Surrogate-Based Design Optimization of Multi-Band Antenna

In this work, design optimization process of a multi-band antenna via the use of artificial neural network (ANN) based surrogate model and meta-heuristic optimizers are studied. For this mean, first, by using Latin-Hyper cube sampling method, a data set based on 3D full wave electromagnetic (EM) simulator is generated to train an ANN-based model. By using the ANNbased surrogate model and a meta-heuristic optimizer invasive weed optimization (IWO), design optimization of a multi-band antenna for (1) 2.4-3.6 GHz for ISM, LTE, and 5G sub-frequencies, and (2) 9-10 GHz for X-band applications is aimed. The obtained results are compared with the measured and simulated results of 3D EM simulation tool. Results show that the proposed methodology provides a computationally efficient design optimization process for design optimization of multiband antennas. © 2022 Applied Computational Electromagnetics Society (ACES). All rights reserved

3-D Metamaterials: Trends on Applied Designs, Computational Methods and Fabrication Techniques

This work was funded in part by the Predoctoral Grant FPU18/01965 and in part by the financial support of BBVA Foundation through a project belonging to the 2021 Leonardo Grants for Researchers and Cultural Creators, BBVA Foundation. The BBVA Foundation accepts no responsibility for the opinions, statements, and contents included in the project and/or the results thereof, which are entirely the responsibility of the authors.Metamaterials are artificially engineered devices that go beyond the properties of conventional materials in nature. Metamaterials allow for the creation of negative refractive indexes; light trapping with epsilon-near-zero compounds; bandgap selection; superconductivity phenomena; non-Hermitian responses; and more generally, manipulation of the propagation of electromagnetic and acoustic waves. In the past, low computational resources and the lack of proper manufacturing techniques have limited attention towards 1-D and 2-D metamaterials. However, the true potential of metamaterials is ultimately reached in 3-D configurations, when the degrees of freedom associated with the propagating direction are fully exploited in design. This is expected to lead to a new era in the field of metamaterials, from which future high-speed and low-latency communication networks can benefit. Here, a comprehensive overview of the past, present, and future trends related to 3-D metamaterial devices is presented, focusing on efficient computational methods, innovative designs, and functional manufacturing techniques.Predoctoral Grant FPU18/01965BBVA Foundatio

HIGH-PERFORMANCE PERIODIC ANTENNAS WITH HIGH ASPECT RATIO VERTICAL FEATURES AND LARGE INTERCELL CAPACITANCES FOR MICROWAVE APPLICATIONS

Modern communications systems are evolving rapidly to address the demand for data exchange, a fact which imposes stringent requirements on the design process of their RF and antenna front-ends. The most crucial pressure on the antenna front-end is the need for miniaturized design solutions while maintaining the desired radiation performance. To satisfy this need, this thesis presents innovative types of periodic antennas, including electromagnetic bandgap (EBG) antennas, which are distinguished in two respects. First, the periodic cells contain thick metal traces, contrary to the conventional thin-trace cells. Second, such thick traces contain very narrow gaps with very tall sidewalls, referred to as high aspect ratio (HAR) gaps. When such cells are used in the structure of the proposed periodic antennas, the high capacitance of HAR gaps decreases the resonance frequency, mitigates conduction loss, and thus, yields considerably small high efficiency antennas. For instance, one of the sample antenna designs with only two EBG cells offers a very small XYZ volume of 0.25λ×0.28λ×0.037λ with efficiency of 83%. Also, a circularly polarized HAR EBG antenna is presented which has a footprint as small as 0.26λ×0.29λ and efficiency as high as 94%. The main analysis method developed in this thesis is a combination of numerical and mathematical analyses and is referred to as HFSS/Bloch method. The numerical part of this method is conducted using a High Frequency Structure Simulator (HFSS), and the mathematical part is based on the classic Bloch theory. The HFSS/Bloch method acts as the mainstay of the thesis and all designs are built upon the insight provided by this method. A circuit model using transmission line (TL) theory is also developed for some of the unit cells and antennas. The HFSS/Bloch perspective results in a HAR EBG TL with radiation properties, a fragment of which (2 to 6 cells) is introduced as a novel antenna, the self-excited EBG resonator antenna (SE-EBG-RA). Open (OC) and short circuited (SC) versions of this antenna are studied and the inherently smaller size of the SC version is demonstrated. Moreover, the possibility of employing the SE-EBG-RA as the element of a series-fed array structure is investigated and some sample high-efficiency, flat array antennas are rendered. A microstrip antenna is also developed, the structure of which is composed of 3×3 unit cells and shows fast-wave behaviors. Most antenna designs are resonant in nature; however, in one case, a low-profile efficient leaky-wave antenna with scanning radiation pattern is proposed. Several antenna prototypes are fabricated and tested to validate the analyses and designs. As the structures are based on tall metal traces, two relevant fabrication methods are considered, including CNC machining and deep X-ray lithography (DXRL). Hands-on experiments provide an outlook of possible future DXRL fabricated SE-EBG-RAs

