65 research outputs found

    High-level services for networks-on-chip

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    Future technology trends envision that next-generation Multiprocessors Systems-on- Chip (MPSoCs) will be composed of a combination of a large number of processing and storage elements interconnected by complex communication architectures. Communication and interconnection between these basic blocks play a role of crucial importance when the number of these elements increases. Enabling reliable communication channels between cores becomes therefore a challenge for system designers. Networks-on-Chip (NoCs) appeared as a strategy for connecting and managing the communication between several design elements and IP blocks, as required in complex Systems-on-Chip (SoCs). The topic can be considered as a multidisciplinary synthesis of multiprocessing, parallel computing, networking, and on- chip communication domains. Networks-on-Chip, in addition to standard communication services, can be employed for providing support for the implementation of system-level services. This dissertation will demonstrate how high-level services can be added to an MPSoC platform by embedding appropriate hardware/software support in the network interfaces (NIs) of the NoC. In this dissertation, the implementation of innovative modules acting in parallel with protocol translation and data transmission in NIs is proposed and evaluated. The modules can support the execution of the high-level services in the NoC at a relatively low cost in terms of area and energy consumption. Three types of services will be addressed and discussed: security, monitoring, and fault tolerance. With respect to the security aspect, this dissertation will discuss the implementation of an innovative data protection mechanism for detecting and preventing illegal accesses to protected memory blocks and/or memory mapped peripherals. The second aspect will be addressed by proposing the implementation of a monitoring system based on programmable multipurpose monitoring probes aimed at detecting NoC internal events and run-time characteristics. As last topic, new architectural solutions for the design of fault tolerant network interfaces will be presented and discussed

    Addressing Manufacturing Challenges in NoC-based ULSI Designs

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    Hernández Luz, C. (2012). Addressing Manufacturing Challenges in NoC-based ULSI Designs [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/1669

    A comprehensive approach to MPSoC security: achieving network-on-chip security : a hierarchical, multi-agent approach

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    Multiprocessor Systems-on-Chip (MPSoCs) are pervading our lives, acquiring ever increasing relevance in a large number of applications, including even safety-critical ones. MPSoCs, are becoming increasingly complex and heterogeneous; the Networks on Chip (NoC paradigm has been introduced to support scalable on-chip communication, and (in some cases) even with reconfigurability support. The increased complexity as well as the networking approach in turn make security aspects more critical. In this work we propose and implement a hierarchical multi-agent approach providing solutions to secure NoC based MPSoCs at different levels of design. We develop a flexible, scalable and modular structure that integrates protection of different elements in the MPSoC (e.g. memory, processors) from different attack scenarios. Rather than focusing on protection strategies specifically devised for an individual attack or a particular core, this work aims at providing a comprehensive, system-level protection strategy: this constitutes its main methodological contribution. We prove feasibility of the concepts via prototype realization in FPGA technology

    Floorplan-Aware High Performance NoC Design

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    Las actuales arquitecturas de m�ltiples n�cleos como los chip multiprocesadores (CMP) y soluciones multiprocesador para sistemas dentro del chip (MPSoCs) han adoptado a las redes dentro del chip (NoC) como elemento -ptimo para la inter-conexi-n de los diversos elementos de dichos sistemas. En este sentido, fabricantes de CMPs y MPSoCs han adoptado NoCs sencillas, generalmente con una topolog'a en malla o anillo, ya que son suficientes para satisfacer las necesidades de los sistemas actuales. Sin embargo a medida que los requerimientos del sistema -- baja latencia y alto rendimiento -- se hacen m�s exigentes, estas redes tan simples dejan de ser una soluci-n real. As', la comunidad investigadora ha propuesto y analizado NoCs m�s complejas. No obstante, estas soluciones son m�s dif'ciles de implementar -- especialmente los enlaces largos -- haciendo que este tipo de topolog'as complejas sean demasiado costosas o incluso inviables. En esta tesis, presentamos una metodolog'a de dise-o que minimiza la p�rdida de prestaciones de la red debido a su implementaci-n real. Los principales problemas que se encuentran al implementar una NoC son los conmutadores y los enlaces largos. En esta tesis, el conmutador se ha hecho modular, es decir, formado como uni-n de m-dulos m�s peque-os. En nuestro caso, los m-dulos son id�nticos, donde cada m-dulo es capaz de arbitrar, conmutar, y almacenar los mensajes que le llegan. Posteriormente, flexibilizamos la colocaci-n de estos m-dulos en el chip, permitiendo que m-dulos de un mismo conmutador est�n distribuidos por el chip. Esta metodolog'a de dise-o la hemos aplicado a diferentes escenarios. Primeramente, hemos introducido nuestro conmutador modular en NoCs con topolog'as conocidas como la malla 2D. Los resultados muestran como la modularidad y la distribuci-n del conmutador reducen la latencia y el consumo de potencia de la red. En segundo lugar, hemos utilizado nuestra metodolog'a de dise-o para implementar un crossbar distribuidRoca Pérez, A. (2012). Floorplan-Aware High Performance NoC Design [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/17844Palanci

