spacecraft system? If you do, can it survive the space environment? Even if it can, what benefit does a printable system provide over a traditional implementation of a spacecraft

Collective Communications and Computation Mechanisms on the RF Channel for Organic Printed Smart Labels and Resource-limited IoT Nodes

Radio Frequency IDentification (RFID) and Wireless Sensor Networks (WSN) are seen as enabler technologies for realizing the Internet of Things (IoT). Organic and printed Electronics (OE) has the potential to provide low cost and all-printable smart RFID labels in high volumes. With regard to WSN, power harvesting techniques and resource-efficient communications are promising key technologies to create sustainable and for the environment friendly sensing devices. However, the implementation of OE smart labels is only allowing printable devices of ultra-low hardware complexity, that cannot employ standard RFID communications. And, the deployment of current WSN technology is far away from offering battery-free and low-cost sensing technology. To this end, the steady growth of IoT is increasing the demand for more network capacity and computational power. With respect to wireless communications research, the state-of-the-art employs superimposed radio transmission in form of physical layer network coding and computation over the MAC to increase information flow and computational power, but lacks on practicability and robustness so far. With regard to these research challenges we developed in particular two approaches, i.e., code-based Collective Communications for dense sensing environments, and time-based Collective Communications (CC) for resource-limited WSNs. In respect to the code-based CC approach we exploit the principle of superimposed radio transmission to acquire highly scalable and robust communications obtaining with it at the same time as well minimalistic smart RFID labels, that can be manufactured in high volume with present-day OE. The implementation of our code-based CC relies on collaborative and simultaneous transmission of randomly drawn burst sequences encoding the data. Based on the framework of hyper-dimensional computing, statistical laws and the superposition principle of radio waves we obtained the communication of so called ensemble information, meaning the concurrent bulk reading of sensed values, ranges, quality rating, identifiers (IDs), and so on. With 21 transducers on a small-scale reader platform we tested the performance of our approach successfully proving the scalability and reliability. To this end, we implemented our code-based CC mechanism into an all-printable passive RFID label down to the logic gate level, indicating a circuit complexity of about 500 transistors. In respect to time-based CC approach we utilize the superimposed radio transmission to obtain resource-limited WSNs, that can be deployed in wide areas for establishing, e.g., smart environments. In our application scenario for resource-limited WSN, we utilize the superimposed radio transmission to calculate functions of interest, i.e., to accomplish data processing directly on the radio channel. To prove our concept in a case study, we created a WSN with 15 simple nodes measuring the environmental mean temperature. Based on our analysis about the wireless computation error we were able to minimize the stochastic error arbitrarily, and to remove the systematic error completely

Intelligent Circuits and Systems

ICICS-2020 is the third conference initiated by the School of Electronics and Electrical Engineering at Lovely Professional University that explored recent innovations of researchers working for the development of smart and green technologies in the fields of Energy, Electronics, Communications, Computers, and Control. ICICS provides innovators to identify new opportunities for the social and economic benefits of society.　 This conference bridges the gap between academics and R&D institutions, social visionaries, and experts from all strata of society to present their ongoing research activities and foster research relations between them. It provides opportunities for the exchange of new ideas, applications, and experiences in the field of smart technologies and finding global partners for future collaboration. The ICICS-2020 was conducted in two broad categories, Intelligent Circuits & Intelligent Systems and Emerging Technologies in Electrical Engineering