A Logic Simplification Approach for Very Large Scale Crosstalk Circuit Designs

Crosstalk computing, involving engineered interference between nanoscale metal lines, offers a fresh perspective to scaling through co-existence with CMOS. Through capacitive manipulations and innovative circuit style, not only primitive gates can be implemented, but custom logic cells such as an Adder, Subtractor can be implemented with huge gains. Our simulations show over 5x density and 2x power benefits over CMOS custom designs at 16nm [1]. This paper introduces the Crosstalk circuit style and a key method for large-scale circuit synthesis utilizing existing EDA tool flow. We propose to manipulate the CMOS synthesis flow by adding two extra steps: conversion of the gate-level netlist to Crosstalk implementation friendly netlist through logic simplification and Crosstalk gate mapping, and the inclusion of custom cell libraries for automated placement and layout. Our logic simplification approach first converts Cadence generated structured netlist to Boolean expressions and then uses the majority synthesis tool to obtain majority functions, which is further used to simplify functions for Crosstalk friendly implementations. We compare our approach of logic simplification to that of CMOS and majority logic-based approaches. Crosstalk circuits share some similarities to majority synthesis that are typically applied to Quantum Cellular Automata technology. However, our investigation shows that by closely following Crosstalk's core circuit styles, most benefits can be achieved. In the best case, our approach shows 36% density improvements over majority synthesis for MCNC benchmark

Microring-Resonator-Based Switch Architectures for Optical Networks

Integrated silicon photonics provides a promising platform for chip-based, high-speed optical signal processing due to its compatibility with complementary metal-oxide semiconductor (CMOS) fabrication processes. They are attracting significant research and development interest globally and making a huge impact on green information and communication technologies, and high-performance computing systems. Microring resonators (MRRs) show the versatility to implement a variety of network functions, compact footprint, and complementary metal-oxide semiconductor compatibility, and demonstrate the viability applied in photonic integrated technologies for both chip level and board-to-board interconnects. Furthermore, MRRs have excellent wavelength selection properties and can be used to design tunable filters, modulators, wavelength converters, and switches that are critical components for optical interconnects. The research work of this dissertation is focused on investigating how to develop MRR-based switches and switch architectures for possible applications not only in optical interconnection networks but also in flexible-grid on-chip networks for optical communication systems. The basic properties and performances of the MRR switches and the MRR switch architectures related to their applications in the networks are examined. In particular, how to design and how to configure high performance, bandwidth variable, low insertion loss, and weak crosstalk MRR-based switches and switch architectures are investigated for applications in optical interconnection networks and in flexible-grid on-chip networks for optical communication systems. The works include several parts as follows. The physical characteristics of microring resonator switching devices are thoroughly analyzed using a model based on the field coupling matrix theory. The spectral response and insertion loss properties of these switching elements are simulated using the developed model. Then we investigate the optimal design of high-order MRR-based switch devices. Spectral shaping of the passbands of microring resonator switches is studied. Multistage high-order microring resonator-based optical switch structures are proposed to achieve steep-edge flat-top spectral passband. Using the transfer matrix analysis model, the spectral response behaviors of the switch structures are simulated. The performances of the proposed multistage high-order microring resonator-based optical switch structures and the high-order microring-resonator-based optical switch structures without stages are studied and compared. Two types of MRR-based switch architectures are proposed to realize variable output bandwidths varying from 0 to 4 THz. One consists of 320, 160, and 80 third-order MRR switches with -3 dB passband widths of 12.5, 25, and 50 GHz, respectively. Another one is two-stage switch structure. In the first stage there are 4 third-order MRR switches with the passband widths of 1 THz. In second stage, there are 80, 40, 20 third-order MRR switches with the passband widths of 12.5, 25, and 50 GHz, respectively. Their insertion losses and crosstalks in the worst cases are numerically analyzed and compared in order to show the feasibility for the architectures to be applied in flexible optical networks. MRR-based bandwidth-variable wavelength selective switch architectures with multiple input and output ports are proposed for flexible optical networks. The light transmission behaviors of a 1 by N MRR-based WSS are analyzed in detail based on numerical simulation using transfer matrix theory. Two types of N by N MRR-based WSS architectures consisting of MRR-based WSSs and MRR-based WSSs, and MRR-based WSSs and optical couplers are proposed. The performances of the proposed architectures are studied. Scalable optical interconnections based on MRRs are proposed, which consist mainly of microring resonator devices: microring lasers, microring switches, microring de-multiplexers, and integrated photo-dectors. Their throughput capacities, end-to-end time latencies, and transmission packet loss rates are evaluated using OMNet++. In summary, the research of the dissertation contributes to develop high performance, variable bandwidth, low insertion loss, and low crosstalk MRR-based optical switches and switch architectures to adapt to dynamic source allocation of flexible-grid optical networks

