A handheld high-sensitivity micro-NMR CMOS platform with B-field stabilization for multi-type biological/chemical assays

We report a micro-nuclear magnetic resonance (NMR) system compatible with multi-type biological/chemical lab-on-a-chip assays. Unified in a handheld scale (dimension: 14 x 6 x 11 cm³, weight: 1.4 kg), the system is capable to detect<100 pM of Enterococcus faecalis derived DNA from a 2.5 μL sample. The key components are a portable magnet (0.46 T, 1.25 kg) for nucleus magnetization, a system PCB for I/O interface, an FPGA for system control, a current driver for trimming the magnetic (B) field, and a silicon chip fabricated in 0.18 μm CMOS. The latter, integrated with a current-mode vertical Hall sensor and a low-noise readout circuit, facilitates closed-loop B-field stabilization (2 mT → 0.15 mT), which otherwise fluctuates with temperature or sample displacement. Together with a dynamic-B-field transceiver with a planar coil for micro-NMR assay and thermal control, the system demonstrates: 1) selective biological target pinpointing; 2) protein state analysis; and 3) solvent-polymer dynamics, suitable for healthcare, food and colloidal applications, respectively. Compared to a commercial NMR-assay product (Bruker mq-20), this platform greatly reduces the sample consumption (120x), hardware volume (175x), and weight (96x)

CMOS Design of Reconfigurable SoC Systems for Impedance Sensor Devices

La rápida evolución en el campo de los sensores inteligentes, junto con los avances en las tecnologías de la computación y la comunicación, está revolucionando la forma en que recopilamos y analizamos datos del mundo físico para tomar decisiones, facilitando nuevas soluciones que desempeñan tareas que antes eran inconcebibles de lograr.La inclusión en un mismo dado de silicio de todos los elementos necesarios para un proceso de monitorización y actuación ha sido posible gracias a los avances en micro (y nano) electrónica. Al mismo tiempo, la evolución de las tecnologías de procesamiento y micromecanizado de superficies de silicio y otros materiales complementarios ha dado lugar al desarrollo de sensores integrados compatibles con CMOS, lo que permite la implementación de matrices de sensores de alta densidad. Así, la combinación de un sistema de adquisición basado en sensores on-Chip, junto con un microprocesador como núcleo digital donde se puede ejecutar la digitalización de señales, el procesamiento y la comunicación de datos proporciona características adicionales como reducción del coste, compacidad, portabilidad, alimentación por batería, facilidad de uso e intercambio inteligente de datos, aumentando su potencial número de aplicaciones.Esta tesis pretende profundizar en el diseño de un sistema portátil de medición de espectroscopía de impedancia de baja potencia operado por batería, basado en tecnologías microelectrónicas CMOS, que pueda integrarse con el sensor, proporcionando una implementación paralelizable sin incrementar significativamente el tamaño o el consumo, pero manteniendo las principales características de fiabilidad y sensibilidad de un instrumento de laboratorio. Esto requiere el diseño tanto de la etapa de gestión de la energía como de las diferentes celdas que conforman la interfaz, que habrán de satisfacer los requisitos de un alto rendimiento a la par que las exigentes restricciones de tamaño mínimo y bajo consumo requeridas en la monitorización portátil, características que son aún más críticas al considerar la tendencia actual hacia matrices de sensores.A nivel de celdas, se proponen diferentes circuitos en un proceso CMOS de 180 nm: un regulador de baja caída de voltaje como unidad de gestión de energía, que proporciona una alimentación de 1.8 V estable, de bajo ruido, precisa e independiente de la carga para todo el sistema; amplificadores de instrumentación con una aproximación completamente diferencial, que incluyen una etapa de entrada de voltaje/corriente configurable, ganancia programable y ancho de banda ajustable, tanto en la frecuencia de corte baja como alta; un multiplicador para conformar la demodulación dual, que está embebido en el amplificador para optimizar consumo y área; y filtros pasa baja totalmente integrados, que actúan como extractores de magnitud de DC, con frecuencias de corte ajustables desde sub-Hz hasta cientos de Hz.<br /

Design and implementation of a multi-modal sensor with on-chip security

With the advancement of technology, wearable devices for fitness tracking, patient monitoring, diagnosis, and disease prevention are finding ways to be woven into modern world reality. CMOS sensors are known to be compact, with low power consumption, making them an inseparable part of wireless medical applications and Internet of Things (IoT). Digital/semi-digital output, by the translation of transmitting data into the frequency domain, takes advantages of both the analog and digital world. However, one of the most critical measures of communication, security, is ignored and not considered for fabrication of an integrated chip. With the advancement of Moore\u27s law and the possibility of having a higher number of transistors and more complex circuits, the feasibility of having on-chip security measures is drawing more attention. One of the fundamental means of secure communication is real-time encryption. Encryption/ciphering occurs when we encode a signal or data, and prevents unauthorized parties from reading or understanding this information. Encryption is the process of transmitting sensitive data securely and with privacy. This measure of security is essential since in biomedical devices, the attacker/hacker can endanger users of IoT or wearable sensors (e.g. attacks at implanted biosensors can cause fatal harm to the user). This work develops 1) A low power and compact multi-modal sensor that can measure temperature and impedance with a quasi-digital output and 2) a low power on-chip signal cipher for real-time data transfer

System-on-Package Low-Power Telemetry and Signal Conditioning unit for Biomedical Applications

