Bibliometric Review of NoC Router Optimization

Network on chip (NoC) has been proposed as an emerging solution for scalability and performance demands of next generation System on Chip (SoC). NoC provides a solution for the bus based interconnection issue of SoC, where large numbers of Intellectual Property modules (IP) are integrated on a single chip for better performance. The NoC has several advantages such as scalability, low latency and low power consumption, high bandwidth over dedicated wires and buses. Interconnections between multiple chip cores have a significant impact on the communication and performance of the chip design in terms of region, latency, throughput and power. In the NoC architecture, the router is a dominant component that significantly affects the performance of the NoC. NoC router architectures evolved since the year 2002 and progress in the domain pertaining to the optimization in the NoC router architectures has been discussed. The key objective of this bibliometric review is to understand the extent of the existing literature in the domain of performance efficient NoC router architectures. The bibliometric analysis is primarily based on data extracted from Scopus. It reveals that major contributions are done by researchers from USA, China followed by India in the form of conference, journals and articles publications. The major contribution is by the subject areas of Computer Science and Engineering followed by Mathematics and Material Science. The geographical analysis is done by using the GPS visualize tool. The clusters were created using Gephi

Cycle-accurate evaluation of reconfigurable photonic networks-on-chip

There is little doubt that the most important limiting factors of the performance of next-generation Chip Multiprocessors (CMPs) will be the power efficiency and the available communication speed between cores. Photonic Networks-on-Chip (NoCs) have been suggested as a viable route to relieve the off- and on-chip interconnection bottleneck. Low-loss integrated optical waveguides can transport very high-speed data signals over longer distances as compared to on-chip electrical signaling. In addition, with the development of silicon microrings, photonic switches can be integrated to route signals in a data-transparent way. Although several photonic NoC proposals exist, their use is often limited to the communication of large data messages due to a relatively long set-up time of the photonic channels. In this work, we evaluate a reconfigurable photonic NoC in which the topology is adapted automatically (on a microsecond scale) to the evolving traffic situation by use of silicon microrings. To evaluate this system's performance, the proposed architecture has been implemented in a detailed full-system cycle-accurate simulator which is capable of generating realistic workloads and traffic patterns. In addition, a model was developed to estimate the power consumption of the full interconnection network which was compared with other photonic and electrical NoC solutions. We find that our proposed network architecture significantly lowers the average memory access latency (35% reduction) while only generating a modest increase in power consumption (20%), compared to a conventional concentrated mesh electrical signaling approach. When comparing our solution to high-speed circuit-switched photonic NoCs, long photonic channel set-up times can be tolerated which makes our approach directly applicable to current shared-memory CMPs

Fault-tolerant vertical link design for effective 3D stacking

[EN] Recently, 3D stacking has been proposed to alleviate the memory bandwidth limitation arising in chip multiprocessors (CMPs). As the number of integrated cores in the chip increases the access to external memory becomes the bottleneck, thus demanding larger memory amounts inside the chip. The most accepted solution to implement vertical links between stacked dies is by using Through Silicon Vias (TSVs). However, TSVs are exposed to misalignment and random defects compromising the yield of the manufactured 3D chip. A common solution to this problem is by over-provisioning, thus impacting on area and cost. In this paper, we propose a fault-tolerant vertical link design. With its adoption, fault-tolerant vertical links can be implemented in a 3D chip design at low cost without the need of adding redundant TSVs (no over-provision). Preliminary results are very promising as the fault-tolerant vertical link design increases switch area only by 6.69% while the achieved interconnect yield tends to 100%.This work was supported by the Spanish MEC and MICINN, as well as European Comission FEDER funds, under Grants CSD2006-00046 and TIN2009-14475-C04. It was also partly supported by the project NaNoC (project label 248972) which is funded by the European Commission within the Research Programme FP7.Hernández Luz, C.; Roca Pérez, A.; Flich Cardo, J.; Silla Jiménez, F.; Duato Marín, JF. (2011). Fault-tolerant vertical link design for effective 3D stacking. IEEE Computer Architecture Letters. 10(2):41-44. https://doi.org/10.1109/L-CA.2011.17S414410

