Evolution of interfacial structure of the joints between a tungsten-copper composite and austenitic stainless steel

Joining of CuW70 composite and 0Cr18Ni9 stainless steel was successfully achieved at temperatures 1150 °C with durations from 15 to 90 min after adding a pure copper intermediate layer. Microstructure, phase composition and elemental distribution at the interfacial region were studied. The optimum joining interface with a dense microstructure was obtained at a joining temperature of 1150 °C with a duration of 60 min. Interdiffusion of atoms occurred at the interface between the tungsten-copper composite and stainless steel, resulting in formation of various compounds such as W _0.6 Cu _0.4 , Cu _3.8 Ni and Fe _0.946 Ni _0.054 . An iron chromium-rich layer was formed at the interface near the tungsten-copper composite side, and an island structure containing Cr, Cu, and Ni was formed near the stainless steel side