Optical MEMS

Optical microelectromechanical systems (MEMS), microoptoelectromechanical systems (MOEMS), or optical microsystems are devices or systems that interact with light through actuation or sensing at a micro- or millimeter scale. Optical MEMS have had enormous commercial success in projectors, displays, and fiberoptic communications. The best-known example is Texas Instruments’ digital micromirror devices (DMDs). The development of optical MEMS was impeded seriously by the Telecom Bubble in 2000. Fortunately, DMDs grew their market size even in that economy downturn. Meanwhile, in the last one and half decade, the optical MEMS market has been slowly but steadily recovering. During this time, the major technological change was the shift of thin-film polysilicon microstructures to single-crystal–silicon microsructures. Especially in the last few years, cloud data centers are demanding large-port optical cross connects (OXCs) and autonomous driving looks for miniature LiDAR, and virtual reality/augmented reality (VR/AR) demands tiny optical scanners. This is a new wave of opportunities for optical MEMS. Furthermore, several research institutes around the world have been developing MOEMS devices for extreme applications (very fine tailoring of light beam in terms of phase, intensity, or wavelength) and/or extreme environments (vacuum, cryogenic temperatures) for many years. Accordingly, this Special Issue seeks to showcase research papers, short communications, and review articles that focus on (1) novel design, fabrication, control, and modeling of optical MEMS devices based on all kinds of actuation/sensing mechanisms; and (2) new developments of applying optical MEMS devices of any kind in consumer electronics, optical communications, industry, biology, medicine, agriculture, physics, astronomy, space, or defense

Integrated power passives

A multi-layer film-stack and method for forming the multilayer film-stack is given where a series of alternating layers of conducting and dielectric materials are deposited such that the conducting layers can be selectively addressed. The use of the method to form integratable high capacitance density capacitors and complete the formation of an integrated power system-on-a-chip device including transistors, conductors, inductors, and capacitors is also given

Paper Session II-C - High-Resolution Integrated Micro Gyroscope for Space Applications

In this paper, an integrated capacitive gyroscope fabricated by CMOS-MEMS technology is presented. The CMOS-compatibility of the fabrication process enables full integration of the sensor with interface and signal conditioning circuitry on a single chip. The entire microstructure is single-crystal silicon based, resulting in large proof mass and good mechanical behaviors. Thus, high-resolution and high-robustness microgyroscopes can be obtained. With a resolution of about 0.01°/s/Hz112 , the fabricated gyroscope chip is only as small as 1.5mm by 2mm including the sensing elements and integrated electronics. The robustness, light weight and high performance make this type of MEMS gyroscope very suitable for space navigation applications where payload is critical. The on-chip capacitive sensing circuitry employs chopper stabilization technique to minimize the influence of 1/f noise. The on-chip circuits also include a two-stage fully differential amplifier and a DC feedback loop to cancel the DC offset. The CMOS fabrication was performed through MOSIS by using the 4-metal TSMC 0.35 μm CMOS process. The post-CMOS micromachining processing consists of only dry etch steps and uses the interconnect metal layers as etching masks. Single-crystal silicon (SCS) structures are produced by applying a backside etch and forming a 60μm-thick SCS membrane. This work is sponsored by NASA through the UCF/UF Space Research Initiative

MEMS-Based Endoscopic Optical Coherence Tomography

Early cancer detection has been playing an important role in reducing cancer mortality. Optical coherence tomography (OCT), due to its micron-scale resolution, has the ability to detect cancerous tissues at their early stages. For internal organs, endoscopic probes are needed as the penetration depth of OCT is about 1–3 mm. MEMS technology has the advantages of fast speed, small size, and low cost, and it has been widely used as the scanning engine in endoscopic OCT probes. Research results have shown great potential for OCT in endoscopic imaging by incorporating MEMS scanning mirrors. Various MEMS-OCT designs are introduced, and their imaging results are reviewed in the paper

Editorial for the Special Issue on MEMS Mirrors

MEMS mirrors can steer, modulate, and switch light, as well as control the wavefront for focusing or phase modulation.[...