Design and practical realization of polymorphic crosstalk circuits using 65nm TSMC PDK

Title from PDF of title page viewed January 14, 2020Thesis advisor: Mostafizur RahmanVitaIncludes bibliographical references (page 54-56)Thesis (M.S.)--School of Computing and Engineering. University of Missouri--Kansas City. 2019As the technology node scales down, the coupling capacitance between the adjacent metal lines increases. With an increase in this electrostatic coupling, the unwanted signal interference also increases, which is popularly called as Crosstalk. In conventional circuits, the Crosstalk affects either functionality or performance or both. Therefore the Crosstalk is always considered as detrimental to the circuits, and we always try to filter out the Crosstalk noise from signals. Crosstalk Computing Technology tries to astutely turn this unwanted coupling capacitance into computing principle for digital logic gates[1, 2]. The special feature of the crosstalk circuits is its inherent circuit mechanism to build polymorphic logic gates[3]. Our team has previously demonstrated various fundamental polymorphic logic circuits [1-6,16-18]. This thesis shows the design of the large-scale polymorphic crosstalk circuits such as Multiplier–Sorter, Multiplier–Sorter–Adder using the fundamental polymorphic gates, and also analyzes the Power, Performance, and Area (PPA) for these large-scale designs. Similar to the basic and complex polymorphic gates, the functionality of the large-scale polymorphic circuits can also be altered using the control signals. Owing to their multi-functional embodiment in a single circuit, polymorphic circuits find a myriad of useful applications such as reconfigurable system design, resource sharing, hardware security, and fault-tolerant circuit design, etc. [3]. Also, in this thesis, a lot of studies have been done on the variability (PVT analysis) of Crosstalk Circuits. This PVT variation analysis establishes the circuit design requirements in terms of coupling capacitances and fan-in limitation that allows reliable operation of the Crosstalk gates under Process, Voltage and Temperature variations. As an example, I also elaborate on the reason for which the full adder can’t be implemented as a single gate in the crosstalk circuit-style at lower technology nodes. Though we designed a variety of basic and complex logic gates and crosstalk polymorphic gates, the biggest question is “Will these crosstalk gates work reliably on silicon owing to their new circuit requirements and technological challenges?”. Trying to answer the above question, the whole thesis is mainly focused on the physical implementation of the crosstalk gates at 65nm. I will detail the steps that we have performed while designing the crosstalk circuits and their layouts, the challenges we faced while implementing the new circuit techniques using conventional design approaches and PDK, and their solutions, specifically during layout design and verification. The other potential application of crosstalk circuits is in non-linear analog circuits: Analog-to-Digital Converter (ADC) [4], Digital-to-Analog Converter (DAC), and Comparator. In this thesis, I have shown how the deterministic charge summation principle that is used in digital crosstalk gates can also be used to implement the non-linear analog circuits.Introduction -- Polymorphic Crosstalk circuit design -- Practical realization of Crosstalk circuits -- PVT variation analysis -- Difficulties or errors in layout design and full chip details -- Potential miscellaneous applications -- Conclusion and future wor

A novel approach to embedding memory with crosstalk logic circuits for high performance applications