    Architectural Support for Hypervisor-Level Intrusion Tolerance in MPSoCs

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    Increasingly, more aspects of our lives rely on the correctness and safety of computing systems, namely in the embedded and cyber-physical (CPS) domains, which directly affect the physical world. While systems have been pushed to their limits of functionality and efficiency, security threats and generic hardware quality have challenged their safety. Leveraging the enormous modular power, diversity and flexibility of these systems, often deployed in multi-processor systems-on-chip (MPSoC), requires careful orchestration of complex and heterogeneous resources, a task left to low-level software, e.g., hypervisors. In current architectures, this software forms a single point of failure (SPoF) and a worthwhile target for attacks: once compromised, adversaries can gain access to all information and full control over the platform and the environment it controls, for instance by means of privilege escalation and resource allocation. Currently, solutions to protect low-level software often rely on a simpler, underlying trusted layer which is often a SPoF itself and/or exhibits downgraded performance. Architectural hybridization allows for the introduction of trusted-trustworthy components, which combined with fault and intrusion tolerance (FIT) techniques leveraging replication, are capable of safely handling critical operations, thus eliminating SPoFs. Performing quorum-based consensus on all critical operations, in particular privilege management, ensures no compromised low-level software can single handedly manipulate privilege escalation or resource allocation to negatively affect other system resources by propagating faults or further extend an adversary’s control. However, the performance impact of traditional Byzantine fault tolerant state-machine replication (BFT-SMR) protocols is prohibitive in the context of MPSoCs due to the high costs of cryptographic operations and the quantity of messages exchanged. Furthermore, fault isolation, one of the key prerequisites in FIT, presents a complicated challenge to tackle, given the whole system resides within one chip in such platforms. There is so far no solution completely and efficiently addressing the SPoF issue in critical low-level management software. It is our aim, then, to devise such a solution that, additionally, reaps benefit of the tight-coupled nature of such manycore systems. In this thesis we present two architectures, using trusted-trustworthy mechanisms and consensus protocols, capable of protecting all software layers, specifically at low level, by performing critical operations only when a majority of correct replicas agree to their execution: iBFT and Midir. Moreover, we discuss ways in which these can be used at application level on the example of replicated applications sharing critical data structures. It then becomes possible to confine software-level faults and some hardware faults to the individual tiles of an MPSoC, converting tiles into fault containment domains, thus, enabling fault isolation and, consequently, making way to high-performance FIT at the lowest level

    Architectural Support for Hypervisor-Level Intrusion Tolerance in MPSoCs

    Get PDF
    Increasingly, more aspects of our lives rely on the correctness and safety of computing systems, namely in the embedded and cyber-physical (CPS) domains, which directly affect the physical world. While systems have been pushed to their limits of functionality and efficiency, security threats and generic hardware quality have challenged their safety. Leveraging the enormous modular power, diversity and flexibility of these systems, often deployed in multi-processor systems-on-chip (MPSoC), requires careful orchestration of complex and heterogeneous resources, a task left to low-level software, e.g., hypervisors. In current architectures, this software forms a single point of failure (SPoF) and a worthwhile target for attacks: once compromised, adversaries can gain access to all information and full control over the platform and the environment it controls, for instance by means of privilege escalation and resource allocation. Currently, solutions to protect low-level software often rely on a simpler, underlying trusted layer which is often a SPoF itself and/or exhibits downgraded performance. Architectural hybridization allows for the introduction of trusted-trustworthy components, which combined with fault and intrusion tolerance (FIT) techniques leveraging replication, are capable of safely handling critical operations, thus eliminating SPoFs. Performing quorum-based consensus on all critical operations, in particular privilege management, ensures no compromised low-level software can single handedly manipulate privilege escalation or resource allocation to negatively affect other system resources by propagating faults or further extend an adversary’s control. However, the performance impact of traditional Byzantine fault tolerant state-machine replication (BFT-SMR) protocols is prohibitive in the context of MPSoCs due to the high costs of cryptographic operations and the quantity of messages exchanged. Furthermore, fault isolation, one of the key prerequisites in FIT, presents a complicated challenge to tackle, given the whole system resides within one chip in such platforms. There is so far no solution completely and efficiently addressing the SPoF issue in critical low-level management software. It is our aim, then, to devise such a solution that, additionally, reaps benefit of the tight-coupled nature of such manycore systems. In this thesis we present two architectures, using trusted-trustworthy mechanisms and consensus protocols, capable of protecting all software layers, specifically at low level, by performing critical operations only when a majority of correct replicas agree to their execution: iBFT and Midir. Moreover, we discuss ways in which these can be used at application level on the example of replicated applications sharing critical data structures. It then becomes possible to confine software-level faults and some hardware faults to the individual tiles of an MPSoC, converting tiles into fault containment domains, thus, enabling fault isolation and, consequently, making way to high-performance FIT at the lowest level