Technological Integration in Printed Electronics

Conventional electronics requires the use of numerous deposition techniques (e.g. chemical vapor deposition, physical vapor deposition, and photolithography) with demanding conditions like ultra-high vacuum, elevated temperature and clean room facilities. In the last decades, printed electronics (PE) has proved the use of standard printing techniques to develop electronic devices with new features such as, large area fabrication, mechanical flexibility, environmental friendliness and—potentially—cost effectiveness. This kind of devices is especially interesting for the popular concept of the Internet of Things (IoT), in which the number of employed electronic devices increases massively. Because of this trend, the cost and environmental impact are gradually becoming a substantial issue. One of the main technological barriers to overcome for PE to be a real competitor in this context, however, is the integration of these non-conventional techniques between each other and the embedding of these devices in standard electronics. This chapter summarizes the advances made in this direction, focusing on the use of different techniques in one process flow and the integration of printed electronics with conventional systems

Miniaturization and Optimization of Electrically Small Antennas, with Investigation into Emergent Fabrication Techniques

With the paradigm shift in personal communications favouring wireless over wired, the demand for efficient, low-cost, and compact antennas is booming. The proliferation of mobile electronic devices (laptops and tablets, fitness trackers, ‘smart’ phones and watches), together with the desire for longer battery life, poses a unique challenge to antenna designers; there is an unavoidable trade-off between miniaturization and performance (in terms of range and efficiency). The size of an antenna is inherently linked to the wavelengths(s) of the electromagnetic waves that it must transmit and/or receive. Due to real-estate pressures, most modern antennas found in electronics are classed as electrically small, i.e. operating at wavelength(s) many times greater than their largest dimension. Theory dictates that the best possible compromise between size and performance is achievable when an antenna fully occupies a volume, the radius of which is defined by an imaginary sphere circumscribing its largest dimension. This Thesis demonstrates the design and optimization of low-cost, easy-to-fabricate, electrically small antennas through the integration of novel digitated structures into a family of antennas known as inverted-F. The effects of these digitated structures are catalogued using simulated models and measured prototypes throughout. Whereas the limitations of traditional industrial processes might once have constrained the imaginations of antenna designers, there is now tremendous potential in successful exploitation of emergent manufacturing processes – such as additive manufacturing (or 3D printing) – to realize complex, voluminous antenna designs. This Thesis also presents pioneering measured results for three-dimensional, electrically small antennas fabricated using powder bed fusion additive manufacturing. The technology is demonstrated to be well suited for prototyping, with recommendations provided for further maturation. It is hoped that these promising early results spur further investigation and unleash bold new avenues for a new class of efficient, low-cost, and compact antennas

