Fault simulation for structural testing of analogue integrated circuits

In this thesis the ANTICS analogue fault simulation software is described which provides a statistical approach to fault simulation for accurate analogue IC test evaluation. The traditional figure of fault coverage is replaced by the average probability of fault detection. This is later refined by considering the probability of fault occurrence to generate a more realistic, weighted test metric. Two techniques to reduce the fault simulation time are described, both of which show large reductions in simulation time with little loss of accuracy. The final section of the thesis presents an accurate comparison of three test techniques and an evaluation of dynamic supply current monitoring. An increase in fault detection for dynamic supply current monitoring is obtained by removing the DC component of the supply current prior to measurement

Voltage sensing based built-in current sensor for IDDQ test

Quiescent current leakage test of the VDD supply (IDDQ Test) has been proven an effective way to screen out defective chips in manufacturing of Integrated Circuits (IC). As technology advances, the traditional IDDQ test is facing more and more challenges. In this research, a practical built-in current sensor (BICS) is proposed and the design is verified by three generations of test chips. The BICS detects the signal by sensing the voltage drop on supply lines of the circuit under test (CUT). Then the sensor performs analog-to-digital conversion of the input signal using a stochastic process with scan chain readout. Self-calibration and digital chopping are used to minimize offset and low frequency noise and drift. This non-invasive procedure avoids any performance degradation of the CUT. The measurement results of test chips are presented. The sensor achieves a high IDDQ resolution with small chip area overhead. This will enable IDDQ of future technology generations

Design and debugging of multi-step analog to digital converters

With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process

Design, Fabrication and Veri cation of a Mixed-Signal XY Zone Monitoring Circuit and its Application to a Phase Lock Loop Circuit

El presente proyecto de final de carrera se centra en el diseño, análisis e implementación en silicio de una metodología de test/diagnosis basada en la comparación de firmas digitales generadas a partir de curvas de Lissajous. Se muestra su aplicación para testar la etapa de filtro de un circuito de bucle de enganche de fase (phase lock loop, PLL), así como los resultados experimentales de su implementación en tecnología CMOS de 65 nm. La obtención de las firmas digitales se consigue mediante el uso de un circuito monitor, el cual, a partir de la composición de dos señales periódicas del circuito a analizar, genera, para cada punto de la curva de Lissajous, un valor digital. La utilización de varios monitores con gurados de la manera adecuada permite una completa teselación del plano en diferentes zonas y por tanto, la generación de distintos códigos digitales (firma) a medida que la curva de Lissajous evoluciona en el tiempo. El test del circuito y/o diagnosis del posible defecto se realiza mediante la comparación de la signatura golden o sin defecto y la signatura generada por el circuito testado. Para la comparación de firmas se emplea el concepto de distancia de Hamming entre códigos a modo de métrica de discrepancia. A partir de los valores precalculados de la métrica para cada posible valor del defecto se consigue realizar la diagnosis de este para el parámetro en estudio. El trabajo se enmarca en el diseño de circuitos integrados de muy alta escala de integración usando una tecnología CMOS de actualidad (65 nm). Es por ello que se requieren técnicas de diseño analógico específicas, como lo son las estrategias centroidales para la elaboración de layouts o el correcto modelado de transistores nanométricos. Para esto último se hace uso del modelo Berkeley, el cual, debidamente ajustado a la tecnología empleada, proporciona aproximaciones muy aceptables y con relativa facilidad de uso. Con el objetivo de verificar la metodología de test/diagnosis propuesta, se hace uso de una aplicación Matlab que permite simular el comportamiento del circuito a testar en diferentes situaciones. Es posible excitar el circuito con distintas entradas, cambiar los parámetros de este, introducir defectos, o emplear distintos conjuntos de curvas para teselar el plano. La aplicación resulta fundamental para efectuar el proceso de diagnosis pues relaciona la cantidad de defecto con los valores de discrepancia obtenidos con la métrica definida. Finalmente, se presentan los resultados experimentales obtenidos con el chip fabricado. Se constata el correcto comportamiento de este y la validez de la metodología de test/diagnosis propuesta

