Reactive Spreading of a Lead-Free Solder on Alumina

The wetting of Sn3Ag-based alloys on Al{sub 2}O{sub 3} has been studied using the sessile-drop configuration. Small additions of Ti decrease the contact angle of Sn3Ag alloys on alumina from 115 to 23 degrees. Adsorption of Ti-species at the solid-liquid interface prior to reaction is the driving force for the observed decrease in contact angle, and the spreading kinetics is controlled by the kinetics of Ti dissolution into the molten alloy. The addition of Ti increases the transport rates at the solid-liquid interface, resulting in the formation of triple-line ridges that pin the liquid front and promote a wide variability in the final contact angles

Reactive spreading: adsorption, ridging and compound formation

Reactive spreading, in which a chemically active element is added to promote wetting of noble metals on nonmetallic materials, is evaluated. Theories for the energetics and kinetics of the necessary steps involved in spreading are outlined and compared to the steps in compound formation that typically accompany reactive wetting. These include: fluid flow, active metal adsorption, including nonequilibrium effects, and triple line ridging. All of these can be faster than compound nucleation under certain conditions. Analysis and assessment of recently reported experiments on metal/ceramic systems lead to a focus on those conditions under which spreading proceeds ahead of the actual formation of a new phase at the interface. This scenario may be more typical than believed, and perhaps the most effective situation leading to enhanced spreading. A rationale for the pervasive variability and hysteresis observed during high temperature wetting also emerges

Ceramic/metal joining for structures and materials

The paper presents a discussion of the various types of ceramic joining within a conceptual framework based on the fundamentals of wetting, adhesion, and the thermodynamics of interfacial reactions. Examples are given of solid state diffusion bonding of Pt to alumina and brazing of AlN. Most ceramic-metal bonding is conducted at high temperatures, where chemical reaction is to be expected. The way in which bond strength is affected by chemical reaction at ceramic-metal interfaces is also discussed

Reactive spreading: Adsorption, ridging and compound formation

Reactive spreading, in which a chemically active element is added to promote wetting of noble metals on nonmetallic materials, is evaluated. Theories for the energetics and kinetics of the necessary steps involved in spreading are outlined and compared to the steps in compound formation that typically accompany reactive wetting. These include: fluid flow, active metal adsorption, including nonequilibrium effects, and triple line ridging. All of these can be faster than compound nucleation under certain conditions. Analysis and assessment of recently reported experiments on metal/ceramic systems lead to a focus on those conditions under which spreading proceeds ahead of the actual formation of a new phase at the interface. This scenario may be more typical than believed, and perhaps the most effective situation leading to enhanced spreading. A rationale for the pervasive variability and hysteresis observed during high temperature wetting also emerges