Modulated Microwave Retro-reflectors and Their Applications

This work seeks to investigate the viability of establishing communications links using modulated microwave reflectors, and explores potential application areas. A primary and underlying objective has been to combine modulation of radar cross section (RCS) with the wide-angle RCS response of a microwave retro-reflector so as to yield a transponder which imparts information content on the reflected spectrum. Since the RCS is electrically large, the communications link is directive and yet the transponder is not a transmitter of microwave energy and hence has modest power needs. The microwave retro-array was quickly identified as the most promising structure to achieve these aims, and hence the further objectives of the work have been to investigate this structure and fabricate working prototypes so as to: • achieve a manufacturable structure. • perform measurements to compare with theoretical models of behaviour. • explore the limits of performance, and seek to expand them. • identify applications and markets. • explore and pursue such related discoveries that may occur. All the above aims have been explored to some extent, and the findings have been reported in the body of the thesis. The background and historical context is discussed in chapter 1, while chapter 2 reports on the construction and characterisation of 16- element modulated retro-array prototypes operating at a 2.5 GHz carrier frequency. The applied nature of this work is extended in chapters 3 and 4 to printed integrated circuits for passive transponders, and the scaling of these methods to frequencies around 9.2 GHz. Theoretical models for the properties of much larger arrays are presented in chapter 5, and range finding applications and results presented in chapter 6. Two applications are then discussed for which the required array dimensions are estimated, before closing with conclusions and suggestions for future work

A Digital Manufacturing Process For Three-Dimensional Electronics

Additive manufacturing (AM) offers the ability to produce devices with a degree of three-dimensional complexity and mass customisation previously unachievable with subtractive and formative approaches. These benefits have not transitioned into the production of commercial electronics that still rely on planar, template-driven manufacturing, which prevents them from being tailored to the end user or exploiting conformal circuitry for miniaturisation. Research into the AM fabrication of 3D electronics has been demonstrated; however, because of material restrictions, the durability and electrical conductivity of such devices was often limited. This thesis presents a novel manufacturing approach that hybridises the AM of polyetherimide (PEI) with chemical modification and selective light-based synthesis of silver nanoparticles to produce 3D electronic systems. The resulting nanoparticles act as a seed site for the electroless deposition of copper. The use of high-performance materials for both the conductive and dielectric elements created devices with the performance required for real-world applications. For printing PEI, a low-cost fused filament fabrication (FFF); also known as fused deposition modelling (FDM), printer with a unique inverted design was developed. The orientation of the printer traps hot air within a heated build environment that is open on its underside allowing the print head to deposit the polymer while keeping the sensitive components outside. The maximum achievable temperature was 120 °C and was found to reduce the degree of warping and the ultimate tensile strength of printed parts. The dimensional accuracy was, on average, within 0.05 mm of a benchmark printer and fine control over the layer thickness led to the discovery of flexible substrates that can be directly integrated into rigid parts. Chemical modification of the printed PEI was used to embed ionic silver into the polymer chain, sensitising it to patterning with a 405 nm laser. The rig used for patterning was a re-purposed vat-photopolymerisation printer that uses a galvanometer to guide the beam that is focused to a spot size of 155 µm at the focal plane. The positioning of the laser spot was controlled with an open-sourced version of the printers slicing software. The optimal laser patterning parameters were experimentally validated and a link between area-related energy density and the quality of the copper deposition was found. In tests where samples were exposed to more than 2.55 J/cm^2, degradation of the polymer was experienced which produced blistering and delamination of the copper. Less than 2.34 J/cm^2 also had negative effect and resulted in incomplete coverage of the patterned area. The minimum feature resolution produced by the patterning setup was 301 µm; however, tests with a photomask demonstrated features an order of magnitude smaller. The non-contact approach was also used to produce conformal patterns over sloped and curved surfaces. Characterisation of the copper deposits found an average thickness of 559 nm and a conductivity of 3.81 × 107 S/m. Tape peel and bend fatigue testing showed that the copper was ductile and adhered well to the PEI, with flexible electronic samples demonstrating over 50,000 cycles at a minimum bend radius of 6.59 mm without failure. Additionally, the PEI and copper combination was shown to survive a solder reflow with peak temperatures of 249°C. Using a robotic pick and place system a test board was automatically populated with surface mount components as small as 0201 resistors which were affixed using high-temperature, Type-V Tin-Silver-Copper solder paste. Finally, to prove the process a range of functional demonstrators were built and evaluated. These included a functional timer circuit, inductive wireless power coils compatible with two existing standards, a cylindrical RF antenna capable of operating at several frequencies below 10 GHz, flexible positional sensors, and multi-mode shape memory alloy actuators

