Index to nasa tech briefs, issue number 2

Annotated bibliography on technological innovations in NASA space program

Apollo experience report guidance and control systems: Lunar module abort guidance system

The history of a unique development program that produced an operational fixed guidance system of inertial quality is presented. Each phase of development, beginning with requirement definition and concluding with qualification and testing, is addressed, and developmental problems are emphasized. Software generation and mission operations are described, and specifications for the inertial reference unit are included, as are flight performance results. Significant program observations are noted

Integrated reference circuits for low-power capacitive sensor interfaces

This thesis consists of nine publications and an overview of the research topic, which also summarizes the work. The research described in this thesis concentrates on the design of low-power sensor interfaces for capacitive 3-axis micro-accelerometers. The primary goal throughout the thesis is to optimize power dissipation. Because the author made the main contribution to the design of the reference and power management circuits required, the overview part is dominated by the following research topics: current, voltage, and temperature references, frequency references, and voltage regulators. After an introduction to capacitive micro-accelerometers, the work describes the typical integrated readout electronics of a capacitive sensor on the functional level. The readout electronics can be divided into four different functional parts, namely the sensor readout itself, signal post-processing, references, and power management. Before the focus is shifted to the references and further to power management, different ways to realize the sensor readout are briefly discussed. Both current and voltage references are required in most analog and mixed-signal systems. A bandgap voltage reference, which inherently uses at least one current reference, is practical for the generation of an accurate reference voltage. Very similar circuit techniques can be exploited when implementing a temperature reference, the need for which in the sensor readout may be justified by the temperature compensation, for example. The work introduces non-linear frequency references, namely ring and relaxation oscillators, which are very suitable for the generation of the relatively low-frequency clock signals typically needed in the sensor interfaces. Such oscillators suffer from poor jitter and phase noise performance, the quantities of which also deserve discussion in this thesis. Finally, the regulation of the supply voltage using linear regulators is considered. In addition to extending the battery life by providing a low quiescent current, the regulator must be able to supply very low load currents and operate without off-chip capacitors

High performance readout circuits and devices for Lorentz force resonant CMOS-MEMS magnetic sensors