    Cost Effective Routing Implementations for On-chip Networks

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    Arquitecturas de múltiples núcleos como multiprocesadores (CMP) y soluciones multiprocesador para sistemas dentro del chip (MPSoCs) actuales se basan en la eficacia de las redes dentro del chip (NoC) para la comunicación entre los diversos núcleos. Un diseño eficiente de red dentro del chip debe ser escalable y al mismo tiempo obtener valores ajustados de área, latencia y consumo de energía. Para diseños de red dentro del chip de propósito general se suele usar topologías de malla 2D ya que se ajustan a la distribución del chip. Sin embargo, la aparición de nuevos retos debe ser abordada por los diseñadores. Una mayor probabilidad de defectos de fabricación, la necesidad de un uso optimizado de los recursos para aumentar el paralelismo a nivel de aplicación o la necesidad de técnicas eficaces de ahorro de energía, puede ocasionar patrones de irregularidad en las topologías. Además, el soporte para comunicación colectiva es una característica buscada para abordar con eficacia las necesidades de comunicación de los protocolos de coherencia de caché. En estas condiciones, un encaminamiento eficiente de los mensajes se convierte en un reto a superar. El objetivo de esta tesis es establecer las bases de una nueva arquitectura para encaminamiento distribuido basado en lógica que es capaz de adaptarse a cualquier topología irregular derivada de una estructura de malla 2D, proporcionando así una cobertura total para cualquier caso resultado de soportar los retos mencionados anteriormente. Para conseguirlo, en primer lugar, se parte desde una base, para luego analizar una evolución de varios mecanismos, y finalmente llegar a una implementación, que abarca varios módulos para alcanzar el objetivo mencionado anteriormente. De hecho, esta última implementación tiene por nombre eLBDR (effective Logic-Based Distributed Routing). Este trabajo cubre desde el primer mecanismo, LBDR, hasta el resto de mecanismos que han surgido progresivamente.Rodrigo Mocholí, S. (2010). Cost Effective Routing Implementations for On-chip Networks [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/8962Palanci

    A Survey of Research into Mixed Criticality Systems

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    This survey covers research into mixed criticality systems that has been published since Vestal’s seminal paper in 2007, up until the end of 2016. The survey is organised along the lines of the major research areas within this topic. These include single processor analysis (including fixed priority and EDF scheduling, shared resources and static and synchronous scheduling), multiprocessor analysis, realistic models, and systems issues. The survey also explores the relationship between research into mixed criticality systems and other topics such as hard and soft time constraints, fault tolerant scheduling, hierarchical scheduling, cyber physical systems, probabilistic real-time systems, and industrial safety standards

    Développement d'architectures HW/SW tolérantes aux fautes et auto-calibrantes pour les technologies Intégrées 3D