MEMS Mirrors

MEMS mirrors can steer, modulate and switch light, as well as control the wavefront for focusing or phase modulation. MEMS mirrors have found enormous commercial success in projectors, displays and fiberoptic communications. Micro-spectrometers based on MEMS mirrors are starting to appear in the consumer market. There are also many breakthroughs in applying MEMS mirrors for endoscopic imaging. Equally excitingly, a new wave of opportunities for MEMS mirrors is coming up, for example, micro-LiDAR for autonomous driving and robotics, optical cross connect (OXC) for cloud data centers, and optical scanners for virtual reality/augumented reality, just to name a few. Of course, there are a number of big challenges that researchers and engineers must overcome to fully utiltize MEMS mirrors’ potential: modeling and control are inherently complex due to the multiphysics, multi-DOF and nonlinear nature of the microactuators for MEMS mirrors; reliability is always a huge hurdle for commercilization; and the tradeoffs among the speed, aperture, and scan range are often overwhelming. Accordingly, this Special Issue seeks to showcase research papers, short communications, and review articles that focus on: (1) novel designs, fabrication, control, and modeling of MEMS mirrors based on all kinds of actuation mechanisms; and (2) new developments of applying MEMS mirrors of any kind in consumer electronics, optical communications, industry, medicine, agriculture, space, or defense

Editorial for the Special Issue on Optical MEMS

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Microfabrication and Characterization of an Integrated 3-Axis CMOS-MEMS Accelerometer

This paper reports the fabrication and characterization of a monolithically integrated 3-axis CMOS-MEMS accelerometer with a single proof mass. An improved microfabrication process has been developed to solve the structure overheating and particle contamination problems in the plasma etching processes of device fabrication. The whole device is made of bulk silicon except for some short thin films for electrical isolation, allowing large sensing capacitance and flat device structure. A low-noise, low-power amplifier is designed for each axis, which provides 40 dB on-chip amplification and consumes only 1 mW power. Quasi-static and dynamic characterization of the fabricated device has been performed. The measured sensitivities of the lateral- and z-axis accelerometers are 560 mV/g and 320 mV/g, respectively, which can be tuned by simply varying the amplitude of the modulation signal. The over-all noise floors of the lateral- and z-axis are 12 μg/ÖHz and 110 μg/ÖHz, respectively when tested at 200 Hz

A Fast, Large-Stroke Electrothermal MEMS Mirror Based on Cu/W Bimorph

This paper reports a large-range electrothermal bimorph microelectromechanical systems (MEMS) mirror with fast thermal response. The actuator of the MEMS mirror is made of three segments of Cu/W bimorphs for lateral shift cancelation and two segments of multimorph beams for obtaining large vertical displacement from the angular motion of the bimorphs. The W layer is also used as the embedded heater. The silicon underneath the entire actuator is completely removed using a unique backside deep-reactive-ion-etching DRIE release process, leading to improved thermal response speed and front-side mirror surface protection. This MEMS mirror can perform both piston and tip-tilt motion. The mirror generates large pure vertical displacement up to 320 μm at only 3 V with a power consumption of 56 mW for each actuator. The maximum optical scan angle achieved is ±18° at 3 V. The measured thermal response time is 15.4 ms and the mechanical resonances of piston and tip-tilt modes are 550 Hz and 832 Hz, respectively

An Electrothermal Cu/W Bimorph Tip-Tilt-Piston MEMS Mirror with High Reliability

This paper presents the design, fabrication, and characterization of an electrothermal MEMS mirror with large tip, tilt and piston scan. This MEMS mirror is based on electrothermal bimorph actuation with Cu and W thin-film layers forming the bimorphs. The MEMS mirror is fabricated via a combination of surface and bulk micromachining. The piston displacement and tip-tilt optical angle of the mirror plate of the fabricated MEMS mirror are around 114 μm and ±8°, respectively at only 2.35 V. The measured response time is 7.3 ms. The piston and tip-tilt resonant frequencies are measured to be 1.5 kHz and 2.7 kHz, respectively. The MEMS mirror survived 220 billion scanning cycles with little change of its scanning characteristics, indicating that the MEMS mirror is stable and reliable