Diamond Dicing

In OLAP, analysts often select an interesting sample of the data. For example, an analyst might focus on products bringing revenues of at least 100 000 dollars, or on shops having sales greater than 400 000 dollars. However, current systems do not allow the application of both of these thresholds simultaneously, selecting products and shops satisfying both thresholds. For such purposes, we introduce the diamond cube operator, filling a gap among existing data warehouse operations. Because of the interaction between dimensions the computation of diamond cubes is challenging. We compare and test various algorithms on large data sets of more than 100 million facts. We find that while it is possible to implement diamonds in SQL, it is inefficient. Indeed, our custom implementation can be a hundred times faster than popular database engines (including a row-store and a column-store).Comment: 29 page

A Study of Integrated Circuit Dicing Tape When Used in a Plasma Dicing Environment

The main objective of this article is to establish which of the many dicing tapes used in the semiconductor industry would be most suitable for use in plasma dicing. Tape design over the past 40 years has continually evolved through advancements in both dicing technologies and the incessant revision of integrated circuit packaging. Die singulation has traditionally been accomplished using a diamond saw, laser-based technology, or a combination of both. The stress on dicing tape was, therefore, limited to fatigue through the physical nature of saw dicing or heat energies induced during laser dicing. These processes do not expose dicing tape to either a high vacuum or a variety of plasma chemistries. This investigative work is a continuation of studies examining the dicing tape behavior when used in plasma dicing. Results show that polyolefin (PO) UV tape with low-to-medium adhesion strength exhibits the greatest resilience under harsh plasma etch conditions and that efficient photoinitiated cross linking (or curing) of the adhesive is triggered if directly exposed to the photonic energies present in a pure SF 6 plasma or full plasma dicing process. However, the postplasma dice, post-UV cure adhesive strength can still be minimized if the tape manufacturers recommended time limitations between which the tape mount, plasma dice, and die pickup process are adhered to

The Fabrication and Integration of a 15 MHz Array Within a Biopsy Needle

It is proposed that integrating ultrasound transducer arrays at the tip of tools such as biopsy needles could enable valuable, real-time image feedback during interventional procedures. High-resolution ultrasound imaging has the potential to aid navigation of interventional tools, and to assist diagnosis or treatment via in-vivo tissue characterisation in the breast, amongst many other applications. In order to produce miniature transducer arrays incorporated within biopsy needle-sized packages (2-5 mm diameter), the challenges in micromachining and handling transducer materials at this scale must be overcome. This paper presents fabrication processes used in the micromachining of a 16 element 15 MHz PIN-PMN-PT piezocrystal-polymer composite array and its integration into an 11 G breast biopsy needle. Particular emphasis is given to the manufacturing of the 1-3 dice-and-fill piezocrystal composite, and establishing electrical interconnects. Characterisation measurements have demonstrated operation of each of the 16 elements within the needle case

Experimental validation of model for pulsed laser-induced subsurface modifications in Si

Wafers are traditionally diced with diamond saw blades. Saw dicing technology has a number of limitations, especially concerning the dicing of thin wafers. Moreover, the use of fluids and the gen-eration of debris can damage fragile components such as micro electro-mechanical systems. Laser ablation dicing is better suited for thin wafers, but is also not a clean process. An alternative dicing method is subsurface laser dicing. This technology is based on the production of laser-induced sub-surface modifications inside the wafer. These modifications weaken the material, such that the wafer separates along the planes with laser modifications when applying an external force. To find the right laser conditions to produce subsurface modifications in silicon, and to enhance the understand-ing of the underlying physics, a numerical model has previously been developed. To validate this model, the current work compares simulation results with experimental data obtained by focusing nano- and picosecond pulses inside silicon wafers. A fairly good agreement between experimental and numerical results was obtaine

Ultra-thin silicon based piezoelectric capacitive tactile sensor

This paper presents an ultra-thin bendable silicon based tactile sensor, in a piezoelectric capacitor configuration, realized by wet anisotropic etching as post-processing steps. The device is fabricated over bulk silicon, which is thinned down to 35 μm from an original thickness of 636 μm. Dicing of thin membrane is achieved by low cost novel technique of Dicing before Etching. The piezoelectric capacitor is composed of polyvinylidene fluoride trifluoroethylene (PVDF-TrFE), which present an attractive avenue for tactile sensing as they respond to dynamic contact events (which is critical for robotic tasks), easy to fabricate at low cost and are inherently flexible. The sensor exhibits enhanced piezoelectric properties, thanks to the optimization of the poling procedure. The sensor capacitive behaviour is confirmed using impedance analysis and the electro-mechanical characterization is done using TIRA shaker setup

Analisa Implementasi Algoritma Stream Cipher Sosemanuk dan Dicing dalam Proses Enkripsi Data

Keamanan merupakan hal yang diutamakan dalam sistem informasi, khususnya dalam pertukaran data yang bersifat penting atau rahasia. Informasi yang akan diberikan kepada pihak yang berhak terhadap informasi tersebut harus benar-benar dijaga tingkat keamanannya, jangan sampai jatuh ke tangan pihak lain yang tidak punya hak akan informasi tersebut.Salah satu cara untuk menjaga keamanan informasi yang dipertukarkan dalan suatu sistem dapat dilakukan dengan menggunakan teknik kriptografi. Kriptografi merupakan seni dan ilmu untuk menyembunyikan informasi dari pihak ketiga. Dalam kriptografi seseorang yang memiliki kunci privat dapat mengubah data asli (plaintext) menjadi data yang bersifat unik dan tidak dapat dibaca (ciphertext) dan dapat mengubah kembali ciphertext yang ada ke dalam bentuk plaintext dengan menggunakan kunci privat yang dimilikinya.Dalam penelitian ini telah berhasil dibuat suatu sistem kriptografi menggunakan algoritma Sosemanuk dan Dicing dan diimplementasikan menggunakan Borland C++ Builder 6.0. Penelitian ini bertujuan untuk menganalisa perbandingan performansi antara algoritma Sosemanuk dan Dicing dalam hal kecepatan proses enkripsi dan dekripsi, memori yang dibutuhkan selama proses, dan nilai avalanche effect.Berdasarkan hasil penelitian dapat disimpulkan bahwa nilai Avalanche Effect (AV) algoritma Sosemanuk lebih besar daripada algoritma Dicing, sehingga algoritma Sosemanuk lebih handal daripada algoritma Dicing. Proses pada algoritma Sosemanuk lebih kompleks daripada algoritma Dicing, sehingga waktu yang diperlukan oleh algoritma Sosemanuk 4,77 % lebih lama dan memori yang diperlukan lebih besar daripada algoritma Dicing. Tipe file tidak berpengaruh terhadap lama waktu enkripsi ataupun dekripsi, karena file dibaca per byte

Lithium niobate micromachining for the fabrication of microfluidic droplet generators

In this paper, we present the first microfluidic junctions for droplet generation directly engraved on lithium niobate crystals by micromachining techniques, preparatory to a fully integrated opto-microfluidics lab-on-chip system. In particular, laser ablation technique and the mechanical micromachining technique are exploited to realise microfluidic channels in T-and cross junction configurations. The quality of both lateral and bottom surfaces of the channels are therefore compared together with a detailed study of their roughness measured by means of atomic force microscopy in order to evaluate the final performance achievable in an optofluidic device. Finally, the microfluidics performances of these water-in-oil droplets generators are investigated depending on these micromachining techniques, with particular focus on a wide range of droplet generation rates