Deposition of biaxially aligned YSZ layers by dual unbalanced magnetron sputtering

Biaxially aligned YSZ (Yttria Stabilised Zirconia) layers were deposited by unbalanced magnetron sputtering, in a dual magnetron geometry. The unbalanced magnetrons were mounted in such a way that the angle between the target- and substrate normal was 55° for both magnetrons. The target-substrate distance was 13 cm for both magnetrons. A better homogeneity in deposition rate and biaxial alignment was obtained with respect to depositions with one unbalanced magnetron. The YSZ layers were characterized by XRD θ/2θ and (111) pole figures and showed a [001] out-of-plane orientation and a [110] in-plane orientation. The best biaxially aligned YSZ layers obtained so far, showed a FWHM of 21° in (111) pole figures. The influence of the magnet configuration (closed-field or mirror-field) and sputter conditions on the biaxial alignment was investigated. Gauss and Langmuir probe measurements were performed to investigate the influence of the magnet configuration and sputter conditions on the plasma density and the magnetic field lines

High-rate low-temperature dc pulsed magnetron sputtering of photocatalytic TiO2films: the effect of repetition frequency

The article reports on low-temperature high-rate sputtering of hydrophilic transparent TiO2thin films using dc dual magnetron (DM) sputtering in Ar + O2mixture on unheated glass substrates. The DM was operated in a bipolar asymmetric mode and was equipped with Ti(99.5) targets of 50 mm in diameter. The substrate surface temperature Tsurfmeasured by a thermostrip was less than 180 °C for all experiments. The effect of the repetition frequency frwas investigated in detail. It was found that the increase of frfrom 100 to 350 kHz leads to (a) an improvement of the efficiency of the deposition process that results in a significant increase of the deposition rate aDof sputtered TiO2films and (b) a decrease of peak pulse voltage and sustaining of the magnetron discharge at higher target power densities. It was demonstrated that several hundreds nm thick hydrophilic TiO2films can be sputtered on unheated glass substrates at aD = 80 nm/min, Tsurf < 180 °C when high value of fr = 350 kHz was used. Properties of a thin hydrophilic TiO2film deposited on a polycarbonate substrate are given

On the Physical Vapour Deposition (PVD): evolution of magnetron sputtering processes for industrial applications

Advanced coatings play an important role in a wide range of industrial applications. These coatings are commonly used in machining tools due to their high hardness and wear resistance, but also can be applied in jewellery and decorative purposes. Deposition techniques have seen a strong evolution as result of the directly related devices, control evolution and software. Several variants have been developed around the main techniques: arc evaporation and sputtering. The coatings produced present significant differences in their characteristics, namely in terms of structure, mechanical properties and surface morphology. Depending on the substrate material and application, the deposition process needs to be properly selected, providing the particular characteristics requested. This paper intends to do a critical review of the evolution of the advanced coatings deposition process, mainly focused on the Physical Vapour Deposition (PVD) process, particularly in the Magnetron Sputtering technique, which is able to produce smooth surfaces, using lower temperatures, presenting excellent mechanical and tribological properties and having very good adhesion to the main materials used as substrate.Fundação para a Ciência e a Tecnologia | Ref. UID/EMS/0615/2016LAETA/CETRIB/INEGI Research Center-FLAD – Fundação Luso-Americana para o Desenvolvimento | Ref. 116/201

On the Physical Vapour Deposition (PVD): Evolution of Magnetron Sputtering Processes for Industrial Applications

Advanced coatings play an important role in a wide range of industrial applications. These coatings are commonly used in machining tools due to their high hardness and wear resistance, but also can be applied in jewellery and decorative purposes. Deposition techniques have seen a strong evolution as result of the directly related devices, control evolution and software. Several variants have been developed around the main techniques: arc evaporation and sputtering. The coatings produced present significant differences in their characteristics, namely in terms of structure, mechanical properties and surface morphology. Depending on the substrate material and application, the deposition process needs to be properly selected, providing the particular characteristics requested. This paper intends to do a critical review of the evolution of the advanced coatings deposition process, mainly focused on the Physical Vapour Deposition (PVD) process, particularly in the Magnetron Sputtering technique, which is able to produce smooth surfaces, using lower temperatures, presenting excellent mechanical and tribological properties and having very good adhesion to the main materials used as substrate.info:eu-repo/semantics/publishedVersio

Исследование структуры и свойств Ti-Si-N покрытий, сформированных методом дуального магнетронного распыления на поверхности полимерных мембран для приложений сердечно-сосудистой хирургии

Исследование поверхности полимерных мембран до и после модифицирования в плазме дуальным магнетроном.Investigation of the polymer membranes surface before and after modification in plasma by a dual magnetron