In the last decades, sensing capabilities of martphones have greatly improved since the early mobile phones of the 90’s. Moreover, wearables and the automotive industry require increasing electronics and sensing sophistication. In such echnological advance, Micro Electro Mechanical Systems (MEMS) have played an important role as accelerometers and gyroscopes were the first sensors based on MEMS technology massively introduced in the market. In contrast, it still does not exist a commercial MEMS-based compass, even though Lorentz force MEMS magnetometers were first proposed in the late 90’s. Currently, Lorentz force MEMS magnetometers have been under the spotlight as they can offer an integrated solution to nowadays sensing power. As a consequence, great advances have been achieved, but various bottlenecks limit the introduction of Lorentz force MEMS compasses in the market. First, current MEMS magnetometers require high current consumption and high biasing voltages to achieve good sensitivities. Moreover, even though devices with excellent performance and sophistication are found in the literature, there is still a lack of research on the readout electronic circuits, specially in the digital signal processing, and closed loop control. Second, most research outcomes rely on custom MEMS fabrication rocesses to manufacture the devices. This is the same approach followed in current commercial MEMS, but it requires different fabrication processes for the electronics and the MEMS. As a consequence, manufacturing cost is high and sensor performance is affected by the MEMS-electronics interface parasitics. This dissertation presents potential solutions to these issues in order to pave the road to the commercialization of Lorentz force MEMS compasses. First, a complete closed loop, digitally controlled readout system is proposed. The readout circuitry, implemented with off-the-shelf commercial components, and the digital control, on an FPGA, are proposed as a proof of concept of the feasibility, and potential benefits, of such architecture. The proposed system has a measured noise of 550 nT / vHz while the MEMS is biased with 300 µA rms and V = 1 V . Second, various CMOS-MEMS magnetometers have been designed using the BEOL part of the TSMC and SMIC 180 nm standard CMOS processes, and wet and vapor etched. The devices measurement and characterisation is used to analyse the benefits and drawbacks of each design as well as releasing process. Doing so, a high volume manufacturing viability can be performed. Yield values as high as 86% have been obtained for one device manufactured in a SMIC 180 nm full wafer run, having a sensitivity of 2.82 fA/µT · mA and quality factor Q = 7.29 at ambient pressure. While a device manufactured in TSMC 180 nm has Q = 634.5 and a sensitivity of 20.26 fA/µT ·mA at 1 mbar and V = 1 V. Finally, an integrated circuit has been designed that contains all the critical blocks to perform the MEMS signal readout. The MEMS and the electronics have been manufactured using the same die area and standard TSMC 180 nm process in order to reduce parasitics and improve noise and current consumption. Simulations show that a resolution of 8.23 µT /mA for V = 1 V and BW = 10 Hz can be achieved with the designed device.En les últimes dècades, tenint en compte els primers telèfons mòbils dels anys 90, les capacitats de sensat dels telèfons intel·ligents han millorat notablement. A més, la indústria automobilística i de wearables necessiten cada cop més sofisticació en el sensat. Els Micro Electro Mechanical Systems (MEMS) han tingut un paper molt important en aquest avenç tecnològic, ja que acceleròmetres i giroscopis varen ser els primers sensors basats en la tecnologia MEMS en ser introduïts massivament al mercat. En canvi, encara no existeix en la indústria una brúixola electrònica basada en la tecnologia MEMS, tot i que els magnetòmetres MEMS varen ser proposats per primera vegada a finals dels anys 90. Actualment, els magnetòmetres MEMS basats en la força de Lorentz són el centre d'atenció donat que poden oferir una solució integrada a les capacitats de sensat actuals. Com a conseqüència, s'han aconseguit grans avenços encara que existeixen diversos colls d'ampolla que encara limiten la introducció al mercat de brúixoles electròniques MEMS basades en la força de Lorentz. Per una banda, els agnetòmetres MEMS actuals necessiten un consum de corrent i un voltatge de polarització elevats per aconseguir una bona sensibilitat. A més, tot i que a la literatura hi podem trobar dispositius amb rendiments i sofisticació excel·lents, encara existeix una manca de recerca en el circuit de condicionament, especialment de processat digital i control del llaç. Per altra banda, moltes publicacions depenen de processos de fabricació de MEMS fets a mida per fabricar els dispositius. Aquesta és la mateixa aproximació que s'utilitza actualment en la indústria dels MEMS, però té l'inconvenient que requereix processos de fabricació diferents pels MEMS i l’electrònica. Per tant, el cost de fabricació és alt i el rendiment del sensor queda afectat pels paràsits en la interfície entre els MEMS i l'electrònica. Aquesta tesi presenta solucions potencials a aquests problemes amb l'objectiu d'aplanar el camí a la comercialització de brúixoles electròniques MEMS basades en la força de Lorentz. En primer lloc, es proposa un circuit de condicionament complet en llaç tancat controlat digitalment. Aquest s'ha implementat amb components comercials, mentre que el control digital del llaç s'ha implementat en una FPGA, tot com una prova de concepte de la viabilitat i beneficis potencials que representa l'arquitectura proposada. El sistema presenta un soroll de 550 nT / vHz quan el MEMS està polaritzat amb 300 µArms i V = 1 V . En segon lloc, s'han dissenyat varis magnetòmetres CMOS-MEMS utilitzant la part BEOL dels processos CMOS estàndard de TSMC i SMIC 180 nm, que després s'han alliberat amb líquid i gas. La mesura i caracterització dels dispositius s’ha utilitzat per analitzar els beneficis i inconvenients de cada disseny i procés d’alliberament. D'aquesta manera, s'ha pogut realitzar un anàlisi de la viabilitat de la seva fabricació en massa. S'han obtingut valors de yield de fins al 86% per un dispositiu fabricat amb SMIC 180 nm en una oblia completa, amb una sensibilitat de 2.82 fA/µT · mA i un factor de qualitat Q = 7.29 a pressió ambient. Per altra banda, el dispositiu fabricat amb TSMC 180 nm presenta una Q = 634.5 i una sensibilitat de 20.26 fA/µT · mA a 1 mbar amb V = 1 V. Finalment, s'ha dissenyat un circuit integrat que conté tots els blocs per a realitzar el condicionament de senyal del MEMS. El MEMS i l'electrònica s'han fabricat en el mateix dau amb el procés estàndard de TSMC 180 nm per tal de reduir paràsits i millorar el soroll i el consum de corrent. Les simulacions mostren una resolució de 8.23 µT /mA amb V = 1 V i BW = 10 Hz pel dispositiu dissenyat

