Interconnect yield analysis and fault tolerance for field programmable gate arrays

Imperial Users onl

2020 NASA Technology Taxonomy

This document is an update (new photos used) of the PDF version of the 2020 NASA Technology Taxonomy that will be available to download on the OCT Public Website. The updated 2020 NASA Technology Taxonomy, or "technology dictionary", uses a technology discipline based approach that realigns like-technologies independent of their application within the NASA mission portfolio. This tool is meant to serve as a common technology discipline-based communication tool across the agency and with its partners in other government agencies, academia, industry, and across the world

On Energy Efficient Computing Platforms

In accordance with the Moore's law, the increasing number of on-chip integrated transistors has enabled modern computing platforms with not only higher processing power but also more affordable prices. As a result, these platforms, including portable devices, work stations and data centres, are becoming an inevitable part of the human society. However, with the demand for portability and raising cost of power, energy efficiency has emerged to be a major concern for modern computing platforms. As the complexity of on-chip systems increases, Network-on-Chip (NoC) has been proved as an efficient communication architecture which can further improve system performances and scalability while reducing the design cost. Therefore, in this thesis, we study and propose energy optimization approaches based on NoC architecture, with special focuses on the following aspects. As the architectural trend of future computing platforms, 3D systems have many bene ts including higher integration density, smaller footprint, heterogeneous integration, etc. Moreover, 3D technology can signi cantly improve the network communication and effectively avoid long wirings, and therefore, provide higher system performance and energy efficiency. With the dynamic nature of on-chip communication in large scale NoC based systems, run-time system optimization is of crucial importance in order to achieve higher system reliability and essentially energy efficiency. In this thesis, we propose an agent based system design approach where agents are on-chip components which monitor and control system parameters such as supply voltage, operating frequency, etc. With this approach, we have analysed the implementation alternatives for dynamic voltage and frequency scaling and power gating techniques at different granularity, which reduce both dynamic and leakage energy consumption. Topologies, being one of the key factors for NoCs, are also explored for energy saving purpose. A Honeycomb NoC architecture is proposed in this thesis with turn-model based deadlock-free routing algorithms. Our analysis and simulation based evaluation show that Honeycomb NoCs outperform their Mesh based counterparts in terms of network cost, system performance as well as energy efficiency.Siirretty Doriast

An Outlook on Design Technologies for Future Integrated Systems

The economic and social demand for ubiquitous and multifaceted electronic systems-in combination with the unprecedented opportunities provided by the integration of various manufacturing technologies-is paving the way to a new class of heterogeneous integrated systems, with increased performance and connectedness and providing us with gateways to the living world. This paper surveys design requirements and solutions for heterogeneous systems and addresses design technologies for realizing them

VLSI Design

This book provides some recent advances in design nanometer VLSI chips. The selected topics try to present some open problems and challenges with important topics ranging from design tools, new post-silicon devices, GPU-based parallel computing, emerging 3D integration, and antenna design. The book consists of two parts, with chapters such as: VLSI design for multi-sensor smart systems on a chip, Three-dimensional integrated circuits design for thousand-core processors, Parallel symbolic analysis of large analog circuits on GPU platforms, Algorithms for CAD tools VLSI design, A multilevel memetic algorithm for large SAT-encoded problems, etc

A two-stage design framework for optimal spatial packaging of interconnected fluid-thermal systems

Optimal spatial packaging of interconnected subsystems and components with coupled physical (thermal, hydraulic, or electromagnetic) interactions, or SPI2, plays a vital role in the functionality, operation, energy usage, and life cycle of practically all engineered systems, from chips to ships to aircraft. However, the highly nonlinear spatial packaging problem, governed by coupled physical phenomena transferring energy through highly complex and diverse geometric interconnects, has largely resisted automation and quickly exceeds human cognitive abilities at moderate complexity levels. The current state-of-the-art in defining an arrangement of these functionally heterogeneous artifacts still largely relies on human intuition and manual spatial placement, limiting system sophistication and extending design timelines. Spatial packaging involves packing and routing, which are separately challenging NP-hard problems. Therefore, solving the coupled packing and routing (PR) problem simultaneously will require disruptive methods to better address pressing related challenges, such as system volume reduction, interconnect length reduction, ensuring non-intersection, and physics considerations. This dissertation presents a novel automated two-stage sequential design framework to perform simultaneous physics-based packing and routing (PR) optimization of fluid-thermal systems. In Stage 1, unique spatially-feasible topologies (i.e., how interconnects and components pass around each other) are enumerated for given fluid-thermal system architecture. It is important to guarantee a feasible initial graph as lumped-parameter physics analyses may fail if components and/or routing paths intersect. Stage 2 begins with a spatially-feasible layout, and optimizes physics-based system performance with respect to component locations, interconnect paths, and other continuous component or system variables (such as sizing or control). A bar-based design representation enables the use of a differentiable geometric projection method (GPM), where gradient-based optimization is used with finite element analysis. In addition to geometric considerations, this method supports optimization based on system behavior by including physics-based (temperature, fluid pressure, head loss, etc.) objectives and constraints. In other words, stage 1 of the framework supports systematic navigation through discrete topology options utilized as initial designs that are then individually optimized in stage 2 using a continuous gradient-based topology optimization method. Thus, both the discrete and continuous design decisions are made sequentially in this framework. The design framework is successfully demonstrated using different 2D case studies such as a hybrid unmanned aerial vehicle (UAV) system, automotive fuel cell (AFC) packaging system, and other complex multi-loop systems. The 3D problem is significantly more challenging than the 2D problem due to vastly more expansive design space and potential features. A review of state-of-the-art methods, challenges, existing gaps, and opportunities are presented for the optimal design of the 3D PR problem. Stage 1 of the framework has been investigated thoroughly for 3D systems in this dissertation. An efficient design framework to represent and enumerate 3D system spatial topologies for a given system architecture is demonstrated using braid and spatial graph theories. After enumeration, the unique spatial topologies are identified by calculating the Yamada polynomials of all the generated spatial graphs. Spatial topologies that have the same Yamada polynomial are categorized together into equivalent classes. Finally, CAD-based 3D system models are generated from these unique topology classes. These 3D models can be utilized in stage 2 as initial designs for 3D multi-physics PR optimization. Current limitations and significantly impactful future directions for this work are outlined. In summary, this novel design automation framework integrates several elements together as a foundation toward a more comprehensive solution of 3D real-world packing and routing problems with both geometric and physics considerations