Recent advancements in healthcare monitoring equipments and wireless communication technologies have led to the integration of specialized medical technology with the pervasive wireless networks. Intensive research has been focused on the development of medical wireless networks (MWN) for telemedicine and smart home care services. Wireless technology also shows potential promises in surgical applications. Unlike conventional surgery, an expert surgeon can perform the surgery from a remote location using robot manipulators and monitor the status of the real surgery through wireless communication link. To provide this service each surgical tool must be facilitated with smart electronics to accrue data and transmit the data successfully to the monitoring unit through wireless network. To avoid unwieldy wires between the smart surgical tool and monitoring units and to reap the benefit of excellent features of wireless technology, each smart surgical tool must incorporate a low-power wireless transmitter. Low-power transmitter with high efficiency is essential for short range wireless communication. Unlike conventional transmitters used for cellular communication, injection-locked transmitter shows greater promises in short range wireless communication. The core block of an injection-locked transmitter is an injection-locked oscillator. Therefore, this research work is directed towards the development of a low-voltage low-power injection-locked oscillator which will facilitate the development of a low-power injection-locked transmitter for MWN applications. Structure of oscillator and types of injection are two crucial design criteria for low-power injection-locked oscillator design. Compared to other injection structures, body-level injection offers low-voltage and low-power operation. Again, conventional NMOS/PMOS-only cross-coupled LC oscillator can work with low supply voltage but the power consumption is relatively high. To overcome this problem, a self-cascode LC oscillator structure has been used which provides both low-voltage and low-power operation. Body terminal coupling is used with this structure to achieve injection-locking. Simulation results show that the self-cascode structure consumes much less power compared to that of the conventional structure for the same output swing while exhibiting better phase noise performance. Usage of PMOS devices and body bias control not only reduces the flicker noise and power consumption but also eliminates the requirements of expensive fabrication process for body terminal access

Design and debugging of multi-step analog to digital converters

With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process

High-Linearity Self-Biased CMOS Current Buffer

A highly linear fully self-biased class AB current buffer designed in a standard 0.18 mu m CMOS process with 1.8 V power supply is presented in this paper. It is a simple structure that, with a static power consumption of 48 mu W, features an input resistance as low as 89 Omega, high accuracy in the input-output current ratio and total harmonic distortion (THD) figures lower than -60 dB at 30 mu A amplitude signal and 1 kHz frequency. Robustness was proved through Monte Carlo and corner simulations, and finally validated through experimental measurements, showing that the proposed configuration is a suitable choice for high performance low voltage low power applications

Wearable electroencephalography for long-term monitoring and diagnostic purposes

Truly Wearable EEG (WEEG) can be considered as the future of ambulatory EEG units, which are the current standard for long-term EEG monitoring. Replacing these short lifetime, bulky units with long-lasting, miniature and wearable devices that can be easily worn by patients will result in more EEG data being collected for extended monitoring periods. This thesis presents three new fabricated systems, in the form of Application Specific Integrated Circuits (ASICs), to aid the diagnosis of epilepsy and sleep disorders by detecting specific clinically important EEG events on the sensor node, while discarding background activity. The power consumption of the WEEG monitoring device incorporating these systems can be reduced since the transmitter, which is the dominating element in terms of power consumption, will only become active based on the output of these systems. Candidate interictal activity is identified by the developed analog-based interictal spike selection system-on-chip (SoC), using an approximation of the Continuous Wavelet Transform (CWT), as a bandpass filter, and thresholding. The spike selection SoC is fabricated in a 0.35 μm CMOS process and consumes 950 nW. Experimental results reveal that the SoC is able to identify 87% of interictal spikes correctly while only transmitting 45% of the data. Sections of EEG data containing likely ictal activity are detected by an analog seizure selection SoC using the low complexity line length feature. This SoC is fabricated in a 0.18 μm CMOS technology and consumes 1.14 μW. Based on experimental results, the fabricated SoC is able to correctly detect 83% of seizure episodes while transmitting 52% of the overall EEG data. A single-channel analog-based sleep spindle detection SoC is developed to aid the diagnosis of sleep disorders by detecting sleep spindles, which are characteristic events of sleep. The system identifies spindle events by monitoring abrupt changes in the input EEG. An approximation of the median frequency calculation, incorporated as part of the system, allows for non-spindle activity incorrectly identified by the system as sleep spindles to be discarded. The sleep spindle detection SoC is fabricated in a 0.18 μm CMOS technology, consuming only 515 nW. The SoC achieves a sensitivity and specificity of 71.5% and 98% respectively.Open Acces

A Bulk Driven Transimpedance CMOS Amplifier for SiPM Based Detection

The contribution of this work lies in the development of a bulk driven operationaltransconducctance amplifier which can be integrated with other analog circuits andphotodetectors in the same chip for compactness, miniaturization and reducing thepower. Silicon photomultipliers, also known as SiPMs, when coupled with scintillator materials are used in many imaging applications including nuclear detection. This thesis discuss the design of a bulk-driven transimpedance amplifier suitable for detectors where the front end is a SiPM. The amplifier was design and fabricated in a standard standard CMOS process and is suitable for integration with CMOS based SiPMs and commercially available SiPMs. Specifically, the amplifier was verified in simulations and experiment using circuit models for the SiPM. The bulk-driven amplifier’s performance, was compared to a commerciallyavailable amplifier with approximately the same open loop gain (70dB). Bothamplifiers were verified with two different light sources, a scintillator and a SiPM.The energy resolution using the bulk driven amplifier was 8.6% and was 14.2% forthe commercial amplifier indicating the suitability of the amplifier design for portable systems