107 research outputs found

    Flip-chip assembly of an integrated optical sensor

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    For enabling low cost mass production for photonic circuits, the application of flipchip technology creates huge expectations. We report on the results of a project, having the goal to demonstrate standard packaging technology in combination with integrated optics, entailing demands and limitations different from IC technology. Mainly fiber attachment, but also special features as sensor window accessibility at the top-side of the chip are prohibiting the positioning of the optical layer stack and solder pads at the same side of the silicon wafer. Therefore, feed through technology had to be included. Compatibility issues in combining feed through technology with integrated optics processing have been solved and the feasibility of feed-through metallization and flip-chip assembly in combination with an integrated optical sensor has been demonstrated

    Photodefinition of channel waveguide in electro-optic polymer

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    Polymers with optically active nonlinear chromophores have been shown to have a promising future in low cost and high speed electro–optic device applications. However, a main question of concern is the photochemical stability of the chromophores for long term application. The chromophore TCVDPA with a benzene bridge between a tricyanovinyl acceptor and an amino donor has been reported to have high photochemical stability combined with high electro-optic activity. In the current work direct waveguide definition of the host polymer SU-8, a negative photoresist, containing this chromophore by masked UV exposure followed by development, has been demonstrated. This was possible by utilizing the chromophore low absorption window in the UV region that allows crosslinking of the host polymer by exposing to UV light followed by thermal curing

    Immunomodulation with self-crosslinked polyelectrolyte multilayer-based coatings

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    This study aims to design an optimal polyelectrolyte multilayer film of poly-L-lysine (PLL) and hyaluronic acid(HA) as an anti-inflammatory cytokine release system in order to decrease the implant failure due to any immune reactions. The chemical modification of the HA with aldehyde moieties allows self-cross-linking of the film and an improvement in the mechanical properties of the film. The cross-linking of the film and the release of immunomodulatory cytokine (IL-4) stimulate the differentiation of primary human monocytes seeded on the films into pro-healing macrophages phenotype. This induces the production of antiinflammatory cytokines (IL1-RA and CCL18) and the decrease of proinflammatory cytokines secreted (IL-12, TNF-α, and IL-1β). Moreover, we demonstrate that cross-linking PLL/HA film using HA-aldehyde is already effective by itself to limit inflammatory processes. Finally, this functionalized self-cross-linked PLL/HA-aldehyde films constitutes an innovative and efficient candidate for immunomodulation of any kind of implants of various architecture and properties
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