534 research outputs found

    Wafer-Level Parylene Packaging With Integrated RF Electronics for Wireless Retinal Prostheses

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    This paper presents an embedded chip integration technology that incorporates silicon housings and flexible Parylene-based microelectromechanical systems (MEMS) devices. Accelerated-lifetime soak testing is performed in saline at elevated temperatures to study the packaging performance of Parylene C thin films. Experimental results show that the silicon chip under test is well protected by Parylene, and the lifetime of Parylenecoated metal at body temperature (37°C) is more than 60 years, indicating that Parylene C is an excellent structural and packaging material for biomedical applications. To demonstrate the proposed packaging technology, a flexible MEMS radio-frequency (RF) coil has been integrated with an RF identification (RFID) circuit die. The coil has an inductance of 16 μH with two layers of metal completely encapsulated in Parylene C, which is microfabricated using a Parylene–metal–Parylene thin-film technology. The chip is a commercially available read-only RFID chip with a typical operating frequency of 125 kHz. The functionality of the embedded chip has been tested using an RFID reader module in both air and saline, demonstrating successful power and data transmission through the MEMS coil

    Study of the Effects of Socioeconomic Class on an Image of a Department Store

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    Scattering of a Tightly Focused Beam by an Optically Trapped Particle

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    Near-forward scattering of an optically trapped 5 m radius polystyrene latex sphere by the trapping beam was examined both theoretically and experimentally. Since the trapping beam is tightly focused, the beam fields superpose and interfere with the scattered fields in the forward hemisphere. The observed light intensity consists of a series of concentric bright and dark fringes centered about the forward scattering direction. Both the number of fringes and their contrast depend on the position of the trapping beam focal waist with respect to the sphere. The fringes are caused by diffraction due to the truncation of the tail of the trapping beam as the beam is transmitted through the sphere

    Nanotechnology for Packaging

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