Test estructural i predictiu per a circuits RF CMOS

En aquesta tesi s’ha desenvolupat una tècnica de test que permet testar un LNA i un mesclador, situats en el capçal RF d’un receptor CMOS, en una configuració de test semblant al mode normal de funcionament. La circuiteria necessària per a implementar aquesta tècnica consta d’un generador IF, per a generar el senyal IF de test, i d’un mesclador auxiliar, per a obtenir el senyal RF de test. Les observables de test escollides han estat l’amplitud de la tensió de sortida del mesclador i el component DC del corrent de consum. S’ha estudiat l’eficàcia de la tècnica de test proposada utilitzant les estratègies de test estructural i predictiu, mitjançant simulacions i mesures experimentals. La seva eficàcia és comparable a altres tècniques de test existents, però l’àrea addicional dedicada a la circuiteria test és inferior.En esta tesis se ha desarrollado una técnica de test que permite verificar un LNA y un mezclador, situados en el cabezal RF de un receptor CMOS, en una configuración de test similar al modo normal de funcionamiento. Los circuitos necesarios para implementar esta técnica son: un generador IF, que permite generar la señal IF de test, y un mezclador auxiliar, para obtener la señal RF de test. Las observables de test seleccionadas han sido la amplitud de la tensión de salida y la componente DC de la corriente de consumo. Se ha estudiado la eficacia de la técnica propuesta usando las estrategias de test estructural y predictiva, mediante simulaciones y medidas experimentales. Su eficacia es comparable a otras técnicas existentes, pero el área dedicada a la circuiteria de test es inferior.This PhD thesis develops a test technique intended for the RF front end of CMOS integrated receivers. This test technique allows testing individually the building blocks of the receiver in a sequential way. The test mode configuration of each block is similar to the normal mode operation. The auxiliary circuitry required to generate the test stimuli consists of an IF generator, which generates the IF test signal, and an auxiliary mixer that produces the RF test signal by mixing the IF test signal with the local oscillator signal. The test observables selected for the test are the voltage amplitude after the IF amplifier, and the DC component of the supply current in each block. The capability of the proposed test technique to perform structural and predictive test strategies has been validated by simulation and experimentally. Its efficiency is comparable to other existing techniques, but the silicon area overhead is lower