Origami Reconfigurable Electromagnetic Systems

With the ever-increasing demand for wireless communications, there is a great need for efficient designs of electromagnetic systems. Reconfigurable electromagnetic systems are very useful because such designs can provide multi-functionality and support different services. The geometrical topology of an electromagnetic element is very important as it determines the element’s RF performance characteristics. Origami geometries have significant advantages for launch-and-carry electromagnetic devices where devices need to fold in order to miniaturize their size during launch and unfold in order to operate after the platform has reached orbit. This dissertation demonstrates a practical process for designing reconfigurable electromagnetic devices using origami structures. Four different origami structures are studied and the integrated Mathematical-Computational-Electromagnetic models of origami antennas, origami reflectors and origami antenna arrays are developed and analyzed. These devices provide many unique capabilities compared with the traditional designs, such as band-switching, frequency tuning, polarization adjustment and mode reconfigurability. Prototypes are also manufactured to validate the performances of the designs. These designs change their geometry naturally, and they can be compactly packaged into small volume, which make them very suitable for spaceborne and satellite communication. Origami antennas and origami electromagnetics are expected to impact a variety of applications related to communications, surveillance and sensing

Analysis and Design of Low-Cost Waveguide Filters for Wireless Communications

The area of research of this thesis is built around advanced waveguide filter structures. Waveguide filters and the waveguide technology in general are renowned for high power capacity, low losses and excellent electromagnetic shielding. Waveguide filters are important components in fixed wireless communications as well as in satellite and radar systems. Furthermore, their advantages and utilization become even greater with increase in frequency, which is a trend in modern communication systems because upper frequency bands offer larger channel capacities. However, waveguide filters are relatively bulky and expensive. To comply with more and more demanding miniaturization and cost-cutting requirements, compactness and economical design represent some of the main contemporary focuses of interest. Approaches that are used to achieve this include use of planar inserts to build waveguide discontinuities, additive manufacturing and substrate integration. At the same time, waveguide filters still need to satisfy opposed stringent requirements like small insertion loss, high selectivity and multiband operation. Another difficulty that metal waveguide components face is integration with other circuitry, especially important when solid-state active devices are included. Thus, improvements of interconnections between waveguide and other transmission interfaces are addressed too. The thesis elaborates the following aspects of work: Further analysis and improved explanations regarding advanced waveguide filters with E-plane inserts developed by the Wireless Communications Research Group, using both cross coupled resonators and extracted pole sections (Experiments with higher filter orders, use of tuning screws, degrees of freedom in design, etc. Thorough performance comparison with competing filter technologies) - Proposing novel E-plane filter sections with I-shaped insets - Extension of the E-plane filtering structures with metal fins to new compact dual band filters with high frequency selectivity and miniaturized diplexers. - Introduction of easy-to-build waveguide filters with polymer insert frames and high-performance low-profile cavity filters, taking advantage of enhanced fabrication capabilities when using additive manufacturing - Developing new substrate integrated filters, as well as circuits used to transfer signals between different interfaces Namely, these are substrate integrated waveguide to metal waveguide planar transitions that do not require any modifications of the metal waveguides. Such novel transitions have been designed both for single and orthogonal signal polarizations