The Benefits of Using Clock Gating in the Design of Networks-on-Chip

Networks-on-chip (NoC) are critical to the design of complex multi-core system-on-chip (SoC) architectures. Since SoCs are characterized by a combination of high performance requirements and stringent energy constraints, NoCs must be realized with low-power design techniques. Since the use of semicustom design flow based on standard-cell technology libraries is essential to cope with the SoC design complexity challenges under tight time-to-market constraints, NoC must be implemented using logic synthesis. In this paper we analyze the major power reduction that clock gating can deliver when applied to the synthesis of a NoC in the context of a semi-custom automated design flow

Enabling System-Level Modeling of Variation-Induced Faults in Networks-on-Chip

Process Variation (PV) is increasingly threatening the reliability of Networks-on-Chips. Thus, various resilient router designs have been recently proposed and evaluated. However, these evaluations assume random fault distributions, which result in 52%--81% inaccuracy. We propose an accurate circuit-level fault-modeling tool, which can be plugged into any system-level NoC simulator, quantify the system-level impact of PV-induced faults at runtime, pinpoint fault-prone router components that should be protected, and accurately evaluate alternative resilient multi-core designs.GigaScale Systems Research CenterFocus Center Research Program. Focus Center for Circuit & System Solutions. Semiconductor Research Corporation. Interconnect Focus Cente

Thermal/performance trade-off in network-on-chip architectures

Multi-core architectures are a promising paradigm to exploit the huge integration density reached by high-performance systems. Indeed, integration density and technology scaling are causing undesirable operating temperatures, having net impact on reduced reliability and increased cooling costs. Dynamic Thermal Management (DTM) approaches have been proposed in literature to control temperature profile at run-time, while design-time approaches generally provide floorplan-driven solutions to cope with temperature constraints. Nevertheless, a suitable approach to collect performance, thermal and reliability metrics has not been proposed, yet. This work presents a novel methodology to jointly optimize temperature/performance trade-off in reliable high-performance parallel architectures with security constraints achieved by workload physical isolation on each core. The proposed methodology is based on a linear formal model relating temperature and duty-cycle on one side, and performance and duty-cycle on the other side. Extensive experimental results on real-world use-case scenarios show the goodness of the proposed model, suitable for design-time system-wide optimization to be used in conjunction with DTM technique

An Efficient Implementation of Distributed Routing Algorithms for NoCs

The design of NoCs for multi-core chips introduces new design constraints like power consumption, area, and ul-tra low latencies. Although 2D meshes are preferred, het-erogeneous blocks, fabrication faults, reliability issues, and chip virtualization may lead to the need of irregular topolo-gies or regions. In this situation, efficient routing becomes a challenge. Although the use of routing tables at switches is flexible, it does not scale in terms of latency and area due to its memory requirements. LBDR (Logic-Based Distributed Routing) is proposed as a new routing method that removes the need of using rout-ing tables at all. LBDR enables the implementation of many routing algorithms on most of the practical topologies we might find in the near future in a multi-core system. From an initial topology and routing algorithm, a set of three bits per switch/output port is computed. Evaluation results show that, by using a small logic, LBDR mimics the performance of routing algorithms when implemented with routing ta-bles, both in regular and irregular topologies.

Comparing energy and latency of asynchronous and synchronous NoCs for embedded SoCs

Journal ArticlePower consumption of on-chip interconnects is a primary concern for many embedded system-on-chip (SoC) applications. In this paper, we compare energy and performance characteristics of asynchronous (clockless) and synchronous network on-chip implementations, optimized for a number of SoC designs. We adapted the COSI-2.0 framework with ORION 2.0 router and wire models for synchronous network generation. Our own tool, ANetGen, specifies the asynchronous network by determining the topology with simulated-annealing and router locations with force-directed placement. It uses energy and delay models from our 65 nm bundled-data router design. SystemC simulations varied traffic burstiness using the self-similar b-model. Results show that the asynchronous network provided lower median and maximum message latency, especially under bursty traffic, and used far less router energy with a slight overhead for the interrouter wires