Constraint-driven RF test stimulus generation and built-in test

With the explosive growth in wireless applications, the last decade witnessed an ever-increasing test challenge for radio frequency (RF) circuits. While the design community has pushed the envelope far into the future, by expanding CMOS process to be used with high-frequency wireless devices, test methodology has not advanced at the same pace. Consequently, testing such devices has become a major bottleneck in high-volume production, further driven by the growing need for tighter quality control. RF devices undergo testing during the prototype phase and during high-volume manufacturing (HVM). The benchtop test equipment used throughout prototyping is very precise yet specialized for a subset of functionalities. HVM calls for a different kind of test paradigm that emphasizes throughput and sufficiency, during which the projected performance parameters are measured one by one for each device by automated test equipment (ATE) and compared against defined limits called specifications. The set of tests required for each product differs greatly in terms of the equipment required and the time taken to test individual devices. Together with signal integrity, precision, and repeatability concerns, the initial cost of RF ATE is prohibitively high. As more functionality and protocols are integrated into a single RF device, the required number of specifications to be tested also increases, adding to the overall cost of testing, both in terms of the initial and recurring operating costs. In addition to the cost problem, RF testing proposes another challenge when these components are integrated into package-level system solutions. In systems-on-packages (SOP), the test problems resulting from signal integrity, input/output bandwidth (IO), and limited controllability and observability have initiated a paradigm shift in high-speed analog testing, favoring alternative approaches such as built-in tests (BIT) where the test functionality is brought into the package. This scheme can make use of a low-cost external tester connected through a low-bandwidth link in order to perform demanding response evaluations, as well as make use of the analog-to-digital converters and the digital signal processors available in the package to facilitate testing. Although research on analog built-in test has demonstrated hardware solutions for single specifications, the paradigm shift calls for a rather general approach in which a single methodology can be applied across different devices, and multiple specifications can be verified through a single test hardware unit, minimizing the area overhead. Specification-based alternate test methodology provides a suitable and flexible platform for handling the challenges addressed above. In this thesis, a framework that integrates ATE and system constraints into test stimulus generation and test response extraction is presented for the efficient production testing of high-performance RF devices using specification-based alternate tests. The main components of the presented framework are as follows: Constraint-driven RF alternate test stimulus generation: An automated test stimulus generation algorithm for RF devices that are evaluated by a specification-based alternate test solution is developed. The high-level models of the test signal path define constraints in the search space of the optimized test stimulus. These models are generated in enough detail such that they inherently define limitations of the low-cost ATE and the I/O restrictions of the device under test (DUT), yet they are simple enough that the non-linear optimization problem can be solved empirically in a reasonable amount of time. Feature extractors for BIT: A methodology for the built-in testing of RF devices integrated into SOPs is developed using additional hardware components. These hardware components correlate the high-bandwidth test response to low bandwidth signatures while extracting the test-critical features of the DUT. Supervised learning is used to map these extracted features, which otherwise are too complicated to decipher by plain mathematical analysis, into the specifications under test. Defect-based alternate testing of RF circuits: A methodology for the efficient testing of RF devices with low-cost defect-based alternate tests is developed. The signature of the DUT is probabilistically compared with a class of defect-free device signatures to explore possible corners under acceptable levels of process parameter variations. Such a defect filter applies discrimination rules generated by a supervised classifier and eliminates the need for a library of possible catastrophic defects.Ph.D.Committee Chair: Chatterjee, Abhijit; Committee Member: Durgin, Greg; Committee Member: Keezer, David; Committee Member: Milor, Linda; Committee Member: Sitaraman, Sures

Quaternary River Erosion, Provenance, and Climate Variability in the NW Himalaya and Vietnam

The influence of Quaternary climate variation on sediment generation, storage, and transport in two mountainous Asian river basin was examined in the largest tributary to the upper Indus River in the Himalayan rain shadow, the Zanskar River basin (~15,000 km2), and the smaller, subtropical Song Gianh basin (\u3c3,500 km2) of central Vietnam. Spatial patterns of erosion in the Zanskar River Basin were established to quantify the dominant controls on Quaternary sedimentation in the Himalayan rain shadow on the edge of the Tibetan Plateau. Glacial erosion and precipitation along the High Himalaya together dominate sediment production and transport in the Zanskar River basin, in contrast to the monsoon-dominated frontal Himalaya and the arid plateau interior. Alluvial terrace document major phases of fluvial aggradation correlating with strong phases of monsoon and westerlies-derived precipitation during the Late Pleistocene (25–32 ka) and mid-Holocene (~6–8 ka), as similarly observed in the frontal Himalaya. Valley-fills in the Zanskar River Basin emphasize a long history of climate-modulated sediment buffering in the rain shadow. Results here indicate that only a modest proportion of stored volumes (40% of total) are exported to the trunk Indus River during the Holocene. The work further underscores that sediment buffering outside of low floodplain regions can be volumetrically significant to the total sediment flux. This work next explores the strongly monsoonal Song Gianh Basin of central Vietnam to better constrain how climate-driven erosional signals are transported and transformed downstream. Spatial patterns of erosion and dating of river terraces indicate that strong monsoonal rainfall drives modern sediment generation in the steep, upper reaches of the Song Gianh especially during the early Holocene (7.4–8.5 ka). Apparent contrast between sediment provenance proxies and younger terracing (medieval and 18–19th century) instead reflect high sediment flux related to agricultural disruption rather than in response to Holocene climatic change. Human-induced erosion inundates modern Song Gianh river sediment compositions with old, weathered soils. This implies that modern offshore sediment signals delivered by larger rivers may be strongly modified by human activities and so must be considered judiciously when used as analogs for the geologic record