Study and Implementation of an Optimized Modular Architecture for an ATE Test Environment

Implementation of a testbench module which is capable of integrating different Synopsys products. This implementation will optimize test speed in an ATE test environment

CubeSat Data Transmission and Storage Throughput Optimization Through the Use of a Zynq SoC Based CubeSat Science Instrument Interface Electronics Board

The CubeSat standard sprang from the desire to create a satellite standard that would open the doors for universities and other lower budget research institutions by making it more feasible to get their work into space. Since then, many other institutions and industries have been adopting variations on the standard for their own use. As more people are seeking out to use the CubeSat standard as their main bus, the standards and practices of the community have grown and expanded and with this growth, new challenges have been created. One such challenge is the bandwidth limitation in the RF-downlink. When carrying payloads requiring what might seem to be a relatively small (science data) bandwidth requirement (on the order of thousands of bps), the RF-link to ground is overloaded. Many approaches in the past have been put forth to help alleviate this issue, unfortunately, none have been fully adopted. This paper presents a solution that takes advantage of new technology yet to be fully exploited in space applications. The key to the solution lies in removing the bandwidth requirements by enabling onboard post-data processing and compression. In order to achieve the high computational needs, while minimizing power consumption, a Xilinx Zynq-7000 SoC is used, creating a highly-programmable, open integration device. This report outlines the design, fabrication and testing of this solution. The completion of the Zynq Processing System CubeSat Science Instrument Interface Electronics Board (or ZPS-Board), ultimately demonstrates the feasibility of this solution. Additionally, this research is funded by NASA’s JPL, with secondary motives for the creating of a space application Zynq-7000 SoC based product. Upon successful completion of the ZPS-Board, the product creates a platform for JPL to perform environmental testing in order to study the effects and performance characteristics of the Zynq in space applications

Experimental Evaluation and Comparison of Time-Multiplexed Multi-FPGA Routing Architectures

Emulating large complex designs require multi-FPGA systems (MFS). However, inter-FPGA communication is confronted by the challenge of lack of interconnect capacity due to limited number of FPGA input/output (I/O) pins. Serializing parallel signals onto a single trace effectively addresses the limited I/O pin obstacle. Besides the multiplexing scheme and multiplexing ratio (number of inter-FPGA signals per trace), the choice of the MFS routing architecture also affect the critical path latency. The routing architecture of an MFS is the interconnection pattern of FPGAs, fixed wires and/or programmable interconnect chips. Performance of existing MFS routing architectures is also limited by off-chip interface selection. In this dissertation we proposed novel 2D and 3D latency-optimized time-multiplexed MFS routing architectures. We used rigorous experimental approach and real sequential benchmark circuits to evaluate and compare the proposed and existing MFS routing architectures. This research provides a new insight into the encouraging effects of using off-chip optical interface and three dimensional MFS routing architectures. The vertical stacking results in shorter off-chip links improving the overall system frequency with the additional advantage of smaller footprint area. The proposed 3D architectures employed serialized interconnect between intra-plane and inter-plane FPGAs to address the pin limitation problem. Additionally, all off-chip links are replaced by optical fibers that exhibited latency improvement and resulted in faster MFS. Results indicated that exploiting third dimension provided latency and area improvements as compared to 2D MFS. We also proposed latency-optimized planar 2D MFS architectures in which electrical interconnections are replaced by optical interface in same spatial distribution. Performance evaluation and comparison showed that the proposed architectures have reduced critical path delay and system frequency improvement as compared to conventional MFS. We also experimentally evaluated and compared the system performance of three inter-FPGA communication schemes i.e. Logic Multiplexing, SERDES and MGT in conjunction with two routing architectures i.e. Completely Connected Graph (CCG) and TORUS. Experimental results showed that SERDES attained maximum frequency than the other two schemes. However, for very high multiplexing ratios, the performance of SERDES & MGT became comparable

From FPGA to ASIC: A RISC-V processor experience

This work document a correct design flow using these tools in the Lagarto RISC- V Processor and the RTL design considerations that must be taken into account, to move from a design for FPGA to design for ASIC

A One Chip Hardened Solution for High Speed SpaceWire System Implementations. Session: Components

An Application Specific Integrated Circuit (ASIC) that implements the SpaceWire protocol has been developed in a radiation hardened 0.25 micron CMOS technology. This effort began in March 2003 as a joint development between the NASA Goddard Space Flight Center (GSFC) and BAE Systems. The BAE Systems SpaceWire ASIC is comprised entirely of reusable core elements, many of which are already flight-proven. It incorporates a router with 4 SpaceWire ports and two local ports, dual PC1 bus interfaces, a microcontroller, 32KB of internal memory, and a memory controller for additional external memory use. The SpaceWire cores are also reused in other ASICs under development. The SpaceWire ASIC is planned for use on the Geostationary Operational Environmental Satellites (GOES)-R, the Lunar Reconnaissance Orbiter (LRO) and other missions. Engineering and flight parts have been delivered to programs and users. This paper reviews the SpaceWire protocol and those elements of it that have been built into the current and next SpaceWire reusable cores and features within the core that go beyond the current standard and can be enabled or disabled by the user. The adaptation of SpaceWire to BAE Systems' On Chip Bus (OCB) for compatibility with the other reusable cores will be reviewed and highlighted. Optional configurations within user systems and test boards will be shown. The physical implementation of the design will be described and test results from the hardware will be discussed. Application of this ASIC and other ASICs containing the SpaceWire cores and embedded microcontroller to Plug and Play and reconfigurable implementations will be described. Finally, the BAE Systems roadmap for SpaceWire developments will be updated, including some products already in design as well as longer term plans

