Miniaturized silicon photonics multi-sensor operating at high temperatures for use in composite materials industrial applications

Composite materials offer significant performance advantages due to their lightweight, high-strength, and high stiffness. This led to their adoption in several industrial sectors with particular emphasis on the aerospace industry which has undergone a transformation towards a composite-dominated new standard. In order to respond to the increased demand, it is mandatory to focus on an efficient and well-controlled curing cycle of the resin, which will lead to a significant reduction of cost and an increase in production speed. Currently, manufacturers use filling and curing cycles with high safety margins which can be optimized by applying process monitoring techniques, which up to now use thermocouples and dielectric sensors. However, these electric solutions suffer in terms of operating capabilities and the facilitation of integrating them in composite materials (due to their size and electrically conductive aspect when using carbon fibers). We present the design and evaluation of a miniaturized novel photonic integrated sensor, fabricated in 220 nm top SOI platform, capable of measuring key monitoring values that facilitate optimization of the curing process. The operation principle is the spectral shift of a silicon Bragg grating component's resonant wavelength. Bragg grating design and post-processing of the integrated chip allows for measuring different key values such as temperature, refractive index and pressure all in similar to 1.5 mm diameter. The fabricated temperature sensors achieve a significant 0.084 nm/degrees C thermo-optic efficiency with high accuracy (0.5 degrees C) and repeatability across a very wide dynamic range (temperature 27 to 180 degrees C)

Silicon photonics temperature and refractive index sensor for curing process monitoring in composite material industry

Composite materials offer significant performance advantages due to their lightweight, high-strength, and high stiffness. This led to their adoption in several industrial sectors with particular emphasis on the aerospace industry which has undergone a transformation towards a composite-dominated new standard. In order to respond to the increased demand, it is mandatory to focus on an efficient and well-controlled curing cycle of the resin, which will lead to a significant reduction of cost and an increase in production speed. We investigate, a photonic solution, able of measure key monitoring values that facilitate optimization of the curing process. Simulation and evaluation results on a bragg grating based photonic integrated sensor, developed in 220 nm Silicon-on-Insulator platform, are presented. A multi-sensor deployment is considered, enabling monitoring of the temperature and the refractive index of the resin. Serially coupled bragg grating photonic elements will enable concurrent monitoring of both temperature and refractive index. Several bragg configurations have been investigated and experimentally evaluated, specifically regular and phase-shifted ones. Both TE and TM polarization operation sensors that have been designed and fabricated, will be presented. Their sensitivity on resin temperature and refractive index variation will be discussed, resulting in a comparative study outlining the benefits and disadvantages of each solution. Refractive index sensors are realized by employing post-processing etching techniques on Multi-project-Wafer run fabricated silicon chips, on top of the periodic bragg grating element. The comparative study takes into consideration TE and TM polarization operation, regular and phase-shifted bragg grating configuration elements, while evaluating their sensitivity in temperature and refractive index variations. Temperatures considered are in the range of 27 °C to 200 °C, while refractive index values lay between 1.5 and 1.6. A Figure-of-Merit is proposed to facilitate the selection of multi-sensor deployment for specific temperature and refractive index ranges

Photonic Integrated Circuit Based Temperature Sensor for Out-of-Autoclave Composite Parts Production Monitoring

The use of composite materials has seen widespread adoption in modern aerospace industry. This has been facilitated due to their favourable mechanical characteristics, namely, low weight and high stiffness and strength. For broader implementation of those materials though, the out-of-autoclave production processes have to be optimized, to allow for higher reliability of the parts produced as well as cost reduction and improved production speed. This optimization can be achieved by monitoring and controlling resin filling and curing cycles. Photonic Integrated Circuits (PICs), and, in particular, Silicon Photonics, owing to their fast response, small size, ability to operate at higher temperatures, immunity to electromagnetic interference, and compatibility with CMOS fabrication techniques, can offer sensing solutions fulfilling the requirements for composite material production using carbon fibres. In this paper, we demonstrate a passive optical temperature sensor, based on a 220 nm height Silicon-on-Insulator platform, embedded in a composite tool used for producing RTM-6 composite parts of high quality (for use in the aerospace industry). The design methodology of the photonic circuit as well as the experimental results and comparison with the industry standard thermocouples during a thermal cycling of the tool are presented. The optical sensor exhibits high sensitivity (85 pm/°C), high linearity (R2 = 0.944), and is compatible with the RTM-6 production process, operating up to 180 °C.</jats:p

Laser-fabricated ball lens optical interface for back side coupling to a silicon photonics sensor chip

We propose a simple optical interface for coupling between a single mode fiber and a grating on a Photonic Integrated Circuit (PIC), by coupling from the back side using a ball lens. This way, the top side of the PIC remains accessible for sensing

A fully packaged silicon photonic Bragg grating temperature sensor with a compact back side interface based on a ball lens