Design of agile signal conditioning circuits for microelectromechanical sensors

Microelectromechanical systems (MEMS) are used in many applications to detect physical parameters and convert them to an electrical signal. The output of MEMS-based transducers is usually not suitable to be directly processed in the digital or the analog domain, and they could be as small as femto farads in capacitive sensing and micro volts in resistive sensing. Consequently, high sensitivity signal conditioning circuits are essential. In this thesis, it is shown that both the noise and input capacitance are important parameters to ensure optimal capacitive sensing. The dominant noise source in MEMS conditioning circuits is flicker noise, and one of the best methods to mitigate flicker noise is the chopping technique. Three different chopping techniques are considered: single chopper amplifier (SCA), dual chopper amplifier (DCA), and two-stage single chopper amplifier (TCA). Also, their sensitivity and power consumption based on the total gain and sensing capacitance are extracted. It is shown that the distribution of gain between the two stages in the DCA and TCA has a significant effect on the sensitivity, and, based on this distribution, the sensitivity and power consumption change significantly. For small sensor capacitances, the highest sensitivity could be achieved by a DCA because of its ability to decrease the noise floor and the input sensor capacitance simultaneously. A novel DCA is proposed to reach higher sensitivity and reduced power consumption. In this DCA, two supply voltages are utilized, and the second stage is composed of two parallel paths that improve the SNR and provide two gain settings. This circuit is fabricated in the GlobalFoundries 0.13 μm CMOS technology. The measurement results show a power consumption of 2.66 μW for the supply voltage of 0.7 V and of 3.26 μW for the supply voltage of 1.2 V. The single path DCA has a gain of 34 dB with bandwidth of 4 kHz and input noise floor of 25 nV/√Hz. The dual path DCA has a gain of 38 dB with bandwidth of 3 kHz and input noise floor of 40 nV/√Hz. To be able to detect the signal near DC frequencies, another circuit is proposed which has a configurable bandwidth and a sub-μHz noise corner frequency. This circuit is composed of three stages, and three chopping frequencies are used to mitigate the flicker noise of the three stages. The simulated circuit is designed in the GlobalFoundries 0.13 μm CMOS technology with supply voltages of 0.4 V and 1.2 V. The total power consumption is of 6.7 μW. A gain of 68 dB and bandwidths of 1, 10, 100 and 1000 Hz are achieved. The input referred noise floor is of 20.5 nV/√Hz and the design attains a good power efficiency factor of 4.0. In the capacitive mode, the noise floor is of 3.6 zF for a 100 fF capacitance sensor

System design of a low-power three-axis underdamped MEMS accelerometer with simultaneous electrostatic damping control

Recently, consumer electronics industry has known a spectacular growth that would have not been possible without pushing the integration barrier further and further. Micro Electro Mechanical Systems (MEMS) inertial sensors (e.g. accelerometers, gyroscopes) provide high performance, low power, low die cost solutions and are, nowadays, embedded in most consumer applications. In addition, the sensors fusion has become a new trend and combo sensors are gaining growing popularity since the co-integration of a three-axis MEMS accelerometer and a three-axis MEMS gyroscope provides complete navigation information. The resulting device is an Inertial measurement unit (IMU) able to sense multiple Degrees of Freedom (DoF). Nevertheless, the performances of the accelerometers and the gyroscopes are conditioned by the MEMS cavity pressure: the accelerometer is usually a damped system functioning under an atmospheric pressure while the gyroscope is a highly resonant system. Thus, to conceive a combo sensor, aunique low cavity pressure is required. The integration of both transducers within the same low pressure cavity necessitates a method to control and reduce the ringing phenomena by increasing the damping factor of the MEMS accelerometer. Consequently, the aim of the thesis is the design of an analog front-end interface able to sense and control an underdamped three-axis MEMSaccelerometer. This work proposes a novel closed-loop accelerometer interface achieving low power consumption The design challenge consists in finding a trade-off between the sampling frequency, the settling time and the circuit complexity since the sensor excitation plates are multiplexed between the measurement and the damping phases. In this context, a patenteddamping sequence (simultaneous damping) has been conceived to improve the damping efficiency over the state of the art approach performances (successive damping). To investigate the feasibility of the novel electrostatic damping control architecture, several mathematical models have been developed and the settling time method is used to assess the damping efficiency. Moreover, a new method that uses the multirate signal processing theory and allows the system stability study has been developed. This very method is used to conclude on the loop stability for a certain sampling frequency and loop gain value. Next, a 0.18μm CMOS implementation of the entire accelerometer signal chain is designed and validated

Sensor Development for Physiological and Environmental Monitoring

abstract: The sensor industry is a growing industry that has been predicted by Allied Market Research to be a multi-billion industry by 2022. One of the many key drives behind this rapid growth in the sensor industry is the increase incorporation of sensors into portable electrical devices. The value for sensor technologies are increased when the sensors are developed into innovative measuring system for application uses in the Aerospace, Defense, and Healthcare industries. While sensors are not new, their increased performance, size reduction, and decrease in cost has opened the door for innovative sensor combination for portable devices that could be worn or easily moved around. With this opportunity for further development of sensor use through concept engineering development, three concept projects for possible innovative portable devices was undertaken in this research. One project was the development of a pulse oximeter devise with fingerprint recognition. The second project was prototyping a portable Bluetooth strain gage monitoring system. The third project involved sensors being incorporated onto flexible printed circuit board (PCB) for improved comfort of wearable devices. All these systems were successfully tested in lab.Dissertation/ThesisMasters Thesis Engineering 201

NASA Tech Briefs, January 1995

Topics include: Sensors; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences; Books and Report

Cumulative index to NASA Tech Briefs, 1963-1965

Annotated bibliography of NASA technical briefs on electrical, energy sources, materials, life sciences, and mechanical informatio