The STAR MAPS-based PiXeL detector

The PiXeL detector (PXL) for the Heavy Flavor Tracker (HFT) of the STAR experiment at RHIC is the first application of the state-of-the-art thin Monolithic Active Pixel Sensors (MAPS) technology in a collider environment. Custom built pixel sensors, their readout electronics and the detector mechanical structure are described in detail. Selected detector design aspects and production steps are presented. The detector operations during the three years of data taking (2014-2016) and the overall performance exceeding the design specifications are discussed in the conclusive sections of this paper

Implementation and Characterization of Mixed-Signal Neuromorphic ASICs

Accelerated neuromorphic hardware allows the emulation of spiking neural networks with a high speed-up factor compared to classical computer simulation approaches. However, realizing a high degree of versatility and configurability in the implemented models is challenging. In this thesis, we present two mixed-signal ASICs that improve upon previous architectures by augmenting the versatility of the modeled synapses and neurons. In the first part, we present the integration of an analog multi-compartment neuron model into the Multi-Compartment Chip. We characterize the properties of this neuron model and describe methods to compensate for deviations from ideal behavior introduced by the physical implementation. The implemented features of the multi-compartment neurons are demonstrated with a compact prototype setup. In the second part, the integration of a general-purpose microprocessor with analog models of neurons and synapses is described. This allows to define learning rules that go beyond spike-timing dependent plasticity in software without decreasing the speed-up of the underlying network emulation. In the third part, the importance of testability and pre-tapeout verification is discussed and exemplified by the design process of both chips

Design of a low-cost high speed data capture card for the Hubble Sphere Hydrogen Survey

Includes bibliographical references (leaves 101-105).This thesis describes the design and implementation of a low-cost high speed data capture card for the Hubble Sphere Hydrogen Survey (HSHS). The Hubble Space Hydrogen Survey was initiated in an effort to build a low-cost cylindrical radio telescope for an all sky redshift survey with the observational goal to produce a 3-dimensional mapping of the bulk Hubble Sphere using Hydrogen 21cm emissions. This dissertation ï¬ rst investigates the system design to see how each of the user speciï¬ cations set by the planning team could be achieved in terms of design decisions, component selection and schematic capture. The final design. AstroGIG, satisï¬ es the user speciï¬ cations by capturing data up to a full power bandwidth of 1.7GHz with an instantaneous bandwidth of ≤ 250MHz white maximizing the dynamic range. AstroGIG buffers, processes, stores and ï¬ nally transmits the data through a 4-lane PCI-Express interface to a standard PC where the majority of the processing is performed. The system implementation is then described where issues relating to the process of transforming schematics into a physical PCB, and HSHS integration are discussed. The design is veriï¬ ed through Hyperlynx simulations to give a high degree of certainty that physical implementation and production would be successful. Results from tests on the actual hardware characterizing the overall system performance are presented. Conclusions are drawn based on these results and suggestions for future work and design improvements are recommended

Methodology and Ecosystem for the Design of a Complex Network ASIC

Performance of HPC systems has risen steadily. While the 10 Petaflop/s barrier has been breached in the year 2011 the next large step into the exascale era is expected sometime between the years 2018 and 2020. The EXTOLL project will be an integral part in this venture. Originally designed as a research project on FPGA basis it will make the transition to an ASIC to improve its already excelling performance even further. This transition poses many challenges that will be presented in this thesis. Nowadays, it is not enough to look only at single components in a system. EXTOLL is part of complex ecosystem which must be optimized overall since everything is tightly interwoven and disregarding some aspects can cause the whole system either to work with limited performance or even to fail. This thesis examines four different aspects in the design hierarchy and proposes efficient solutions or improvements for each of them. At first it takes a look at the design implementation and the differences between FPGA and ASIC design. It introduces a methodology to equip all on-chip memory with ECC logic automatically without the user’s input and in a transparent way so that the underlying code that uses the memory does not have to be changed. In the next step the floorplanning process is analyzed and an iterative solution is worked out based on physical and logical constraints of the EXTOLL design. Besides, a work flow for collaborative design is presented that allows multiple users to work on the design concurrently. The third part concentrates on the high-speed signal path from the chip to the connector and how it is affected by technological limitations. All constraints are analyzed and a package layout for the EXTOLL chip is proposed that is seen as the optimal solution. The last part develops a cost model for wafer and package level test and raises technological concerns that will affect the testing methodology. In order to run testing internally it proposes the development of a stand-alone test platform that is able to test packaged EXTOLL chips in every aspect