Laser scanner for testing semiconductor chips

Individual ''fingerprint'' signals are produced when system photoexcites chips. ''Fingerprints'' are analyzed for characteristics associated with defects, including many not visible to the naked eye. Electromagnetic radiation photogenerates free electrons and holes in semiconductor chip. These carriers produce electrical signals at terminals. Signals vary depending on what defects are present

Reducing regression test size by exclusion.

Operational software is constantly evolving. Regression testing is used to identify the unintended consequences of evolutionary changes. As most changes affect only a small proportion of the system, the challenge is to ensure that the regression test set is both safe (all relevant tests are used) and unclusive (only relevant tests are used). Previous approaches to reducing test sets struggle to find safe and inclusive tests by looking only at the changed code. We use decomposition program slicing to safely reduce the size of regression test sets by identifying those parts of a system that could not have been affected by a change; this information will then direct the selection of regression tests by eliminating tests that are not relevant to the change. The technique properly accounts for additions and deletions of code. We extend and use Rothermel and Harrold’s framework for measuring the safety of regression test sets and introduce new safety and precision measures that do not require a priori knowledge of the exact number of modification-revealing tests. We then analytically evaluate and compare our techniques for producing reduced regression test sets

Reducing regression test size by exclusion.

Operational software is constantly evolving. Regression testing is used to identify the unintended consequences of evolutionary changes. As most changes affect only a small proportion of the system, the challenge is to ensure that the regression test set is both safe (all relevant tests are used) and unclusive (only relevant tests are used). Previous approaches to reducing test sets struggle to find safe and inclusive tests by looking only at the changed code. We use decomposition program slicing to safely reduce the size of regression test sets by identifying those parts of a system that could not have been affected by a change; this information will then direct the selection of regression tests by eliminating tests that are not relevant to the change. The technique properly accounts for additions and deletions of code. We extend and use Rothermel and Harrold’s framework for measuring the safety of regression test sets and introduce new safety and precision measures that do not require a priori knowledge of the exact number of modification-revealing tests. We then analytically evaluate and compare our techniques for producing reduced regression test sets

Can Thomas Kuhn's paradigms help us understand software engineering

Peer reviewe

The impact of using pair programming on system evolution a simulation-based study

In this paper we investigate the impact of pair--programming on the long term evolution of software systems. We use system dynamics to build simulation models which predict the trend in system growth with and without pair programming. Initial results suggest that the extra effort needed for two people to code together may generate sufficient benefit to justify pair programming.Peer reviewe

NTF: Soldering Technology Development for Cryogenics

The advent of the National Transonic Facility (NTF) brought about a new application for an old joining method, soldering. Soldering for use at cryogenic temperatures requires that solders remain ductile and free from tin-pest (grey tin), have toughness to withstand aerodynamic loads associated with flight research, and maintain their surface finishes. Solders are used to attach 347 Stainless-Steel tubing in surface grooves of models. The solder must fill up the gap and metallurgically bound to the tubing and model. Cryogenic temperatures require that only specific materials for models can be used, including: Vasco Max 200 CVM, lescalloy A-286 Vac Arc, pH 13-8 Mo. Solders identified for testing at this time are: 50% Sn - 49.5% Pb - 0.5% Sb, 95% Sn - 5% Sb, 50% In 50% Pb, and 37.5% Sn - 37.5% Pb - 25% In. With these materials and solders, it is necessary to determine their solderability. After solderability is determined, tube/groove specimens are fabricated and stressed under cryogenic temperatures. Compatible solders are then used for acutual models

Effects of Subsurface Drainage on Pavement Performance

This report evaluates the effects of subsurface drainage features on pavement performance through a program of inspection and testing of the subsurface drainage features present in the Long-Term Pavement Performance (LTPP) SPS-1 and SPS-2 field sections. The report will be of particular interest to engineers in the public and private sectors with responsibility for the design, construction, and rehabilitation of highway pavements