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    Malgré les avantages de l'intégration 3D, le test, le rendement et la fiabilité des Through-Silicon-Vias (TSVs) restent parmi les plus grands défis pour les systèmes 3D à base de Réseaux-sur-Puce (Network-on-Chip - NoC). Dans cette thèse, une stratégie de test hors-ligne a été proposé pour les interconnections TSV des liens inter-die des NoCs 3D. Pour le TSV Interconnect Built-In Self-Test (TSV-IBIST) on propose une nouvelle stratégie pour générer des vecteurs de test qui permet la détection des fautes structuraux (open et short) et paramétriques (fautes de délaye). Des stratégies de correction des fautes transitoires et permanents sur les TSV sont aussi proposées aux plusieurs niveaux d'abstraction: data link et network. Au niveau data link, des techniques qui utilisent des codes de correction (ECC) et retransmission sont utilisées pour protégé les liens verticales. Des codes de correction sont aussi utilisés pour la protection au niveau network. Les défauts de fabrication ou vieillissement des TSVs sont réparé au niveau data link avec des stratégies à base de redondance et sérialisation. Dans le réseau, les liens inter-die défaillante ne sont pas utilisables et un algorithme de routage tolérant aux fautes est proposé. On peut implémenter des techniques de tolérance aux fautes sur plusieurs niveaux. Les résultats ont montré qu'une stratégie multi-level atteint des très hauts niveaux de fiabilité avec un cout plus bas. Malheureusement, il n'y as pas une solution unique et chaque stratégie a ses avantages et limitations. C'est très difficile d'évaluer tôt dans le design flow les couts et l'impact sur la performance. Donc, une méthodologie d'exploration de la résilience aux fautes est proposée pour les NoC 3D mesh.3D technology promises energy-efficient heterogeneous integrated systems, which may open the way to thousands cores chips. Silicon dies containing processing elements are stacked and connected by vertical wires called Through-Silicon-Vias. In 3D chips, interconnecting an increasing number of processing elements requires a scalable high-performance interconnect solution: the 3D Network-on-Chip. Despite the advantages of 3D integration, testing, reliability and yield remain the major challenges for 3D NoC-based systems. In this thesis, the TSV interconnect test issue is addressed by an off-line Interconnect Built-In Self-Test (IBIST) strategy that detects both structural (i.e. opens, shorts) and parametric faults (i.e. delays and delay due to crosstalk). The IBIST circuitry implements a novel algorithm based on the aggressor-victim scenario and alleviates limitations of existing strategies. The proposed Kth-aggressor fault (KAF) model assumes that the aggressors of a victim TSV are neighboring wires within a distance given by the aggressor order K. Using this model, TSV interconnect tests of inter-die 3D NoC links may be performed for different aggressor order, reducing test times and circuitry complexity. In 3D NoCs, TSV permanent and transient faults can be mitigated at different abstraction levels. In this thesis, several error resilience schemes are proposed at data link and network levels. For transient faults, 3D NoC links can be protected using error correction codes (ECC) and retransmission schemes using error detection (Automatic Retransmission Query) and correction codes (i.e. Hybrid error correction and retransmission).For transients along a source-destination path, ECC codes can be implemented at network level (i.e. Network-level Forward Error Correction). Data link solutions also include TSV repair schemes for faults due to fabrication processes (i.e. TSV-Spare-and-Replace and Configurable Serial Links) and aging (i.e. Interconnect Built-In Self-Repair and Adaptive Serialization) defects. At network-level, the faulty inter-die links of 3D mesh NoCs are repaired by implementing a TSV fault-tolerant routing algorithm. Although single-level solutions can achieve the desired yield / reliability targets, error mitigation can be realized by a combination of approaches at several abstraction levels. To this end, multi-level error resilience strategies have been proposed. Experimental results show that there are cases where this multi-layer strategy pays-off both in terms of cost and performance. Unfortunately, one-fits-all solution does not exist, as each strategy has its advantages and limitations. For system designers, it is very difficult to assess early in the design stages the costs and the impact on performance of error resilience. Therefore, an error resilience exploration (ERX) methodology is proposed for 3D NoCs.SAVOIE-SCD - Bib.électronique (730659901) / SudocGRENOBLE1/INP-Bib.électronique (384210012) / SudocGRENOBLE2/3-Bib.électronique (384219901) / SudocSudocFranceF

    A Framework and Protocol for Dynamic Management of Fault Tolerant Systems in Harsh Environments

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    Robots can be used to deal with hazardous materials like nuclear waste. Unfortunately, electronic components are also susceptible to radiation effects. Current proposals to tackle this issue solve only parts of the problems for the specific scenarios and the specific types of radiation. At the same time, current computational devices should provide run-time capabilities to monitor and adapt to different situations. In this paper, we target a possible solution presenting a framework which provides the flexibility to employ fault-tolerant techniques on distributed systems. As proof of concept, we target a fault-tolerant technique to extend the operating time of systems in harsh environments. Results show a very low overhead, of few microseconds, to execute a majority voter with replicated tasks
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