Title from PDF of title page viewed January 20, 2022Thesis advisor: Mostafizur RahmanVitaIncludes bibliographical references (page 33-36)Thesis (M.S.)--School of Computing and Engineering. University of Missouri--Kansas City, 2021One of the essential elements of computing is the memory element. Flip-flops form an integral part of a System-on-Chip (SoC) and consume most of the area on the die. To meet the high-speed performance demands by data-intensive applications like artificial intelligence, cloud computing, and machine learning, we intend to integrate memory with the logic to get built-in memory logic circuits that operate based on the crosstalk computing logic. These circuits are called Crosstalk Built-in Memory Logic (CBML) circuits which exploit the detrimental interconnect crosstalk and astutely turn this unwanted effect into a computing principle with embedded memory. By virtue of our novel CBML circuit technique, the logic is computed by the novel computing technique called Crosstalk Computing, and the result is stored intrinsically within these complex circuits. The stored values will be retained irrespective of the change in input until the next logic evaluation cycle. This neoteric embedding of memory in logic provides high-speed operation with a reduced number of transistors. In this work, we present how Crosstalk Computing can be leveraged to embed memory in logic. We have manifested the in-built memory feature of the complex CBML circuits using 16 nanometer (nm) PTM models in HSPICE. Benchmarking is performed with the equivalent static CMOS circuits to compare the number of transistors, performance, and power. It is observed that the number of transistors consumed by the CBML logic circuits like 3-input AND, OR, is 40% less than the equivalent CMOS circuits. The cascaded CBML 4-bit Full-Adder (the key element prevalent in Arithmetic circuits, e.g., ALU, Counters, etc.,) is up to 46% less, and performance is improved by 27% than the equivalent CMOS circuits. This circuit serves as an example of a large-scale CBML circuit. Also, the performance improvement achieved by other circuits such as 3-input AND and the CARRY logic is up to 60% along with a 40% reduction in the number of transistors. The qualitative analysis with the existing flip-flop architectures shows that the transistor count reduction of the CBML circuits is around 45% less than the architectures like Semi-dynamic Single-Phase Pulsed FF (SDFF), Dual dynamic node FF (DDFF) which embed logic into their flip-flop circuits. Additionally, these existing architectures do not have capability to embed complex circuits like full adder into a single flip-flop circuit. Hence, CBML circuits have the potential to pave the way for special high-speed macros with specifically engineered structures.Introduction and Motivation -- Basic Flip-Flop Memory -- Literature survey on Existing Flip-Flop Architectures With Embedded Logic -- Overview: Basic Crosstalk Circuits -- Crosstalk Logic With Embedded Memory Feature -- Comparison and Benchmarking -- Conclusion and Future Wor

Crosstalk Analysis of a CMOS Single Membrane Thermopile Detector Array.

We present a new experimental technique to characterise the crosstalk of a thermopile-based thermal imager, based on bi-directional electrical heating of thermopile elements. The new technique provides a significantly simpler and more reliable method to determine the crosstalk, compared to a more complex experimental setup with a laser source. The technique is used to characterise a novel single-chip array, fabricated on a single dielectric membrane. We propose a theoretical model to simulate the crosstalk, which shows good agreement with the experimental results. Our results allow a better understanding of the thermal effects in these devices, which are at the center of a rising market of industrial and consumer applications

Multiphysics modeling and simulation for large-scale integrated circuits

This dissertation is a process of seeking solutions to two important and challenging problems related to the design of modern integrated circuits (ICs): the ever increasing couplings among the multiphysics and the large problem size arising from the escalating complexity of the designs. A multiphysics-based computer-aided design methodology is proposed and realized to address multiple aspects of a design simultaneously, which include electromagnetics, heat transfer, fluid dynamics, and structure mechanics. The multiphysics simulation is based on the finite element method for its unmatched capabilities in handling complicate geometries and material properties. The capability of the multiphysics simulation is demonstrated through its applications in a variety of important problems, including the static and dynamic IR-drop analyses of power distribution networks, the thermal-ware high-frequency characterization of through-silicon-via structures, the full-wave electromagnetic analysis of high-power RF/microwave circuits, the modeling and analysis of three-dimensional ICs with integrated microchannel cooling, the characterization of micro- and nanoscale electrical-mechanical systems, and the modeling of decoupling capacitor derating in the power integrity simulations. To perform the large-scale analysis in a highly efficient manner, a domain decomposition scheme, parallel computing, and an adaptive time-stepping scheme are incorporated into the proposed multiphysics simulation. Significant reduction in computation time is achieved through the two numerical schemes and the parallel computing with multiple processors