With the increased interest in silicon photonics, smart integration and packaging technologies are essential to transform photonic integrated circuits (PICs) into functional photonic systems. Especially for sensing, the currently existing standard packaging technologies are too expensive and bulky. We developed a solution for integrating a 1 mm x 1 mm sensor PIC with a single mode fiber and packaging it in a 1.5 mm inner-diameter metal protective tube. The concept relies on interfacing a grating coupler with a fiber from the back side of the PIC employing a 300 μm ball lens mounted in a laser-fabricated fused silica precision holder. It is shown that the additional insertion loss caused by the ball lens interface is very limited. A packaged sensor was achieved by sequentially mounting the holder on a ceramic ferrule, then the PIC on the holder and finally gluing a metal tube surrounding the assembly, taking care that the PIC surface is flush with the end face of the tube. The back side fiber interface ensures that the PIC’s surface remains accessible for sensing, while the tube protects the fiber-to-PIC interface. We demonstrated this concept by realizing a packaged phase shifted silicon Bragg grating temperature sensor operating around 1550 nm, which could be read out in reflection using a commercial interrogator. A temperature sensitivity of 73 pm/°C was found, and we demonstrated sensor functionality up to 180°C

Demonstration of photonic temperature sensor for RTM-6 composite manufacturing process (180°C) integrated with PMOC system

We demonstrate a sensing platform for composite manufacturing (RTM-6) process based on silicon photonics, being controlled by novel Process Monitoring Optimization Control (PMOC) system. The photonic multi-sensor is based on bragg grating components, allowing measurements of temperature, pressure and refractive index, and is packaged employing a ball lens fiber-to-chip interface. We present results of the packaged temperature photonic sensor regarding bandwidth, linearity and thermo-optic efficiency, being controlled by our PMOC system. We experimentally achieve 0.074 nm/C with R^2 = 0.995 linearity for temperature up to 180°C (RTM-6 compatible) with 1 kHz data acquisition and 0.2°C accuracy

Demonstration of photonic temperature sensor for RTM-6 composite manufacturing process (180°C) integrated with PMOC system

We demonstrate a sensing platform for composite manufacturing (RTM-6) process based on silicon photonics, being controlled by novel Process Monitoring Optimization Control (PMOC) system. The photonic multi-sensor is based on bragg grating components, allowing measurements of temperature, pressure and refractive index, and is packaged employing a ball lens fiber-to-chip interface. We present results of the packaged temperature photonic sensor regarding bandwidth, linearity and thermo-optic efficiency, being controlled by our PMOC system. We experimentally achieve 0.074 nm/C with R^2 = 0.995 linearity for temperature up to 180°C (RTM-6 compatible) with 1 kHz data acquisition and 0.2°Caccuracy.We demonstrate a sensing platform for composite manufacturing (RTM-6) process based on silicon photonics, being controlled by novel Process Monitoring Optimization Control (PMOC) system. The photonic multi-sensor is based on bragg grating components, allowing measurements of temperature, pressure and refractive index, and is packaged employing a ball lens fiber-to-chip interface. We present results of the packaged temperature photonic sensor regarding bandwidth, linearity and thermo-optic efficiency, being controlled by our PMOC system. We experimentally achieve 0.074 nm/C with R^2 = 0.995 linearity for temperature up to 180°C (RTM-6 compatible) with 1 kHz data acquisition and 0.2°Caccuracy.C

NEUROPULS: NEUROmorphic energy-efficient secure accelerators based on Phase change materials aUgmented siLicon photonicS

International audienceThis special session paper introduces the Horizon Europe NEUROPULS project, which targets the development of secure and energy-efficient RISC-V interfaced neuromorphic accelerators using augmented silicon photonics technology. Our approach aims to develop an augmented silicon photonics platform, an FPGA-powered RISC-V-connected computing platform, and a complete simulation platform to demonstrate the neuromorphic accelerator capabilities. In particular, their main advantages and limitations will be addressed concerning the underpinning technology for each platform. Then, we will discuss three targeted use cases for edge-computing applications: Global National Satellite System (GNSS) anti-jamming, autonomous driving, and anomaly detection in edge devices. Finally, we will address the reliability and security aspects of the stand-alone accelerator implementation and the project use case

NEUROPULS: NEUROmorphic energy-efficient secure accelerators based on Phase change materials aUgmented siLicon photonicS

This special session paper introduces the Horizon Europe NEUROPULS project, which targets the development of secure and energy-efficient RISC-V interfaced neuromorphic accelerators using augmented silicon photonics technology. Our approach aims to develop an augmented silicon photonics platform, an FPGA-powered RISC-V-connected computing platform, and a complete simulation platform to demonstrate the neuromorphic accelerator capabilities. In particular, their main advantages and limitations will be addressed concerning the underpinning technology for each platform. Then, we will discuss three targeted use cases for edge-computing applications: Global National Satellite System (GNSS) anti-jamming, autonomous driving, and anomaly detection in edge devices. Finally, we will address the reliability and security aspects of the stand-alone accelerator implementation and the project use cases.Comment: 10 pages, 2 figures, conferenc