Photonic packaging: transforming silicon photonic integrated circuits into photonic devices

Dedicated multi-project wafer (MPW) runs for photonic integrated circuits (PICs) from Si foundries mean that researchers and small-to-medium enterprises (SMEs) can now afford to design and fabricate Si photonic chips. While these bare Si-PICs are adequate for testing new device and circuit designs on a probe-station, they cannot be developed into prototype devices, or tested outside of the laboratory, without first packaging them into a durable module. Photonic packaging of PICs is significantly more challenging, and currently orders of magnitude more expensive, than electronic packaging, because it calls for robust micron-level alignment of optical components, precise real-time temperature control, and often a high degree of vertical and horizontal electrical integration. Photonic packaging is perhaps the most significant bottleneck in the development of commercially relevant integrated photonic devices. This article describes how the key optical, electrical, and thermal requirements of Si-PIC packaging can be met, and what further progress is needed before industrial scale-up can be achieved

Free space intra-datacenter interconnects based on 2D optical beam steering enabled by photonic integrated circuits

Data centers are continuously growing in scale and can contain more than one million servers spreading across thousands of racks; requiring a large-scale switching network to provide broadband and reconfigurable interconnections of low latency. Traditional data center network architectures, through the use of electrical packet switches in a multi-tier topology, has fundamental weaknesses such as oversubscription and cabling complexity. Wireless intra-data center interconnection solutions have been proposed to deal with the cabling problem and can simultaneously address the over-provisioning problem by offering efficient topology re-configurability. In this work we introduce a novel free space optical interconnect solution for intra-data center networks that utilizes 2D optical beam steering for the transmitter, and high bandwidth wide-area photodiode arrays for the receiver. This new breed of free space optical interconnects can be developed on a photonic integrated circuit; offering ns switching at sub-µW consumption. The proposed interconnects together with a networking architecture that is suitable for utilizing those devices could support next generation intra-data center networks, fulfilling the requirements of seamless operation, high connectivity, and agility in terms of the reconfiguration time.Peer ReviewedPostprint (published version

High capacity photonic integrated switching circuits

As the demand for high-capacity data transfer keeps increasing in high performance computing and in a broader range of system area networking environments; reconfiguring the strained networks at ever faster speeds with larger volumes of traffic has become a huge challenge. Formidable bottlenecks appear at the physical layer of these switched interconnects due to its energy consumption and footprint. The energy consumption of the highly sophisticated but increasingly unwieldy electronic switching systems is growing rapidly with line rate, and their designs are already being constrained by heat and power management issues. The routing of multi-Terabit/second data using optical techniques has been targeted by leading international industrial and academic research labs. So far the work has relied largely on discrete components which are bulky and incurconsiderable networking complexity. The integration of the most promising architectures is required in a way which fully leverages the advantages of photonic technologies. Photonic integration technologies offer the promise of low power consumption and reduced footprint. In particular, photonic integrated semiconductor optical amplifier (SOA) gate-based circuits have received much attention as a potential solution. SOA gates exhibit multi-terahertz bandwidths and can be switched from a high-gain state to a high-loss state within a nanosecond using low-voltage electronics. In addition, in contrast to the electronic switching systems, their energy consumption does not rise with line rate. This dissertation will discuss, through the use of different kind of materials and integration technologies, that photonic integrated SOA-based optoelectronic switches can be scalable in either connectivity or data capacity and are poised to become a key technology for very high-speed applications. In Chapter 2, the optical switching background with the drawbacks of optical switches using electronic cores is discussed. The current optical technologies for switching are reviewed with special attention given to the SOA-based switches. Chapter 3 discusses the first demonstrations using quantum dot (QD) material to develop scalable and compact switching matrices operating in the 1.55µm telecommunication window. In Chapter 4, the capacity limitations of scalable quantum well (QW) SOA-based multistage switches is assessed through experimental studies for the first time. In Chapter 5 theoretical analysis on the dependence of data integrity as ultrahigh line-rate and number of monolithically integrated SOA-stages increases is discussed. Chapter 6 presents some designs for the next generation of large scale photonic integrated interconnects. A 16x16 switch architecture is described from its blocking properties to the new miniaturized elements proposed. Finally, Chapter 7 presents several recommendations for future work, along with some concluding remark