Challenges and solutions for large-scale integration of emerging technologies

Title from PDF of title page viewed June 15, 2021Dissertation advisor: Mostafizur RahmanVitaIncludes bibliographical references (pages 67-88)Thesis (Ph.D.)--School of Computing and Engineering and Department of Physics and Astronomy. University of Missouri--Kansas City, 2021The semiconductor revolution so far has been primarily driven by the ability to shrink devices and interconnects proportionally (Moore's law) while achieving incremental benefits. In sub-10nm nodes, device scaling reaches its fundamental limits, and the interconnect bottleneck is dominating power and performance. As the traditional way of CMOS scaling comes to an end, it is essential to find an alternative to continue this progress. However, an alternative technology for general-purpose computing remains elusive; currently pursued research directions face adoption challenges in all aspects from materials, devices to architecture, thermal management, integration, and manufacturing. Crosstalk Computing, a novel emerging computing technique, addresses some of the challenges and proposes a new paradigm for circuit design, scaling, and security. However, like other emerging technologies, Crosstalk Computing also faces challenges like designing large-scale circuits using existing CAD tools, scalability, evaluation and benchmarking of large-scale designs, experimentation through commercial foundry processes to compete/co-exist with CMOS for digital logic implementations. This dissertation addresses these issues by providing a methodology for circuit synthesis customizing the existing EDA tool flow, evaluating and benchmarking against state-of-the-art CMOS for large-scale circuits designed at 7nm from MCNC benchmark suits. This research also presents a study on Crosstalk technology's scalability aspects and shows how the circuits' properties evolve from 180nm to 7nm technology nodes. Some significant results are for primitive Crosstalk gate, designed in 180nm, 65nm, 32nm, and 7nm technology nodes, the average reduction in power is 42.5%, and an average improvement in performance is 34.5% comparing to CMOS for all mentioned nodes. For benchmarking large-scale circuits designed at 7nm, there are 48%, 57%, and 10% improvements against CMOS designs in terms of density, power, and performance, respectively. An experimental demonstration of a proof-of-concept prototype chip for Crosstalk Computing at TSMC 65nm technology is also presented in this dissertation, showing the Crosstalk gates can be realized using the existing manufacturing process. Additionally, the dissertation also provides a fine-grained thermal management approach for emerging technologies like transistor-level 3-D integration (Monolithic 3-D, Skybridge, SN3D), which holds the most promise beyond 2-D CMOS technology. However, such 3-D architectures within small form factors increase hotspots and demand careful consideration of thermal management at all integration levels. This research proposes a new direction for fine-grained thermal management approach for transistor-level 3-D integrated circuits through the insertion of architected heat extraction features that can be part of circuit design, and an integrated methodology for thermal evaluation of 3-D circuits combining different simulation outcomes at advanced nodes, which can be integrated to traditional CAD flow. The results show that the proposed heat extraction features effectively reduce the temperature from a heated location. Thus, the dissertation provides a new perspective to overcome the challenges faced by emerging technologies where the device, circuit, connectivity, heat management, and manufacturing are addressed in an integrated manner.Introduction and motivation -- Cross talk computing overview -- Logic simplification approach for Crosstalk circuit design -- Crostalk computing scalability study: from 180 nm to 7 nm -- Designing large*scale circuits in Crosstalk at 7 nm -- Comparison and benchmarking -- Experimental demonstration of Crosstalk computing -- Thermal management challenges and mitigation techniques for transistor-level- 3D integratio

Min/max time limits and energy penalty of communication scheduling in ring-based ONoC

International audienceRecent advances in the photonics devices integration bring ONoC as a bridge future for communication media in the MPSoC domain. As ONoC can support Wavelength Division Multiplexing (WDM) technique, communications between cores can be improved through allocation of one or several wavelengths for each communication. However, WDM introduces wavelength crosstalk, requiring to increase the laser power to provide accurate communication between cores. Thus, for the designer, exploring this design space (execution time vs power consumption) is not an easy task due to a large number of wavelength allocation combinations. The contribution presented in this paper proposes to evaluate the two extreme bounds of this design space considering the different communication scenario. To address this problem, we model the wavelength allocation by two different objective functions to compute the bounds in terms of execution times. Furthermore, from an accurate model of crosstalk between the wavelengths, we compute the energy penalty for each communication scenario. The results presented in this paper highlight the execution time and energy consumption tradeoff, and the opportunity for communication optimisation thanks to an efficient use of WDM technique