Reliability-aware multi-segmented bus architecture for photonic networks-on-chip

Network-on-chip (NoC) has emerged as an enabling platform for connecting hundreds of cores on a single chip, allowing for a structured, scalable system when compared to traditional on-chip buses. However, the multi-hop wireline paths in traditional NoCs result in high latency and energy dissipation causing an overall degradation in performance, especially for increasing system size. To alleviate this problem a few radically different interconnect technologies are envisioned. One such method of interconnecting different cores in NoCs is photonic interconnects. Photonic NoCs are on-chip communications networks in which information is transmitted in the form of optical signals. Photonic interconnection is one of the leading examples of emerging technology for on-chip interconnects. Existing innovative photonic NoC architectures have improved performance and reduced energy dissipation. Most architectures use Wavelength Division Multiplexing (WDM) on the photonic waveguides to increase the data bandwidth. However they have issues relating to reliability, such as waveguide losses and adjacent channel crosstalk. These phenomena could have a crippling effect on a system, and most current architectures do not address these effects. A newly proposed topology, known as the Multiple-Segmented Bus topology, or MSB, has shown promise for solving, or at least reducing, many of the problems plaguing the design of photonic networks using a modification of a folded torus to transmit different wavelength signals simultaneously. The MSB segments the waveguides into smaller parts to limit the waveguide losses. The formal performance evaluation of this proposed architecture has not been completed. This thesis will analyze the performance of such a network when implemented as a NoC in terms of data bandwidth, energy dissipation, latency, and reliability. By analyzing and comparing performance, energy dissipations, and reliability, the MSB-based photonic NoC (MSB-PNoC) can be compared to other state-of-the-art photonic NoCs to determine the feasibility of this topology for future network-on-chip designs

Control Plane Hardware Design for Optical Packet Switched Data Centre Networks

Optical packet switching for intra-data centre networks is key to addressing traffic requirements. Photonic integration and wavelength division multiplexing (WDM) can overcome bandwidth limits in switching systems. A promising technology to build a nanosecond-reconfigurable photonic-integrated switch, compatible with WDM, is the semiconductor optical amplifier (SOA). SOAs are typically used as gating elements in a broadcast-and-select (B\&S) configuration, to build an optical crossbar switch. For larger-size switching, a three-stage Clos network, based on crossbar nodes, is a viable architecture. However, the design of the switch control plane, is one of the barriers to packet switching; it should run on packet timescales, which becomes increasingly challenging as line rates get higher. The scheduler, used for the allocation of switch paths, limits control clock speed. To this end, the research contribution was the design of highly parallel hardware schedulers for crossbar and Clos network switches. On a field-programmable gate array (FPGA), the minimum scheduler clock period achieved was 5.0~ns and 5.4~ns, for a 32-port crossbar and Clos switch, respectively. By using parallel path allocation modules, one per Clos node, a minimum clock period of 7.0~ns was achieved, for a 256-port switch. For scheduler application-specific integrated circuit (ASIC) synthesis, this reduces to 2.0~ns; a record result enabling scalable packet switching. Furthermore, the control plane was demonstrated experimentally. Moreover, a cycle-accurate network emulator was developed to evaluate switch performance. Results showed a switch saturation throughput at a traffic load 60\% of capacity, with sub-microsecond packet latency, for a 256-port Clos switch, outperforming state-of-the-art optical packet switches

A 40 Gb/s chip-to-chip interconnect for 8-socket direct connectivity using integrated photonics

We present an O-band any-to-any chip-to-chip (C2C) interconnection at 40 Gb/s suitable for up to 8-socket direct connectivity in multi-socket server boards, utilizing integrated low-energy photonics for the transceiver and routing functions. The C2C interconnect exploits an Si-based ring modulator as its transmitter and a co-packaged photodiode/transimpedance amplifier enabled receiver interconnected over an 8 x 8 Si-based arrayed waveguide grating router, allowing for a single-hop flat-topology interconnection between eight nodes. A proof-of-concept demonstration of the C2C interconnect is presented at 25 and 40 Gb/s for eight possible routing scenarios, revealing clear eye diagrams at both data rates with extinction ratios of 4.8 +/- 0.3 and 4.38 +/- 0.31 dB, respectively, among the eight routed signals